An input capacitance measurement circuit includes a transformer, a first capacitor, a second capacitor, and a third capacitor. A primary wire of the transformer has a first end provided so as to be connectable to an anode of the semiconductor device. The primary wire of the transformer has a second end connected to a first end of the first capacitor. A secondary wire of the transformer has a first end provided so as to be connectable to a cathode of the semiconductor device. The secondary wire of the transformer has a second end connected to a first end of the second capacitor. The third capacitor has a first end provided so as to be connectable to the cathode of the semiconductor device. A second end of the first capacitor, a second end of the second capacitor, and a second end of the third capacitor are electrically connected to each other.

An input capacitance measurement circuit includes a transformer, a first capacitor, a second capacitor, and a third capacitor. A primary wire of the transformer has a first end provided so as to be connectable to an anode of the semiconductor device. The primary wire of the transformer has a second end connected to a first end of the first capacitor. A secondary wire of the transformer has a first end provided so as to be connectable to a cathode of the semiconductor device. The secondary wire of the transformer has a second end connected to a first end of the second capacitor. The third capacitor has a first end provided so as to be connectable to the cathode of the semiconductor device. A second end of the first capacitor, a second end of the second capacitor, and a second end of the third capacitor are electrically connected to each other.

An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined. A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected, a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering, in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left and the organic component parts and/or the voids included in the metal layer formed by sintering have 5 to 80 area percent in a vertical cross section of the metal layer formed by sintering.

An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined. A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected, a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering, in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left and the organic component parts and/or the voids included in the metal layer formed by sintering have 5 to 80 area percent in a vertical cross section of the metal layer formed by sintering.

A method for manufacturing an electrical component, comprising: an armature (1) formed by a polymeric plastic material and an organometallic additive and comprising a support arm (4), with a winding (2) formed directly on the surface of the support arm (4) by a conductor track (10) forming turns. According to the invention, in order to obtain a winding with a high density of turns, with a precise arrangement which varies little over time, while making it possible to have a winding design with any desired geometry, the manufacturing method comprises laser engraving of the support arm (4), for engraving an initiator track forming the turns of the winding (2) and where the organometallic additive is locally activated. The method then comprises metallizing the initiator track with a conducting metal so to form the conductor track (10) according to the turns formed by the initiator track.

A method for manufacturing an electrical component, comprising: an armature (1) formed by a polymeric plastic material and an organometallic additive and comprising a support arm (4), with a winding (2) formed directly on the surface of the support arm (4) by a conductor track (10) forming turns. According to the invention, in order to obtain a winding with a high density of turns, with a precise arrangement which varies little over time, while making it possible to have a winding design with any desired geometry, the manufacturing method comprises laser engraving of the support arm (4), for engraving an initiator track forming the turns of the winding (2) and where the organometallic additive is locally activated. The method then comprises metallizing the initiator track with a conducting metal so to form the conductor track (10) according to the turns formed by the initiator track.

A method of detecting a foreign object on a stage according to one aspect of the present disclosure includes acquiring first position information of a first pattern included in a first image in a reference state of a surface of the stage capable of attracting an object to be inspected; acquiring second position information of a second pattern included in a second image of the surface, the second image being obtained after obtaining the first image; and detecting one or more foreign objects on the surface by comparing the first position information and the second position information.

A method of detecting a foreign object on a stage according to one aspect of the present disclosure includes acquiring first position information of a first pattern included in a first image in a reference state of a surface of the stage capable of attracting an object to be inspected; acquiring second position information of a second pattern included in a second image of the surface, the second image being obtained after obtaining the first image; and detecting one or more foreign objects on the surface by comparing the first position information and the second position information.

Examples described herein generally relate to wafer testing and structures implemented on a wafer for wafer testing. In an example method for testing a wafer, power is applied to a first pad in a test site (TS) region on the wafer. The TS region is electrically connected to a device under test (DUT) region on the wafer. The DUT region includes a DUT. The TS region and DUT region are in a first and second scribe line, respectively, on the wafer. A third scribe line is disposed on the wafer between the TS region and the DUT region. A signal is detected from a second pad in the TS region on the wafer. The signal is at least in part a response of the DUT to the power applied to the first pad.

An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising and providing a base substrate; buildup layer level thereof vertical electrical shield and insulation on the top layer test pad to provide EMI protection from probe contact pins and another adjacent conductor.