A system for lithography patterning includes a first supply pipe for supplying a first solution; a second supply pipe for supplying a second solution; a third supply pipe coupled to the first and second supply pipes for receiving the first and second solutions respectively and mixing the first and second solutions into a mixture; a substrate stage for holding a substrate; a supply nozzle coupled to the third supply pipe for dispensing the mixture to the substrate; a first control unit coupled to the first supply pipe and configured to control a flow rate of the first solution going to the third supply pipe; and a second control unit coupled to the second supply pipe and configured to control a flow rate of the second solution going to the third supply pipe.

A substrate treating apparatus includes a plurality of conveying rollers arranged in a first direction which is a horizontal direction, and configured to transfer a substrate in the first direction, the substrate being disposed on a plane formed by the first direction and a second direction perpendicular to the first direction, a developer providing nozzle configured to provide a developer onto the substrate to form a developer layer on the substrate, a sensor part for recognizing a position of the substrate, and a vertical moving part configured to move each of the conveying rollers along a third direction which is downward and perpendicular to the first and second directions.

Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate; a thin film formation step of forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern; a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.

A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate; a thin film formation step of forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern; a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.

The shape of a camera body of a digital camera including a printer viewed from the front surface is a square shape, and an imaging optical system is positioned at the center of a camera body. An axis crossing an optical axis of the imaging optical system in a vertical direction is referred to as a vertical axis, and an axis crossing the optical axis in a horizontal direction is referred to as a horizontal axis. A grip portion is formed on the camera body at positions that are symmetric with respect to the vertical axis and symmetric with respect to the horizontal axis. The grip portion has an annular shape and a concave shape that is concave from the surface around the grip portion. The imaging optical system is positioned at the center of the annular grip portion in a case where the digital camera including a printer is viewed from the front surface of the camera body.

An apparatus and a method for performing liquid treatment with respect to a substrate are provided. The apparatus includes a substrate supporting unit that supports and rotates the substrate, and a liquid supplying unit that supplies a liquid onto the substrate supported by the substrate supporting unit. The liquid supplying unit includes a nozzle unit that supplies a first treatment liquid and a second treatment liquid, and a moving unit that moves the nozzle unit. The nozzle unit has a first slit discharge port for discharging the first treatment liquid in a liquid curtain manner, a second slit discharge port for discharging the second treatment liquid in the liquid curtain manner, and a wetting liquid discharge port for discharging a pre-wetting liquid. The treatment liquids are selectively supplied depending on films formed on the substrate, thereby easily coping with the substrate having various types of films.

A conveyor, a developing system and a developing method are provided. The conveyor includes a conveying unit configured to convey a substrate and having a plurality of conveying portions. The plurality of conveying portions includes a first tilt conveying portion and a second tilt conveying portion. One of a conveying surface of the first tilt conveying portion and a conveying surface of the second tilt conveying portion is a rising surface configured to raise the substrate gradually, and the other one of the conveying surfaces is a falling surface configured to bring down the substrate gradually.

A coating and developing apparatus 2 includes a first protection processing unit U01, a film forming unit U02, a first cleaning processing unit U03 and a control unit U08. The control unit U08 is configured to control the first protection processing unit U01 to form a first protective film on a peripheral portion Wc of a wafer W, control the film forming unit U02 to form a resist film on a front surface Wa of the wafer W, control the first cleaning processing unit U03 to supply a first cleaning liquid for removing the resist film to the peripheral portion Wc, control the first cleaning processing unit U03 to supply a second cleaning liquid for removing a metal component to the peripheral portion Wc, and control the first cleaning processing unit U03 to supply a third cleaning liquid for removing the first protective film PF1 to the peripheral portion Wc.

A developing method includes: horizontally holding a substrate; disposing an opposing surface of a developer nozzle that faces a portion of a surface of the substrate, above one of central and peripheral portions of the surface; discharging a developer to form a liquid collection portion of the developer; spreading the liquid collection portion by moving the developer nozzle toward the other of the central and peripheral portions with the opposing surface brought into contact with the liquid collection portion; lifting the developer nozzle relative to the surface while stopping the discharge of the developer, and pulling up a portion of the liquid collection portion; stopping the lifting, and forming a pillar of the developer having a tapered upper end which is brought into contact with the opposing surface; and applying a shearing force to the pillar to shear the tapered upper end and separating the pillar from the opposing surface.