As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of an electrode pad of a TEG to facilitate the evaluation of electrical characteristics. According to the present invention, the above described problem can be solved by arranging a plurality of probes in a fan shape or manufacturing the probes with micro electro mechanical systems (MEMS) technology.

A cylindrical body is formed of a conductive member provided with a spiral spring portion. Further, the cylindrical body includes a Ni metal layer and a Ni—W alloy layer containing W, and an end portion of the Ni—W alloy layer protrudes to an outer side of the Ni metal layer.

A cylindrical body is formed of a conductive member provided with a spiral spring portion. Further, the cylindrical body includes a Ni metal layer and a Ni—W alloy layer containing W, and an end portion of the Ni—W alloy layer protrudes to an outer side of the Ni metal layer.

A contact probe can be easily mass-produced, reduce manufacturing cost, and obtain a stable contact state with an electrode such as a land of an inspection substrate. An inspection socket can be provided with the contact probe. The contact probe has a first contact terminal that contacts a solder ball of a device under test and a second contact terminal that contacts a land of a printed substrate, and a coil spring for urging contact terminals so as to separate the first and the second terminals. The first contact terminal is constituted by a first contact element formed by a rod-shaped metal member, and the second contact terminal is constituted by two second contact elements formed by a plate-shaped metal member and which clamp the first contact element in frictional contact with a part of the first contact element.

A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed upon a root of the probe pin. The second metallic coating is in contact with the first metallic coating and comprises a softer (more flexible) metal than the first metallic coating.

A testing device of an inverter device includes a power supply device including an AC-DC conversion circuit for converting AC power received from an AC power supply into DC power and a control part for controlling the AC-DC conversion circuit and a filter circuit interposed between a tested inverter device to be tested and the power supply device, having a reactor and a capacitor, and delivering the DC power output from the power supply device to the tested inverter device. The control part is configured to execute output adjustment of the AC-DC conversion circuit when a test start signal is generated to start an instantaneous voltage abnormality test which is a test changing magnitude of power supply voltage of the AC power supply in a predetermined direction being either one of increase or decrease during operation of the tested inverter device and the power supply device.

A testing device of an inverter device includes a power supply device including an AC-DC conversion circuit for converting AC power received from an AC power supply into DC power and a control part for controlling the AC-DC conversion circuit and a filter circuit interposed between a tested inverter device to be tested and the power supply device, having a reactor and a capacitor, and delivering the DC power output from the power supply device to the tested inverter device. The control part is configured to execute output adjustment of the AC-DC conversion circuit when a test start signal is generated to start an instantaneous voltage abnormality test which is a test changing magnitude of power supply voltage of the AC power supply in a predetermined direction being either one of increase or decrease during operation of the tested inverter device and the power supply device.

An embodiment of the present invention provides a method of manufacture thereof controlled alloy amount, height, quality, and optical alignment joining the microelectronic test interface substrate to the printed circuit test load board and real time alloy quality inspection of the test load board system. An embodiment of the system platform comprising: a microelectronic test interface substrate and a printed circuit test load board, such as probe card system and device test load board system.

An embodiment of the present invention provides a method of manufacture thereof controlled alloy amount, height, quality, and optical alignment joining the microelectronic test interface substrate to the printed circuit test load board and real time alloy quality inspection of the test load board system. An embodiment of the system platform comprising: a microelectronic test interface substrate and a printed circuit test load board, such as probe card system and device test load board system.

The disclosure includes a contact device for electrical test, the contact device for electrical test including a second body portion, a first body portion stacked above the second body portion, a middle portion stacked above the first body portion, and having a first protrusion that is sharp and has a first apex portion, the first protrusion being formed on an upper side of the middle portion, and the first body portion, the middle portion, and the contact portion are sequentially and upwardly stacked, the middle portion and the contact portion include materials different from each other, and a first protrusion is provided inside the second protrusion.