An electronic device includes a multilevel lamination structure having a core layer, dielectric layers and conductive features formed in metal layers on or between respective ones or pairs of the dielectric layers. The core layer and the dielectric layers extend in respective planes of orthogonal first and second directions and are stacked along an orthogonal third direction. The conductive features include a first patterned conductive feature having multiple conductive turns in each of a first pair of the metal layers to form a first winding having a first turn and a final turn adjacent to one another in the same metal layer of the first pair, and a second patterned conductive feature having multiple conductive turns in a second pair of the metal layers to form a second winding having a first turn and a final turn.

Fabricating composite monolithic structures to achieve optimal electrical, thermal, and mechanical properties through the elimination of air is discussed herein. A method of fabricating a composite structure includes coating an insulating layer with an uncured binding material and performing a first curing process on the uncured binding material to form a first stage cured binding material on the insulating layer without introduction of air pockets in a conventional manufacturing atmospheric environment. The method further includes disposing the insulating layer on an array of conductive structures. The first stage cured binding material is positioned between the insulating layer and the array of conductive structures. The method further includes performing a second curing process on the first stage cured binding material to form a cured binding material, and forming cured regions between adjacent conductive structures of the array of conductive structures.

Fabricating composite monolithic structures to achieve optimal electrical, thermal, and mechanical properties through the elimination of air is discussed herein. A method of fabricating a composite structure includes coating an insulating layer with an uncured binding material and performing a first curing process on the uncured binding material to form a first stage cured binding material on the insulating layer without introduction of air pockets in a conventional manufacturing atmospheric environment. The method further includes disposing the insulating layer on an array of conductive structures. The first stage cured binding material is positioned between the insulating layer and the array of conductive structures. The method further includes performing a second curing process on the first stage cured binding material to form a cured binding material, and forming cured regions between adjacent conductive structures of the array of conductive structures.

Network transformer structures including a production method therefore are disclosed. In one embodiment, multiple integrated I-shaped magnetic cores that include three winding barrel portions based on a new design for a magnetic core structure is disclosed. A first winding barrel portion and a second winding barrel portion are configured to wind a transformer winding, and a third winding barrel portion is configured to wind a common mode choke winding, so that a transformer and a common mode choke are combined onto one magnetic core to replace two previous magnetic cores, thereby saving on the overall network transformer structure cost as well as space on, for example, an end consumer printed circuit board.

A Fai 2 converter includes an isolated Fai 2 inverter coupled to a resonant rectifier with either clamped diodes or clamped self-driven synchronous rectifiers. The Fai 2 inverter converts an input DC signal to a high-frequency AC signal. The resonant rectifier with either clamped diodes or clamped self-driven synchronous rectifiers rectifies the high-frequency AC signal to a DC signal while clamping the voltage across the clamped diodes or clamped self-driven synchronous rectifiers to the output voltage. Clamping the voltage in this manner minimizes the voltage stress and enables the use of low voltage stress components (diodes or synchronous rectifiers) with low conduction voltage drop.

A Fai 2 converter includes an isolated Fai 2 inverter coupled to a resonant rectifier with either clamped diodes or clamped self-driven synchronous rectifiers. The Fai 2 inverter converts an input DC signal to a high-frequency AC signal. The resonant rectifier with either clamped diodes or clamped self-driven synchronous rectifiers rectifies the high-frequency AC signal to a DC signal while clamping the voltage across the clamped diodes or clamped self-driven synchronous rectifiers to the output voltage. Clamping the voltage in this manner minimizes the voltage stress and enables the use of low voltage stress components (diodes or synchronous rectifiers) with low conduction voltage drop.

A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

There is disclosed a magnetic component which includes a first magnetic pole extending in a first direction and having an air gap provided therein, a second magnetic pole extending in the first direction, a cover plate extending in a second direction perpendicular to the first direction and connected with an end of the first magnetic pole and an end of the second magnetic pole, a protrusion formed on and at least partially surrounding the first magnetic pole, and a winding wound around the first magnetic pole at the air gap and having a lead supported by the protrusions such that a clearance is formed between the winding and the first magnetic pole.

There is disclosed a magnetic component which includes a first magnetic pole extending in a first direction and having an air gap provided therein, a second magnetic pole extending in the first direction, a cover plate extending in a second direction perpendicular to the first direction and connected with an end of the first magnetic pole and an end of the second magnetic pole, a protrusion formed on and at least partially surrounding the first magnetic pole, and a winding wound around the first magnetic pole at the air gap and having a lead supported by the protrusions such that a clearance is formed between the winding and the first magnetic pole.