A measurement probe for on-wafer testing of semiconductor devices, comprises a plurality of contact fingers at a distal end for contacting landing pads of the wafer. The measurement probe comprises a central conductive wire, the central conductive wire being connected to a first contact finger of the measurement probe, a tapered glass layer over a longitudinal portion of the central conductive wire, and a conductive outer layer coating the glass layer, the conductive outer layer being connected to at least a second contact finger of the measurement probe. For manufacturing such a measurement probe, a glass capillary is heated and drawn over the central conductive wire. A prove holder may comprise such a measurement probe.

A flexible probe for microLED defect detection includes: a flexible base and a flexible circuit film layer. The flexible base includes a flexible substrate and flexible protrusions located on the flexible substrate. A circuit for illuminating a microLED to be detected is provided inside the flexible circuit film layer. The flexible circuit film layer is attached to a surface on a side of the flexible base on which the flexible protrusions are provided, at least a portion of the circuit of the flexible circuit film layer is located on the flexible protrusions, and when the flexible probe for MicroLED defect detection is placed on the MicroLED, the circuit on the flexible protrusions abuts against pins of the MicroLED to be detected and is electrically connected to the pins.

A flexible probe for microLED defect detection includes: a flexible base and a flexible circuit film layer. The flexible base includes a flexible substrate and flexible protrusions located on the flexible substrate. A circuit for illuminating a microLED to be detected is provided inside the flexible circuit film layer. The flexible circuit film layer is attached to a surface on a side of the flexible base on which the flexible protrusions are provided, at least a portion of the circuit of the flexible circuit film layer is located on the flexible protrusions, and when the flexible probe for MicroLED defect detection is placed on the MicroLED, the circuit on the flexible protrusions abuts against pins of the MicroLED to be detected and is electrically connected to the pins.

Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two springs separated by a movable stop while in other embodiments, three or more springs may be included with two or more movable stops. Movable stops interact with fixed stops that are either part of the probes themselves or part of separate elements that engage with the probes (such as array frame structures) that provide for the retention, longitudinal and/or lateral positioning of probes and possibly for orientation of the probes about a longitudinal axis. Fixed stops provide for controlled limits for movement of the movable stops which in turn allow for enhanced compliant or elastic performance of the probes upon increased probe compression in either one direction, in the order of tip compressions, or in both directions or tip compression orders (e.g. to provide one or more decreases in spring constant upon reaching one or more compression levels (or biasing force levels) with a given tip compression direction and/or order).

Disclosed is a test socket. The test socket includes a base frame shaped like a plate having a plurality of probe holes and conductive probes accommodated in the plurality of probe holes, having terminal portions protruding from both sides of the base frame, and comprising elastic material having higher elastic deformation than the base frame and conductive particles distributed in the elastic material.

Disclosed is a test socket. The test socket includes a base frame shaped like a plate having a plurality of probe holes and conductive probes accommodated in the plurality of probe holes, having terminal portions protruding from both sides of the base frame, and comprising elastic material having higher elastic deformation than the base frame and conductive particles distributed in the elastic material.

A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.

A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.

A conduction inspection jig includes a first member having first openings and a flexural strength of 300 MPa or higher, a second member having second openings and positioned above the first member, a support member positioned between the first member and the second member such that the support member is forming a space between the first member and the second member, and a probe that is positioned in one of the first openings in the first member and one of the second openings in the second member such that the probe penetrates through the one of the first openings, the space formed between the first member and the second member, and the one of the second openings and has a first end portion protruding from the first member and a second end portion protruding from the second member on the opposite side with respect to the first end portion.

A strip-shaped sandwich composite material for producing probe needles, wherein an inner core layer is arranged between two outer cover layers, wherein the inner core layer consists of a palladium alloy comprising at least 30 wt. % palladium or of a platinum alloy comprising at least 30 wt. % platinum, and wherein the two outer cover layers consist of a precipitation-hardened and/or dispersion-hardened copper alloy comprising at least 90 wt. % copper and/or silver alloy comprising at least 70 wt. % silver. The invention also relates to a probe needle, a bonding strip, a probe needle array and a method for producing a composite material.