A frame for a contact unit includes: a resin frame made of resin and a metal frame made of metal. The metal frame has a bottom plate on which the resin plate is disposed, an inner peripheral plate and an outer peripheral plate. Each of the resin frame and the bottom plate has a front side, a rear side, a left side and a right side at front, rear, left and right positions to surround a housing portion of the contact unit. The inner peripheral plate and an outer peripheral plate stand in a first direction from an inner peripheral edge and an outer peripheral edge of the bottom plate respectively to cover at least partially an inner part and an outer part of the resin frame on the bottom plate.

A semiconductor manufacturing method includes forming a first redistribution structure with a fine redistribution circuitry over a first temporary carrier; forming testing tips on a first surface of the fine redistribution circuitry; transferring the testing tips and the first redistribution structure to a second temporary carrier provided with a temporary adhesive layer, where the testing tips are embedded in the temporary adhesive layer with the second temporary carrier disposed on the temporary adhesive layer; releasing the first temporary carrier to expose a second surface of the fine redistribution circuitry; coupling a second redistribution structure with a coarse redistribution circuitry to the first redistribution structure through conductive joints, where the conductive joints are formed on the second surface of the fine redistribution circuitry; and releasing the second temporary carrier and the temporary adhesive layer from the testing tips and the first redistribution structure after coupling the second redistribution structure.

A semiconductor manufacturing method includes forming a first redistribution structure with a fine redistribution circuitry over a first temporary carrier; forming testing tips on a first surface of the fine redistribution circuitry; transferring the testing tips and the first redistribution structure to a second temporary carrier provided with a temporary adhesive layer, where the testing tips are embedded in the temporary adhesive layer with the second temporary carrier disposed on the temporary adhesive layer; releasing the first temporary carrier to expose a second surface of the fine redistribution circuitry; coupling a second redistribution structure with a coarse redistribution circuitry to the first redistribution structure through conductive joints, where the conductive joints are formed on the second surface of the fine redistribution circuitry; and releasing the second temporary carrier and the temporary adhesive layer from the testing tips and the first redistribution structure after coupling the second redistribution structure.

The present disclosure provides a differential measurement probe comprising a first support plate, a second support plate arranged in parallel to the first support plate, a first printed circuit probe tip that comprises a first contact section for contacting a device under test, and a second printed circuit probe tip that comprises a second contact section for contacting a device under test, wherein the first printed circuit probe tip and the second printed circuit probe tip are arranged between the first support plate and the second support plate and are mechanically supported by the first support plate and the second support plate.

An interface element arranged to put a plurality of terminations of a device to be tested in contact with corresponding channels of a testing head, including at least one elastomeric matrix and a plurality of conductors embedded in the elastomeric matrix; the interface element having an upper face and a lower face which are substantially parallel and spaced apart by a thickness measured along a vertical direction; the conductors are separated from each other and pass through the whole thickness of the interface element from the upper face to the lower face, the conductors have at least one portion which is not parallel to the vertical direction.

An interface element arranged to put a plurality of terminations of a device to be tested in contact with corresponding channels of a testing head, including at least one elastomeric matrix and a plurality of conductors embedded in the elastomeric matrix; the interface element having an upper face and a lower face which are substantially parallel and spaced apart by a thickness measured along a vertical direction; the conductors are separated from each other and pass through the whole thickness of the interface element from the upper face to the lower face, the conductors have at least one portion which is not parallel to the vertical direction.

The present invention provides an electrically conductive contact pin formed by stacking a plurality of metal layers, and a manufacturing method therefor, the electrically conductive contact pin being pressed by pressing force concentrated at a tip part with a relatively small cross-sectional area, so that unintentional deformation is prevented.

The present invention provides an electrically conductive contact pin formed by stacking a plurality of metal layers, and a manufacturing method therefor, the electrically conductive contact pin being pressed by pressing force concentrated at a tip part with a relatively small cross-sectional area, so that unintentional deformation is prevented.

Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).