Disclosed herein is an apparatus that includes a plurality of column planes each including a plurality of bit lines, an access control circuit configured to select one of the plurality of bit lines in each of the plurality of column planes based on a column address to read a plurality of data-bits, a data generating circuit configured to generate an expected-bit based at least in part on the data-bits, and an analyzing circuit configured to generate a fail-bit data indicating which one of the data-bits does not match the expected-bit when one of the data-bits does not match the expected-bit.

A memory includes: first to N.sup.th register circuits each suitable for receiving and storing a failure address transferred from a memory controller when a corresponding selection signal of first to N.sup.th selection signals is activated, where N is an integer equal to or greater than 2; first to N.sup.th resource latch circuits suitable for storing first to N.sup.th resource signals indicating availability of the first to N.sup.th register circuits, respectively; and a priority selection circuit suitable for activating, when two or more of the first to N.sup.th resource signals are activated, one of selection signals respectively corresponding to the activated resource signals among the first to N.sup.th selection signals.

A three-dimensional stacked integrated circuit (3D SIC) that can have at least a first 3D XPoint (3DXP) die and, in some examples, can have at least a second 3DXP die too. In such examples, the first 3DXP die and the second 3DXP die can be stacked. The 3D SIC can be partitioned into a plurality of columns that are perpendicular to each of the stacked dies. In such examples, when a first column of the plurality of columns is determined as failing, data stored in the first column can be replicated to a second column of the plurality of columns. Also, for example, when a part of a first column of the plurality of columns is determined as failing, data stored in the part of the first column can be replicated to a corresponding part of a second column of the plurality of columns.

Embodiments of the disclosure are drawn to apparatuses and methods for bad row mode. The memory may prevent proper access operations (e.g., read operations) from being performed on a selected bad row of the memory as part of a bad row mode. For example, the memory may store a bad row address and when an access address matches the bad row address, may suppress one or more signals, change data read from the address, or combinations thereof. The bad row mode may be used to provide a positive control for post package repair (PPR) operations on the memory. A controller may enter the memory into bad row mode and then test the memory to determine if the selected bad row can be located and repaired via PPR.

A method for determining a repaired line and a repairing line in a memory includes the following: writing first preset data sets into respective lines in a normal region, and writing second preset data sets into respective lines in a redundancy region; repairing the lines in the normal region by using the lines in the redundancy region; reading data from the lines in the normal region after repairing; and determining a repaired line in the normal region and a repairing line in the redundancy region according to the data of the lines in the normal region, the data of the lines in the normal region after repairing, or the data of the lines in the redundancy region.

A computer platform is disclosed. The computer platform comprises a non-volatile memory to store fuse override data; and a system on chip (SOC), coupled to the non-volatile memory, including a fuse memory to store fuse data and security micro-controller to receive the fuse override data and perform a fuse override to overwrite the fuse data stored in the fuse memory with the fuse override data.

A scan network configured to transport repair information between memories and a controller for a non-volatile storage device comprises: repair registers coupled in parallel to repair information generation circuitry for one of the memories and segment selection devices that divide the repair registers into repair register segments. Each of the segment selection devices comprises: a storage element configured to store a segment selection bit and segment selection bit generation circuitry configured to generate the segment selection bit based on the repair information. Each of the segment selection devices is configurable to include or not include the corresponding repair register segment in a scan path of the scan network in a shift operation based on the segment selection bit.

Methods of operating a memory device are disclosed. A method may include enabling a first and second row section units a number of row section units of a memory device in response to a row address. The method may also include comparing a selected column address to a number of column addresses of defective memory cells of a first row section of the first row section unit. Moreover, in response to the selected column address matching a first column address of the number of column addresses, the method may include activating a second row section of the second row section unit, conveying a redundant column select signal to the memory array to select a redundant memory cell of the second row section. Memory devices and systems are also disclosed.

Methods, systems, and devices for full multi-plane operation enablement are described. A flash controller can determine that a first plane of a set of planes of a memory die is an invalid plane. The flash controller can issue a single descriptor associated with a multi-plane operation for the set of planes of the memory die. The single descriptor can include a plurality of commands for the multi-plane operation in which the first command of the plurality of commands can be a duplicate of a second command of the plurality of commands based on the first plane being the invalid plane. In some cases, a negative-and (NAND) controller can receive the single descriptor associated with the multi-plane operation for the set of planes of a memory die. The NAND controller can issue a plurality of commands for the multi-plane operation based on receiving the single descriptor.

Techniques for repair of a memory die are disclosed. In the illustrative embodiment, a faulty wordline (or bitline) can be remapped to a redundant wordline on the same layer by entering the address of the faulty wordline in a repair table for the layer. If there are more faulty wordlines on a layer than redundant wordlines available on the layer, the faulty wordlines can be remapped to redundant wordlines on a different layer, and the address of the faulty wordline can be placed in a repair table for the different layer. When a memory operation is received, the wordline address for the memory operation is checked against the repair tables to check if it remapped.