A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

A cleaning material for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, has a cleaning pad layer, one or more intermediate layers having a set of predetermined characteristics and having a plurality of abrasive particles.

A wired rubber contact including a lower film, an upper film, a plurality of conductive wires, a rubber layer, and a film guide. The lower film includes a plurality of lower electrode parts formed in openings. A periphery of the upper film is disposed within an interface between the central area and the peripheral area. The conductive wires are disposed between the lower film and the upper film, and connect between the lower electrode parts and the upper electrode parts. The rubber layer includes elastic material. A periphery of the rubber layer is protruded toward an outer side from the periphery of the upper film. The rubber layer maintains a constant distance between the lower film and the upper film. The film guide is disposed in the peripheral area of the lower film along a side surface of the rubber layer and integrally formed with the lower film.

A wired rubber contact including a lower film, an upper film, a plurality of conductive wires, a rubber layer, and a film guide. The lower film includes a plurality of lower electrode parts formed in openings. A periphery of the upper film is disposed within an interface between the central area and the peripheral area. The conductive wires are disposed between the lower film and the upper film, and connect between the lower electrode parts and the upper electrode parts. The rubber layer includes elastic material. A periphery of the rubber layer is protruded toward an outer side from the periphery of the upper film. The rubber layer maintains a constant distance between the lower film and the upper film. The film guide is disposed in the peripheral area of the lower film along a side surface of the rubber layer and integrally formed with the lower film.

A backplane test system is provided that uses a pressed or deposited resistive film and infra-red (IR) imaging to visualize and quantify the current drive of pixels. In one form, the system is used for measuring organic light-emitting-diode (OLED) backplanes or other current-actuated-display (CAD) backplanes.

The present disclosure provides a testing apparatus, a holding assembly and a probe card carrier. In some embodiments of the present disclosure, the testing apparatus includes a basic circuit board having a first surface and a second surface; a holding assembly disposed on the first surface; a signal transfer assembly disposed on the second surface and electrically connected to the basic circuit board; and a probe card carrier configured to carry a probe card. In some embodiments of the present disclosure, when the probe card carrier is assembled to the holding assembly, the probe card is electrically connected to the signal transfer assembly.

The present disclosure provides a testing apparatus, a holding assembly and a probe card carrier. In some embodiments of the present disclosure, the testing apparatus includes a basic circuit board having a first surface and a second surface; a holding assembly disposed on the first surface; a signal transfer assembly disposed on the second surface and electrically connected to the basic circuit board; and a probe card carrier configured to carry a probe card. In some embodiments of the present disclosure, when the probe card carrier is assembled to the holding assembly, the probe card is electrically connected to the signal transfer assembly.

An inspection apparatus, including an extendable structure, an inspection probe, a drive, a sensor, and a processor. The extendable structure includes an end fixed to the inspection probe and insertable into a gap defined between a first surface and a second surface. The extendable structure is configured to maintain physical contact with the first surface as the end transitions across the first surface. The drive is configured to position the inspection probe. The current sensor is coupled to the drive and configured to measure a drive load over a period of time the inspection probe transitions across the first surface. The processor is coupled to the sensor and is configured to receive a signal associated with the drive load corresponding to movement of the inspection probe, and determine an operating condition of the extendable structure based on the drive load signal.

An inspection apparatus, including an extendable structure, an inspection probe, a drive, a sensor, and a processor. The extendable structure includes an end fixed to the inspection probe and insertable into a gap defined between a first surface and a second surface. The extendable structure is configured to maintain physical contact with the first surface as the end transitions across the first surface. The drive is configured to position the inspection probe. The current sensor is coupled to the drive and configured to measure a drive load over a period of time the inspection probe transitions across the first surface. The processor is coupled to the sensor and is configured to receive a signal associated with the drive load corresponding to movement of the inspection probe, and determine an operating condition of the extendable structure based on the drive load signal.

An electrode includes a conductor, an insulator, and a housing. The insulator is positioned at least partially around the conductor. The housing is positioned at least partially around the conductor. An upper surface of the insulator may be at least partially concave, an outer surface of the housing may have a groove formed therein, or both.