A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring. A method includes disposing a first plunger within a spring along a spring longitudinal axis, disposing a second probe within the spring along the spring longitudinal axis, and engaging the spring latch and the second plunger spring latch with the spring, for instance by capturing an end coil of the spring with the spring latch of at least one of the spring latch or the second plunger spring latch.

A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring. A method includes disposing a first plunger within a spring along a spring longitudinal axis, disposing a second probe within the spring along the spring longitudinal axis, and engaging the spring latch and the second plunger spring latch with the spring, for instance by capturing an end coil of the spring with the spring latch of at least one of the spring latch or the second plunger spring latch.

The present disclosure provides a jig for manufacturing probe card for semiconductor inspection, a probe alignment system comprising same, and a probe card manufactured thereby.

The present disclosure provides a jig for manufacturing probe card for semiconductor inspection, a probe alignment system comprising same, and a probe card manufactured thereby.

A contact terminal includes a tubular body and a first conductor. The tubular body has an end-side cutout provided in a shape cut out from one axial-direction end surface toward an other axial-direction side at one axial-direction end portion of the tubular body, a hole that is open at the one axial-direction end portion, and a pair of arms interposed between the end-side cutout and the hole. The first conductor includes a first insertion including an inclined portion having an outside diameter gradually increased toward one axial-direction side, and a first straight portion connected to the one axial-direction side of the inclined portion and having an outside diameter constant along the axial direction. The outside diameter of the first straight portion is larger than an inside diameter of the tubular body. The first straight portion is configured to be in contact with the pair of arms.

A probe card (10) includes a flexible substrate (114) and a rigid substrate (120). The flexible substrate (114) contacts an inspection object. The rigid substrate (120) is electrically connected to the flexible substrate (114). The flexible substrate (114) is located on a side of the rigid substrate (120) where the inspection object is located in a direction perpendicular to the rigid substrate (120).

Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.

Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.

Space transformers, planarization layers for space transformers, methods of fabricating space transformers, and methods of planarizing space transformers are disclosed herein. In one embodiment, the space transformers include a space transformer assembly including a first rigid space transformer layer, a second rigid space transformer layer, and an attachment layer that extends between the first rigid space transformer layer and the second rigid space transformer layer. In another embodiment, the space transformers include a space transformer body and a flex cable assembly. The planarization layer includes an interposer, a resilient dielectric layer, a planarized rigid dielectric layer, a plurality of holes, and an electrically conductive paste extending within the plurality of holes. In one embodiment, the methods include methods of fabricating the space transformer assembly. In another embodiment, the methods include methods of planarizing a space transformer.

An inductive-capacitive (LC) wireless sensor for the detection of toxic heavy metal ions includes inductors and interdigitated electrodes (IDE) in planar form. The sensor may be fabricated by screen printing silver (Ag) ink onto a flexible polyethylene-terephthalate (PET) substrate to form a metallization layer. Palladium nanoparticles (Pd NP) may be drop casted onto the IDEs to form a sensing layer. The resonant frequency of the LC sensor may be remotely monitored by measuring the reflection coefficient (S.sub.11) of a detection coil (planar inductor). The resonant frequency of the LC sensor changes with varying concentrations of heavy metals such as mercury (Hg.sup.2+) and lead (Pb.sup.2+) ions. Changes in the resonant frequency may be used to detect the presence and/or concentration of heavy metal ions.