G21K5/00

Layout design system, system and method for fabricating mask pattern using the same

According to example embodiments of inventive concepts, a layout design system includes a processor, a storage unit configured to store a layout design, and a stitch module. The layout design includes a first pattern group and a second pattern group disposed in accordance with a design. The first pattern group including a first pattern for patterning at a first time. The second pattern group including a second pattern for patterning at a second time that is different than the first time. The stitch module is configured to detect an iso-pattern of the second pattern using the processor. The stitch module is configured to repetitively designate at least one of the first pattern, which is spaced apart from the iso-pattern by a pitch or more, to the second pattern group using the processor.

Layout design system, system and method for fabricating mask pattern using the same

According to example embodiments of inventive concepts, a layout design system includes a processor, a storage unit configured to store a layout design, and a stitch module. The layout design includes a first pattern group and a second pattern group disposed in accordance with a design. The first pattern group including a first pattern for patterning at a first time. The second pattern group including a second pattern for patterning at a second time that is different than the first time. The stitch module is configured to detect an iso-pattern of the second pattern using the processor. The stitch module is configured to repetitively designate at least one of the first pattern, which is spaced apart from the iso-pattern by a pitch or more, to the second pattern group using the processor.

Light illuminating apparatus
10213518 · 2019-02-26 · ·

Provided is a light illuminating apparatus irradiates a target object relatively moveable along a first direction with light. The apparatus includes a light source having a plurality of solid-state devices which irradiates the target object with the light in a second direction perpendicular to the first direction; a first reflecting part having at least one first reflecting surface placed at a downstream side in the second direction below the target object when viewed from the first direction, wherein the first reflecting part reflects a portion of the light from the light source incident on the first reflecting surface onto the target object; and a second reflecting part having a pair of second reflecting surfaces standing erect from the light source toward the first reflecting surface, wherein the second reflecting part guides the light from the light source into the first reflecting surface.

Light illuminating apparatus
10213518 · 2019-02-26 · ·

Provided is a light illuminating apparatus irradiates a target object relatively moveable along a first direction with light. The apparatus includes a light source having a plurality of solid-state devices which irradiates the target object with the light in a second direction perpendicular to the first direction; a first reflecting part having at least one first reflecting surface placed at a downstream side in the second direction below the target object when viewed from the first direction, wherein the first reflecting part reflects a portion of the light from the light source incident on the first reflecting surface onto the target object; and a second reflecting part having a pair of second reflecting surfaces standing erect from the light source toward the first reflecting surface, wherein the second reflecting part guides the light from the light source into the first reflecting surface.

CHARGED PARTICLE BEAM TREATMENT APPARATUS
20190027339 · 2019-01-24 ·

A charged particle beam treatment apparatus includes an accelerator that emits a charged particle beam by accelerating a charged particle, an irradiation unit that irradiates an irradiation target body with the charged particle beam, a beam transport line that connects the accelerator and the irradiation unit to each other, and that transports the charged particle beam from the accelerator to the irradiation unit, and a control unit that controls the irradiation unit in irradiating the irradiation target body with the charged particle beam. The irradiation unit includes a scanning unit that scans each layer with the charged particle beam. After one layer is scanned with the charged particle beam by using a first current value, the control unit controls the irradiation unit so as to scan and irradiate the one layer with the charged particle beam by using a second current value which is different from the first current value.

MARKING PAPER PRODUCTS
20180336375 · 2018-11-22 ·

Methods of marking paper products and marked paper products are provided. Some methods include irradiating the paper product to alter the functionalization of the paper.

Processing fluid supply device, substrate processing device, processing fluid supply method, substrate processing method, processing fluid processing device, and processing fluid processing method

A processing liquid supplying apparatus is arranged to discharge a processing liquid from a discharge port to supply the processing liquid to a processing object, and the processing liquid supplying apparatus includes a first piping, through the interior of which the processing liquid can flow, the interior of the first piping being in communication with the discharge port, and an X-ray irradiating means irradiating X-rays onto the processing liquid present inside the first piping. The first piping has an opening in its pipe wall and the opening is closed by a window member formed using a material that can transmit the X-rays, and the X-ray irradiating means irradiates the X-rays onto the processing liquid present inside the first piping via the window member.

Device and a method for treating a pathology-affected site in a subject

A device for treating a pathology-affected site in a subject is disclosed. A first generator is configured for generating a first flux of ionized gas molecules, a second generator is operable simultaneously with the first generator and configured for generating a second flux of electromagnetic radiation. To ensure correct treatment, monitoring, documentation and enhanced analysis of the treatment, the device has computerized control means configured to be operable simultaneously with the first and second generators and configured to determine a net electrical charge of the subject while the first generator generates the first flux of ionized gas molecules and while the second generator generates the second flux of electromagnetic radiation. Also a client server computer network including the device is disclosed.

Device and a method for treating a pathology-affected site in a subject

A device for treating a pathology-affected site in a subject is disclosed. A first generator is configured for generating a first flux of ionized gas molecules, a second generator is operable simultaneously with the first generator and configured for generating a second flux of electromagnetic radiation. To ensure correct treatment, monitoring, documentation and enhanced analysis of the treatment, the device has computerized control means configured to be operable simultaneously with the first and second generators and configured to determine a net electrical charge of the subject while the first generator generates the first flux of ionized gas molecules and while the second generator generates the second flux of electromagnetic radiation. Also a client server computer network including the device is disclosed.

Method and System for Overlay Control
20180329313 · 2018-11-15 ·

A method for overlay monitoring and control is introduced in the present disclosure. The method includes selecting a group of patterned wafers from a lot using a wafer selection model; selecting a group of fields for each of the selected group of patterned wafers using a field selection model; selecting at least one point in each of the selected group of fields using a point selection model; measuring overlay errors of the selected at least one point on a selected wafer; forming an overlay correction map using the measured overlay errors on the selected wafer; and generating a combined overlay correction map using the overlay correction map of each selected wafer in the lot.