Patent classifications
H01F41/00
FERROFLUID
The invention is directed to a method and a system for producing a ferrofluid comprising providing a stock solution with Fe(II) and Fe(III); mixing the stock solution with a base to form magnetic nanoparticles and a spent solution, said method further comprising a separation step of separating the nanoparticles from the spent solution by applying a magnet to immobilize the nanoparticles and remove at least part of the spent solution as supernatant from the immobilized nanoparticles. In another aspect, the invention is directed to the resulting ferrofluid.
Methods of Manufacturing a Molded, Formerless Multi-Coil Cylindrical Superconducting Magnet Structure, and a Structure as May Be Manufactured by Such Methods
A method for the manufacture of a formerless, multi-coil cylindrical superconducting magnet structure is disclosed. The structure comprises superconducting coils and annular spacers of composite filler material. The disclosure also provides a formerless, multi-coil cylindrical superconducting magnet structure as may be manufactured by such a method.
Coil Impregnation With Filled Resin
Techniques are described for a method to manufacture a magnet structure comprising superconducting coils and annular spacers comprising a filled composite filler material. Also described are superconducting magnet structures as may be manufactured by such a method.
Transformer and assembling method thereof
A transformer comprises at least two windings and each of the at least two windings includes at least one lead-out wire, and a silicone rubber heat-shrinkable sleeve is wrapped around the outer surface of the lead-out wire. The at least two windings and a portion of the silicone rubber heat-shrinkable sleeve are encapsulated in a potting box with a first potting sealant, and another portion of the silicone rubber heat-shrinkable sleeve is exposed outside of the potting box.
ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
The present disclosure concerns a method of manufacturing an electronic device, where the electronic device includes at least one electronic component with at least one electrical winding, and at least one heat dissipation mass coating, and the method includes inserting the at least one electronic component into a cavity; pouring, before or after the insertion of the electronic component, a heat dissipation mass into the cavity so as to at least partially fill the cavity and at least partially cover the electronic component with the heat dissipation mass; removing the electronic device, namely, the electronic component covered by the heat dissipation mass coating, from the cavity. The present disclosure also concerns an electronic apparatus including at least one electronic device manufactured by the foregoing method.
Power inductor and manufacturing method therefor
Disclosed are a power inductor and a method of manufacturing the same. The power inductor includes a body, a coil pattern provided in the body, an external electrode disposed on at least one surface of the body and extending to at least the other surface of the body, which is adjacent thereto, and a coupling layer provided between the body and an extended area of the external electrode.
Coil component
A coil component includes a molded portion having one surface and another surface opposing each other, and a wound coil disposed on the one surface of the molded portion and including an innermost turn, at least one intermediate turn, and an outermost turn disposed outwardly of a central portion of the one surface of the molded portion. A cover portion is disposed to face the one surface of the molded portion and to cover the wound coil, and first and second external electrodes are connected to the wound coil and arranged to be spaced apart from each other on the other surface of the molded portion. A thickness of one region of the cover portion disposed on the innermost turn is thicker than a thickness of another region of the cover portion disposed on the outermost turn.
Device for preparing a magnetic core with a thin amorphous ribbon
The invention discloses a method and its device for preparing a magnetic core with amorphous ribbon. The magnetic core is prepared with amorphous ribbon, the size of the amorphous ribbon is controlled according to the target requirements, and the magnetic core with required size and shape is prepared according to the target requirements; the single-roller rapid quenching technology with online automatic segmentation and automatic storage capability is used for preparation, which can control the length, width and thickness of the amorphous ribbon according to the target requirements; the amorphous ribbon segmented by single-roller rapid quenching technology is used to spray and cool down one by one, and then air-dry, transfer, spray adhesive and online store it one by one; the stored amorphous ribbon is reshaped, compressed and heat-treated successively, and then demoulded to prepare a magnetic core.
Circuit board and method for manufacturing the same
The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.
Method for manufacturing embedded circuit board, embedded circuit board, and application
The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.