High-efficiency, ultra-low power gas sensors are provided. In one aspect, a gas detector device is provided which includes: at least one gas sensor having a plurality of fins; a conformal resistive heating element on the fins; a conformal barrier layer on the resistive heating element; and a conformal sensing layer on the barrier layer. A method of forming a gas sensor as well as a method for use thereof in gas detection are also provided.

High-efficiency, ultra-low power gas sensors are provided. In one aspect, a gas detector device is provided which includes: at least one gas sensor having a plurality of fins; a conformal resistive heating element on the fins; a conformal barrier layer on the resistive heating element; and a conformal sensing layer on the barrier layer. A method of forming a gas sensor as well as a method for use thereof in gas detection are also provided.

A method for producing a force-measuring element (10) having at least one articulation point (20) which separates one region of the force-measuring element (10) into two connected subregions (11, 12) which can be deflected in relation to one another. The method includes: providing a force-measuring element blank (10), removing material from the force-measuring element blank (10) in order to produce the articulation point (20), checking whether the deflection behavior of the subregions (11, 12) which is produced by the articulation point corresponds to a predefined specification, defining a correction form (30) which can be produced through material removal and compensates for an ascertained deviation from the predefined specification, correcting the articulation point geometry using a laser and the previously defined correction form (30), through material removal at the articulation point.

A method for producing a force-measuring element (10) having at least one articulation point (20) which separates one region of the force-measuring element (10) into two connected subregions (11, 12) which can be deflected in relation to one another. The method includes: providing a force-measuring element blank (10), removing material from the force-measuring element blank (10) in order to produce the articulation point (20), checking whether the deflection behavior of the subregions (11, 12) which is produced by the articulation point corresponds to a predefined specification, defining a correction form (30) which can be produced through material removal and compensates for an ascertained deviation from the predefined specification, correcting the articulation point geometry using a laser and the previously defined correction form (30), through material removal at the articulation point.

Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.

Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.

An electrical contact that employs a common compressible layer for all contacts, wherein the compressible layer is fashioned with ducts that contain bridges within them. The bridges are formed of the compressible layer. This bridge serves as a compressible member for a first and second member in electrical contact with each other, and that interact with each other such that a compression force acted on the first and second members will cause them to maintain electrical contact while compressing the bridge. When the compressive force is released, the bridge, acting like a spring, expands thus pushing the first and second members apart, but still in electrical contact with each other.

An electrical contact that employs a common compressible layer for all contacts, wherein the compressible layer is fashioned with ducts that contain bridges within them. The bridges are formed of the compressible layer. This bridge serves as a compressible member for a first and second member in electrical contact with each other, and that interact with each other such that a compression force acted on the first and second members will cause them to maintain electrical contact while compressing the bridge. When the compressive force is released, the bridge, acting like a spring, expands thus pushing the first and second members apart, but still in electrical contact with each other.

An MRIS gradient coil sub-assembly comprising a first coil layer comprising a first conducting coil portion, a second coil layer comprising a second conductive coil portion electrically connected with the first conductive coil portion so that the first and second conductive coil portions act together as one coil, and a B-stage material consolidation layer sandwiched between the first and second coil layers.

In one embodiment, a sensor circuit may include a first receiver circuit that may be configured to receive a first signal that is representative of a first mutual inductance and form a first detection signal that is representative of the first mutual inductance, wherein the first variable mutual inductance varies in response to a position of a metal object. An embodiment may include a second receiver circuit configured to receive a second signal that is representative of a second mutual inductance and form a second detection signal that is representative of the second mutual inductance, wherein the second mutual inductance varies in response to the position of the metal object. In an embodiment, the sensor circuit may include a recognition circuit configured to assert a movement detected signal responsively to a first value of the first detection signal, configured to assert a movement direction signal responsively to a first value of the second detection signal.