A gas sensor assembling method includes a step for placing an element dummy such that it has a longitudinal direction in a vertical direction, wherein the cross-sectional shape of the dummy is similar to the cross-sectional shape of a sensor element, a step for fitting a through hole in an annularly-mounted member to the dummy from above vertically, wherein the through hole included in the annularly-mounted member corresponds to the cross-sectional shape of the sensor element, a step for fitting a tubular member to an outer periphery of the annularly-mounted member from above vertically, an step for placing the sensor element in contact with an upper end portion of the dummy on a single straight line, and an step for descending the dummy downwardly vertically for descending the sensor element and fitting the through hole in the annularly-mounted member to the sensor element.

The present disclosure provides an improved Rogowski-type current sensor. The current measurement coil, and the compensation coil are provided on the same board. The measurement coil and the compensation coil are arranged such that they at least partially overlap by virtue of each repeatedly changing side of the board. This arrangement makes the current sensor far better at rejecting interference than certain other PCB Rogowski type coil arrangements.

The present disclosure provides an improved Rogowski-type current sensor. The current measurement coil, and the compensation coil are provided on the same board. The measurement coil and the compensation coil are arranged such that they at least partially overlap by virtue of each repeatedly changing side of the board. This arrangement makes the current sensor far better at rejecting interference than certain other PCB Rogowski type coil arrangements.

The present invention provides a probe card. A module cap, on the probe card substrate, is designed to have a chute and the probe module can be installed on or uninstalled from the module cap via the chute. That simplifies the operations of assembling and disassembling the probe card and avoids positioning error.

An electrostatic encoder (40) detects the rotation angle of a rotor (42) with great accuracy based on the change in the capacitance between electrodes arranged on a stator (41) and the rotor (42). Detection electrodes (44a to 44d) and transmission electrodes (45a to 45d) are arranged circumferentially and alternately on the stator (41). Detection signals (phase A, phase B) amplitude-modulated based on the rotation of the rotor (42) and having a mutual phase difference of 90 degrees are output from adjacent ones of the detection electrodes. Modulated signals (V1, V2) are generated by demodulating the detection signals having a mutual phase difference of 90 degrees. Applying resolver-digital (RD) conversion processing to the modulated signals allows obtaining the rotation angle of the rotor.

A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.

A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.