The coil substrate may include a substrate; a first conductor layer including a plurality of first and second segments periodically disposed on a top and a bottom of the substrate; a second conductor layer including a plurality of first and second segments periodically overlapping the first conductor layer on the top and the bottom of the substrate; a first connection line that connects the first and second segments of the first conductor layer; and a second connection line that connects the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.

A coil component includes a body having one surface and another surface opposing each other in one direction, an internal insulating layer embedded in the body, and a coil portion disposed on the internal insulating layer and forming at least one turn. First and second external electrodes are disposed on the one surface of the body to be spaced apart from each other, and first and second connection electrodes respectively penetrate through the body to connect the coil portion and the first and second external electrodes to each other. A support electrode extends from the coil portion to be exposed to the other surface of the body to support the coil portion and the internal insulating layer.

Embodiments described herein may be related to apparatuses, processes, and techniques related to inductors located within a substrate. An inductor may be created in a glass core using a laser-assisted etching of glass interconnects techniques to create trenches or vias within the glass substrate, into which conductive material may be plated or filled to create the inductor. In embodiments, the inductors may be low equivalent series resistance (ESR) compact air-core inductors. Other embodiments may be described and/or claimed.

Disclosed herein are a transformer and a method of manufacturing the same. The transformer includes: a primary side winding having a loop shape; a secondary side winding formed on the same plane as that of the primary side winding in a remaining section except for at least a section at which it intersects with the primary side winding and having the same loop shape as that of the primary side winding so as to be electromagnetically coupled to the primary side winding; and an intersecting section formed so that the primary side and secondary side windings having the sum of the turn numbers of 3 or more intersect with each other in a two-layer structure, wherein the intersecting section includes at least one point of intermediate node having one side connected in a first layer and the other side connected in a second layer.

One object is to suppress thermal shrinkage of a cover resin layer at the time of thermal curing. A laminated coil according to one embodiment of the present invention is provided with a magnetic substrate formed of a sintered magnetic material, an insulation resin layer formed on the magnetic substrate, a cover resin layer formed on the insulation resin layer, and a coil conductor embedded in the insulation resin layer. In one embodiment of the present invention, said insulation resin layer includes a first resin and first filler particles, and said cover resin layer includes a second resin and second filler particles. A filling factor of the second filler particles in the cover resin layer is higher than a filling factor of the first filler particles in the insulation resin layer.

An inductor device includes a first inductor unit and a second inductor unit. The first inductor unit includes a first side to a fourth side, a first wire, and a first input terminal. The first wire is winded to form a plurality of circles. The first wire is winded in an interlaced manner at one of the first to fourth sides of the first inductor unit. The first input terminal is disposed on one of the first to fourth sides. The second inductor unit includes a fifth side to an eighth side, a second wire, and a second input terminal. The second wire is winded to form a plurality of circles. The second wire is winded in an interlaced manner at one of the fifth to eighth sides of the second inductor unit. The second input terminal is disposed on one of the fifth to eighth sides.

Disclosed herein is a coil component that includes first and second substrates, a first coil pattern formed on one surface of the first substrate, a second coil pattern formed on one surface of the second substrate, a first terminal electrode connected to one end of the first coil pattern and protruding from the first substrate, and a second terminal electrode connected to one end of the second coil pattern and protruding from the second substrate. The first and second substrates are laminated such that the first and second terminal electrodes overlap each other and are connected to each other.

A coil module comprises a carrier which has a polygonal basic shape with four to twelve corners and comprises a magnetic material. A coil is arranged on the carrier. The polygonal basic shape is rotationally symmetrical with an angle of 360°.Math.2 divided by the number of corners. To produce a coil assembly, a plurality of coil modules can be connected to each other. This makes it possible to produce an efficient coil assembly for wireless electromagnetic energy transmission in a simple and flexible manner.

Provided are a coil capable of further improvement in heat dissipation performance and a method for manufacturing the same. A coil includes a helical structure formed of a hollow flat conductor.

Provided are a coil capable of further improvement in heat dissipation performance and a method for manufacturing the same. A coil includes a helical structure formed of a hollow flat conductor.