H01B1/00

Conductive adhesive tape and manufacturing method thereof

Provided is a conductive adhesive tape comprising: a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material by a spinning method; and a conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate. Accordingly, thickness of the adhesive tape can be made thin, adhesive strength of the adhesive tape can be enhanced, and the adhesive tape can be precisely attached on even a curved surface. Further, when removing the adhesive tape from components, the adhesive layer can be prevented from remaining on the surface of the components.

Conductive adhesive tape and manufacturing method thereof

Provided is a conductive adhesive tape comprising: a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material by a spinning method; and a conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate. Accordingly, thickness of the adhesive tape can be made thin, adhesive strength of the adhesive tape can be enhanced, and the adhesive tape can be precisely attached on even a curved surface. Further, when removing the adhesive tape from components, the adhesive layer can be prevented from remaining on the surface of the components.

Adaptive tuning networks with direct mapped multiple channel filter tuning

A flexible multi-path RF adaptive tuning network switch architecture that counteracts impedance mismatch conditions arising from various combinations of coupled RF band filters, particularly in a Carrier Aggregation-based (CA) radio system. In one version, a digitally-controlled tunable matching network is coupled to a multi-path RF switch in order to provide adaptive impedance matching for various combinations of RF band filters. Optionally, some or all RF band filters include an associated digitally-controlled filter pre-match network to further improve impedance matching. In a second version, some or all RF band filters coupled to a multi-path RF switch include a digitally-controlled phase matching network to provide necessary per-band impedance matching. Optionally, a digitally-controlled tunable matching network may be included on the common port of the multi-path RF switch to provide additional impedance matching capability. In a third version, CA direct mapped adaptive tuning networks include filter tuning blocks for selected lower frequency bands.

Nonlinear resistive coating material, bus, and stator coil

A nonlinear resistive coating material 20 in an embodiment includes: a matrix resin 22 made of an epoxy resin which is cured by adding a curing agent thereto; ZnO-containing particles 21 dispersedly contained in the matrix resin 22 and made of a sintered compact containing ZnO as a main component; and semiconductive surface-treated whiskers 10 dispersedly contained in the matrix resin 22 and made of ZnO subjected to titanate coupling surface modification treatment.

METHOD FOR FORMING METAL PATTERN, AND ELECTRIC CONDUCTOR

The present invention provides a method for forming a metal pattern on a pattern formation section set in a part or the whole of a region on a base material, the base material including a fluorine-containing resin layer on a surface including at least the pattern formation section, the method including the step of: forming a functional group on a pattern formation section of the fluorine-containing resin layer by a treatment such as ultraviolet-ray irradiation, then applying to the surface of the base material a metal fine particle dispersion liquid in which metal fine particles protected by an amine compound as a first protective agent and a fatty acid as a second protective agent are dispersed in a solvent, and fixing the metal fine particles on the pattern formation section.

Cable conductor

A cable conductor includes a conductor portion and an insulating material covering the conductor portion. The conductor portion includes a plurality of conductive materials having different characteristics.

Electrically conductive adhesive film and dicing-die bonding film using the same

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

Electrically conductive adhesive film and dicing-die bonding film using the same

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

Conductive coating material and production method for shielded package using conductive coating material

A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).

Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrode

A bio-electrode composition includes (A) an ionic material and (B) a silicon material powder. The component (A) is a polymer compound containing a repeating unit-a having a structure selected from an ammonium salt, a sodium salt, a potassium salt, and a silver salt of any of fluorosulfonic acid, fluorosulfonimide, and N-carbonyl-fluorosulfonamide. Thus, the present invention provides a bio-electrode composition capable of forming a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, is light-weight, can be manufactured at low cost, and can control significant reduction in the electric conductivity even when the bio-electrode is wetted with water or dried; a bio-electrode including a living body contact layer formed of the bio-electrode composition; and a method for manufacturing the bio-electrode.