Disclosed is a test device for testing a high-frequency and high-speed semiconductor. The test device includes a probe supporting block formed with a tube accommodating portion along a test direction; a conductive shield tube accommodated in the tube accommodating portion; and a probe accommodated and supported in the shield tube without contact, the tube accommodating portion including a conductive contact portion for transmitting a ground signal to the shield tube. When a high-frequency and high-speed semiconductor or the like subject is tested, the test device easily and inexpensively prevents crosstalk between the adjacent signal probes and improves impedance characteristic.

A relay pogo contact first charged device model test head apparatus for relay-based contact first field induced charged device model testing has a ground plane of conductive material, a coaxial connector whose outer conductor electrically connects to the ground plane, a current-sensing element with one terminal electrically connects to the ground plane and the other terminal electrically connects to the center conductor of the coaxial connector, a switch where the first terminal electrically connects to a center conductor of the coaxial connector, and a probe with one end electrically connected to a second terminal of the switch and the other end exposed to contact external objects.

A magnetoresistive sensor is provided. The magnetoresistive sensor comprises a substrate having a layer structure thereon. The layer structure comprises a lower layer, and an upper layer. The lower layer is provided on the substrate, wherein the lower layer comprises one or more graphene layers which extend across the lower layer. The upper layer is provided on the lower layer and formed of a dielectric material. The lower and upper layers of the layer structure share one or more continuous edge surfaces. The magnetoresistive sensor further comprises a first electrical contact provided adjacent to the layer structure such that the first electrical contact is in direct contact with the one or more graphene layers via one of the one or more continuous edge surfaces, a second electrical contact provided adjacent to the layer structure such that the second electrical contact is in direct contact with the one or more graphene layers via one of the one or more continuous edge surfaces, and a continuous air-resistant coating layer covering the layer structure.

A magnetoresistive sensor is provided. The magnetoresistive sensor comprises a substrate having a layer structure thereon. The layer structure comprises a lower layer, and an upper layer. The lower layer is provided on the substrate, wherein the lower layer comprises one or more graphene layers which extend across the lower layer. The upper layer is provided on the lower layer and formed of a dielectric material. The lower and upper layers of the layer structure share one or more continuous edge surfaces. The magnetoresistive sensor further comprises a first electrical contact provided adjacent to the layer structure such that the first electrical contact is in direct contact with the one or more graphene layers via one of the one or more continuous edge surfaces, a second electrical contact provided adjacent to the layer structure such that the second electrical contact is in direct contact with the one or more graphene layers via one of the one or more continuous edge surfaces, and a continuous air-resistant coating layer covering the layer structure.

A metal probe structure and a method for fabricating the same are provided. The metal probe structure includes a multi-layer substrate, a first flexible dielectric layer, a second flexible dielectric layer, and a plurality of first metal components. The first flexible dielectric layer is disposed over the multi-layer substrate and has a conductive layer formed thereover. The second flexible dielectric layer is disposed over the first flexible dielectric layer to cover the conductive layer. The plurality of first metal components is disposed over the conductive layer and partially in the second flexible dielectric layer to serve as a metal probe.

A method of making an array of vapor cells for an array of magnetometers includes providing a plurality of separate vapor cell elements, each vapor cell element including at least one vapor cell; arranging the vapor cell elements in an alignment jig to produce a selected arrangement of the vapor cells; attaching at least one alignment-maintaining film onto the vapor cell elements in the alignment jig; transferring the vapor cells elements and the at least one alignment-maintaining film from the alignment jig to a mold; injecting a bonding material into the mold and between the vapor cell elements to bond the vapor cell elements in the selected arrangement; removing the at least one alignment maintaining film from the vapor cell elements; and removing the bonded vapor cells elements in the selected arrangement from the mold to provide the array of vapor.

A method of making an array of vapor cells for an array of magnetometers includes providing a plurality of separate vapor cell elements, each vapor cell element including at least one vapor cell; arranging the vapor cell elements in an alignment jig to produce a selected arrangement of the vapor cells; attaching at least one alignment-maintaining film onto the vapor cell elements in the alignment jig; transferring the vapor cells elements and the at least one alignment-maintaining film from the alignment jig to a mold; injecting a bonding material into the mold and between the vapor cell elements to bond the vapor cell elements in the selected arrangement; removing the at least one alignment maintaining film from the vapor cell elements; and removing the bonded vapor cells elements in the selected arrangement from the mold to provide the array of vapor.

Embodiments of the invention are directed to apparatuses and methods for cleaning and disinfecting probes. A cleaner is utilized to remove foreign materials (e.g., bioburden, soil, and other like material) from the probe after it is removed from the patient by soaking and/or flushing the foreign materials from the probe. The cleaner may be an enzymatic detergent that has bacteriostatic properties to inhibit bacterial growth within the apparatus. The multiple enzymes in the cleaner attack the foreign material, and include low-foam properties for effective recirculation across cycles within the cleaning step. The probe is rinsed after the cleaning step, and after rinsing a disinfectant process is applied to the probe. The disinfectant soaks and/or flushes the probe for a specified amount of time across cycles of recirculation to disinfect the surface of the probe, and afterwards the probe is rinsed thoroughly to remove the disinfectant from the probe.

Embodiments of the invention are directed to apparatuses and methods for cleaning and disinfecting probes. A cleaner is utilized to remove foreign materials (e.g., bioburden, soil, and other like material) from the probe after it is removed from the patient by soaking and/or flushing the foreign materials from the probe. The cleaner may be an enzymatic detergent that has bacteriostatic properties to inhibit bacterial growth within the apparatus. The multiple enzymes in the cleaner attack the foreign material, and include low-foam properties for effective recirculation across cycles within the cleaning step. The probe is rinsed after the cleaning step, and after rinsing a disinfectant process is applied to the probe. The disinfectant soaks and/or flushes the probe for a specified amount of time across cycles of recirculation to disinfect the surface of the probe, and afterwards the probe is rinsed thoroughly to remove the disinfectant from the probe.

A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.