A sensor intermediate part is provided with a physical quantity detection element that has a power source terminal, a ground terminal and an output terminal that outputs a desired output signal, where the physical quantity detection element is capable of adjusting properties of the output signal; a high-capacitance capacitor, which has at least a first terminal and a second terminal, and a jumper wire, one end of which is conducted to either the power source terminal or the second terminal and the other end of which is not conducted. The first terminal is conducted to the ground terminal, and the power source terminal and the second terminal are configured to be electrically connectable by the jumper wire.

Provided is a conical nano-carbon material functionalized needle tip, formed by assembling a nano-carbon material with a material of a needle tip by means of a covalent bond; and the material of the needle tip is a metal selected from one or more of tungsten, iron, cobalt, nickel and titanium. Further provided is a method for preparing the conical nano-carbon material functionalized needle tip. The conical nano-material functionalized needle tip has an outstanding interface formed by metal-carbide covalent bonds, and the orientation of the conical nano-material is matched with the axial direction of the metal needle tip (illustrated in FIG. 6). The proposed preparation method affords a robust interface and avoids the potential pollution to the nano-material caused during the deposition of fixing materials, such as carbon or platinum or the like, in other preparation methods.

Provided is a conical nano-carbon material functionalized needle tip, formed by assembling a nano-carbon material with a material of a needle tip by means of a covalent bond; and the material of the needle tip is a metal selected from one or more of tungsten, iron, cobalt, nickel and titanium. Further provided is a method for preparing the conical nano-carbon material functionalized needle tip. The conical nano-material functionalized needle tip has an outstanding interface formed by metal-carbide covalent bonds, and the orientation of the conical nano-material is matched with the axial direction of the metal needle tip (illustrated in FIG. 6). The proposed preparation method affords a robust interface and avoids the potential pollution to the nano-material caused during the deposition of fixing materials, such as carbon or platinum or the like, in other preparation methods.

A system, method and apparatus for measuring carrier lifetime of a device comprises subjecting a test device to a voltage via a voltage source associated with the test system, disconnecting the test device from the voltage source, measuring the voltage as a function of time, measuring the current as a function of time, and determining a carrier lifetime of the test piece according to the slope of the measured voltage and the measured current.

A method of detecting abnormal test signal channel of automatic test equipment firstly obtains a raw test data and then divides into the data groups according to a mapping data. The test data of DUTs in one data group are generated by the same group of probes. A yield of each data group is further estimated. A yield of a wafer is further estimated when the yield of the data group matches a first failure threshold. An abnormal test signal channel is determined when the yield of the wafer does not match a second failure threshold or the yield of the wafer matches the normal threshold. Therefore, to add the detecting method in an original test procedure of the ATE, the operator easily identifies which blocks in the failure color on the test data map are caused by the abnormal test signal channel.

A method of detecting abnormal test signal channel of automatic test equipment firstly obtains a raw test data and then divides into the data groups according to a mapping data. The test data of DUTs in one data group are generated by the same group of probes. A yield of each data group is further estimated. A yield of a wafer is further estimated when the yield of the data group matches a first failure threshold. An abnormal test signal channel is determined when the yield of the wafer does not match a second failure threshold or the yield of the wafer matches the normal threshold. Therefore, to add the detecting method in an original test procedure of the ATE, the operator easily identifies which blocks in the failure color on the test data map are caused by the abnormal test signal channel.

A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base (16) with apertures (30) for insertion of test pin insert blocks (28). The blocks are inserted topin or bottomin and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins (32) from the housing.

A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base (16) with apertures (30) for insertion of test pin insert blocks (28). The blocks are inserted topin or bottomin and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins (32) from the housing.

An on-wafer calibration device comprises on a substrate at least a first measuring port, at least a first switch element, at least two calibration standards, and a controller unit or a control interface for control of the first switch element. The first switch element is controlled in a manner that it selectively connects a wafer probe tip connectable to the first measuring port to the at least two calibration standards.

An on-wafer calibration device comprises on a substrate at least a first measuring port, at least a first switch element, at least two calibration standards, and a controller unit or a control interface for control of the first switch element. The first switch element is controlled in a manner that it selectively connects a wafer probe tip connectable to the first measuring port to the at least two calibration standards.