G11C16/00

Semiconductor memory device

A semiconductor memory device includes a first memory cell, a second memory cell above the first memory cell, a first word line electrically connected to a gate of the first memory cell, a second word line electrically connected to a gate of the second memory cell, and a control unit that performs an erasing operation on the first and second memory cells. During the erasing operation, the control unit applies a first voltage to a first word line and a second voltage higher than the first voltage to a second word line.

MEMORY DEVICE COMPRISING ELECTRICALLY FLOATING BODY TRANSISTOR
20210288051 · 2021-09-16 ·

A semiconductor memory cell comprising an electrically floating body. A method of operating the memory cell is provided.

MEMORY DEVICE COMPRISING ELECTRICALLY FLOATING BODY TRANSISTOR
20210288051 · 2021-09-16 ·

A semiconductor memory cell comprising an electrically floating body. A method of operating the memory cell is provided.

Charge loss failure mitigation
11133071 · 2021-09-28 · ·

Memories including a controller configured to cause the memory to read a plurality of memory cells using a read voltage having a particular voltage level, determine a number of memory cells of a first subset of memory cells of the plurality of memory cells having a particular data state in response to the read voltage having the particular voltage level, and in response to determining that the number of memory cells of the first subset of memory cells having the particular data state is less than a particular threshold, adjust the voltage level of the read voltage based on the number of memory cells of the first subset of memory cells having the particular data state, and re-read the plurality of memory cells using the read voltage having the adjusted voltage level.

Verify before program resume for memory devices
11068388 · 2021-07-20 · ·

A method of programming data into a memory device including an array of memory cells is disclosed. The method comprises receiving at least one program command that addresses a number of the memory cells for a programming operation to program data in the memory cells. The at least one program command is executed by iteratively carrying out at least one program/verify cycle to incrementally program the addressed memory cells with the program data. A secondary command may be selectively received after initiating but before completing the programming operation. The programming operation may be selectively resumed by first verifying the memory cells, then carrying out at least one program/verify cycle.

Memory system

According to one embodiment, a memory system includes a first memory, an interface circuit, and a processor. The interface circuit is configured to receive a first request from an external device. The processor is configured to select a mode among a plurality of modes in response to the first request, and perform, on data read from the first memory, error correction of the selected mode.

Memory system

According to one embodiment, a memory system includes a first memory, an interface circuit, and a processor. The interface circuit is configured to receive a first request from an external device. The processor is configured to select a mode among a plurality of modes in response to the first request, and perform, on data read from the first memory, error correction of the selected mode.

Predictive clock control

A predictive clock controller is provided for modifying the frequency of a clock signal provided to a processing unit based on knowledge of the power usage by the application running on the processing unit during different execution periods. The predictive clock controller counts barrier syncs for the application, so as to determine where the application is in its sync schedule. The predictive clock controller is able to determine from the number of counted syncs, when the application will transition from one execution period to another execution period with different power requirements, and to adjust the clock frequency accordingly.

Non-volatile memory (NVM) cell structure to increase reliability

Various embodiments of the present disclosure are directed towards an integrated chip including a first well region and a second well region disposed within a substrate. A gate electrode overlies the first well region and the second well region. A first memory active region is disposed within the second well region. A second memory active region is disposed within the second well region and is laterally offset from the first memory active region by a non-zero distance.

Erasable programmable non-volatile memory

An erasable programmable non-volatile memory includes a memory array and a sensing circuit. The memory array includes a general memory cell and a reference memory cell, which are connected with a word line. The sensing circuit includes a current comparator. The read current in the program state of the general memory cell is higher than the read current in the program state of the reference memory cell. The erase efficiency of the general memory cell is higher than the erase efficiency of the reference memory cell. When a read action is performed, the general memory cell generates a read current to the current comparator, and the reference memory cell generates a reference current to the current comparator. According to the reference current and the read current, the current comparator generates an output data signal to indicate a storage state of the general memory cell.