H01F17/00

Coil component and method for fabricating the same
11551850 · 2023-01-10 · ·

A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

Inductor

An inductor includes a coil that is provided in a component body. A first end of the coil is connected to a first outer electrode, and a second end of the coil is connected to a second outer electrode. The coil includes a plurality of coil conductor layers that are provided in a width direction. Each coil conductor layer is substantially spirally formed with the number of turns being greater than or equal to about one turn. The height of the component body is greater than the width of the component body.

Multilayer coil component
11551845 · 2023-01-10 · ·

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers and including a coil built therein, and first and second outer electrodes electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors stacked together with the insulating layers. The multilayer coil component further includes, inside the multilayer body, first and second connecting conductors. The first connecting conductor connects between a portion of the first outer electrode covering the first end face, and a coil conductor facing the portion. The second connecting conductor connects between a portion of the second outer electrode covering the second end face, and a coil conductor facing the portion. Concerning the length direction, the first and second connecting conductors each have a length from about 2.5% to about 7.5% of the length of the multilayer body.

Module substrate antenna, and module substrate mounting the same

A module substrate antenna includes: a laminate in which a plurality of ferrite layers are stacked; antennal coils provided on surfaces of the respective ferrite layers; a connection pad connected to an external circuit; and a lead wire provided between the laminate and the connection pad. In the laminate, the antenna coils are two types of the antenna coils, and the two types of the antenna coils are alternately stacked.

Oscillator frequency range extension using switched inductor

An inductive switch comprises an inductor that has a primary metallic winding having a boundary configured in shape of a figure eight, such as in two loops, and a plurality of secondary metallic windings arranged within the boundary of the primary metallic winding. The inductive switch includes a plurality of switches, each switch arranged in series with a respective one of the plurality of secondary metallic windings. An equal number of the secondary windings is arranged within each loop. A tunable inductor comprises at least one main metallic loop and at least one secondary metallic loop, wherein the at least one secondary metallic loop comprises a switch that is arranged to configure the at least one secondary metallic loop into at least one shorted metallic loop or at least one closed metallic loop. The at least one shorted loop is floating.

Multilayer coil component

A sintered material contains Fe in an amount of from 8 mol % to 37 mol % in terms of Fe.sub.2O.sub.3, Zn in an amount of from 30 mol % to 60 mol % in terms of ZnO, Cu in an amount of from 1 mol % to 7 mol % in terms of CuO, Ni in an amount of from 3 mol % to 17 mol % in terms of NiO, and Si in an amount of from 7 mol % to 28 mol % in terms of SiO.sub.2. A mole ratio (SiO.sub.2/Fe.sub.2O.sub.3) of the SiO.sub.2 to the Fe.sub.2O.sub.3 is from 0.2 to 3.5. The sintered material contains B in an amount of from 0.05 mol parts to 0.5 mol parts.

Multilayer coil component

A coil is disposed in an element body such that a gap between the coil and a first principal surface is larger than a gap between the coil and a second principal surface, and has a coil axis along a direction intersecting with a direction in which the first principal surface and the second principal surface oppose each other. A terminal electrode is disposed on the element body such that at least a part of the first principal surface and a part of the second principal surface are exposed. The coil includes a plurality of coil conductors separated from each other in a direction along the coil axis and a through-hole conductor connecting the coil conductors adjacent to each other in the direction along the coil axis. The through-hole conductor does not overlap the plurality of terminal electrodes when viewed from the direction along the coil axis.

COIL COMPONENT

A coil component includes: an element body; a coil including a plurality of coil conductors disposed in the element body and electrically connected to each other; an external electrode disposed on the element body; and a connection conductor that connects the coil and the external electrode. The connection conductor has an end portion exposed from an outer surface of the element body and connected to the external electrode. The end portion has a shape extending outward over an entire circumference.

COIL COMPONENT

A coil component includes: an element body; a coil including a plurality of coil conductors disposed in the element body and electrically connected to each other; an external electrode disposed on the element body; and a connection conductor that connects the coil and the external electrode. The connection conductor has an end portion exposed from an outer surface of the element body and connected to the external electrode. The end portion has a shape extending outward over an entire circumference.

Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate

Embodiments may include inductors with embedded magnetic cores and methods of making such inductors. In an embodiment, an integrated circuit package may include an integrated circuit die with a multi-phase voltage regulator electrically coupled to the integrated circuit die. In such embodiments, the multi-phase voltage regulator may include a substrate core and a plurality of inductors. The inductors may include a conductive through-hole disposed through the substrate core and a plugging layer comprising a dielectric material surrounding the conductive through-hole. In an embodiment, a magnetic sheath is formed around the plugging layer. In an embodiment, the magnetic sheath is separated from the plated through hole by the plugging layer. Additionally, a first layer comprising a dielectric material may be disposed over a first surface of the magnetic sheath, and a second layer comprising a dielectric material may be disposed over a second surface of the magnetic sheath.