A memory system and storage device are provided, including: an auxiliary power device having at least one capacitor, wherein the at least one capacitor has a first path for leakage current; a charging circuit including a switch connected to the auxiliary power device; and a state determining circuit connected to the auxiliary power device, wherein the state determining circuit includes a path circuit connected in parallel with the at least one capacitor to form a second path having at least one of a resistance lower than a resistance of the first path or a current source.

An electronic apparatus includes a storage device having a plurality of memory blocks including a first memory block; and a controller configured to control the storage device to perform a read operation for the first memory block in response to a read request of a host. The controller controls the storage device to perform a refresh operation for the first memory block based on whether there is a difference value between a current pass read voltage and a previous pass read voltage which were applied to the first memory block when performing the read operation, and whether there is a difference between a current erase/write count and a previous erase/write count for the first memory block.

The present technology relates to a semiconductor apparatus, a production method, and an electronic apparatus that enable semiconductor apparatuses to be laminated and the laminated semiconductor apparatuses to be identified. A semiconductor apparatus that is laminated and integrated with a plurality of semiconductor apparatuses, includes a first penetrating electrode for connecting with the other semiconductor apparatuses and a second penetrating electrode that connects the first penetrating electrode and an internal device, the second penetrating electrode being arranged at a position that differs for each of the laminated semiconductor apparatuses. The second penetrating electrode indicates a lamination position at a time of lamination. An address of each of the laminated semiconductor apparatuses in a lamination direction is identified by writing using external signals after lamination. The present technology is applicable to a memory chip and an FPGA chip.

The present technology relates to a semiconductor apparatus, a production method, and an electronic apparatus that enable semiconductor apparatuses to be laminated and the laminated semiconductor apparatuses to be identified. A semiconductor apparatus that is laminated and integrated with a plurality of semiconductor apparatuses, includes a first penetrating electrode for connecting with the other semiconductor apparatuses and a second penetrating electrode that connects the first penetrating electrode and an internal device, the second penetrating electrode being arranged at a position that differs for each of the laminated semiconductor apparatuses. The second penetrating electrode indicates a lamination position at a time of lamination. An address of each of the laminated semiconductor apparatuses in a lamination direction is identified by writing using external signals after lamination. The present technology is applicable to a memory chip and an FPGA chip.

An integrated circuit (IC) die comprises a sensor, which includes a pulse generator and a pulse expander. The pulse generator comprises gate circuits coupled to each other in an in-series arrangement. An input of the pulse generator is coupled to receive a voltage and the pulse generator is to generate a first signal based on the voltage. The pulse generator is to generate a first pulse of the first signal based on an event wherein radiation from a laser is incident upon the pulse generator. The pulse expander is coupled to receive the first signal from the pulse generator and to generate a second signal based on the first signal, wherein a second pulse of the second signal is based on the first pulse. A first duration of the first pulse is less than a second duration of the second pulse.

The subject technology performs the following in a storage system including memory dies, where each memory die includes its own temperature sensor. The subject technology determines a temperature of each of the memory dies based on a temperature reading from each memory die's temperature sensor. The subject technology determines whether data is hot data or cold data, where hot data is more likely to be changed after it is written than cold data. In response to determining that the data is hot data, the subject technology stores the data in a memory die with a relatively higher temperature than another one of the memory dies. Further, in response to determining that the data is cold data, the subject technology stores the data in a memory die with a relatively cooler temperature than another one of the memory dies.

Methods of operating a memory system comprising a plurality of memory devices include loading respective sets of termination information to a subset of memory devices of the plurality of memory devices, and, for each memory device of the subset of memory devices, storing its respective set of termination information to an array of non-volatile memory cells of that memory device. For each memory device of the subset of memory devices, its respective set of termination information comprises address information of the memory system and one or more termination values associated with that address information.

Methods of operating a memory system comprising a plurality of memory devices include loading respective sets of termination information to a subset of memory devices of the plurality of memory devices, and, for each memory device of the subset of memory devices, storing its respective set of termination information to an array of non-volatile memory cells of that memory device. For each memory device of the subset of memory devices, its respective set of termination information comprises address information of the memory system and one or more termination values associated with that address information.

A voltage regulator and a method for generating a retention voltage for a RAM cell that is sufficiently high to prevent data loss, while minimizing leakage currents are presented. The A voltage regulator is used for generating at least one voltage. The regulator contains mirror circuitry, a leakage device coupled to the mirror circuitry, and a first resistive device coupled to the mirror circuitry via a first output node. The mirror circuitry mirrors a leakage current from the leakage device to the first resistive device, and the leakage current contributes to the generation of a first reference voltage at the first output node.

A system that includes a non-volatile memory subsystem having non-volatile memory. The system also includes a plurality of memory modules that are separate from the non-volatile memory subsystem. Each memory module can include a plurality of random access memory packages where each first random access memory package includes a primary data port and a backup data port. Each memory module can include a storage interface circuit coupled to the backup data ports of the random access memory packages. The storage interface circuit offloads data from the memory module in the event of a power loss by receiving data from the backup data ports of the random access memory packages and transmitting the data to the non-volatile memory subsystem.