Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.

A design method applied to a capacitor array is provided. The capacitor array includes multiple preset capacitor units, and each preset capacitor includes multiple unit capacitors. The method includes: acquiring unit simulation models of the preset capacitor units; acquiring a first simulation model of the capacitor array based on an arrangement manner of the preset capacitor units in the capacitor array and the unit simulation models of the preset capacitor unit; acquiring an arrangement direction of the preset capacitor units based on the arrangement manner, establishing a parasitic resistance equivalent test structure of a group of preset capacitor units in the same arrangement direction; obtaining a parasitic resistance of each preset capacitor unit based on the parasitic resistance equivalent test structure; and establishing a second simulation model representing the capacitor array based on the parasitic resistance of each preset capacitor unit and the first simulation model.

A design method applied to a capacitor array is provided. The capacitor array includes multiple preset capacitor units, and each preset capacitor includes multiple unit capacitors. The method includes: acquiring unit simulation models of the preset capacitor units; acquiring a first simulation model of the capacitor array based on an arrangement manner of the preset capacitor units in the capacitor array and the unit simulation models of the preset capacitor unit; acquiring an arrangement direction of the preset capacitor units based on the arrangement manner, establishing a parasitic resistance equivalent test structure of a group of preset capacitor units in the same arrangement direction; obtaining a parasitic resistance of each preset capacitor unit based on the parasitic resistance equivalent test structure; and establishing a second simulation model representing the capacitor array based on the parasitic resistance of each preset capacitor unit and the first simulation model.

The disclosure relates to power electronic devices with busbars and a method for their fabrication. In particular, the disclosure relates to the connection of semiconductor power modules and intermediate circuit capacitor in a commutation cell of an inverter of an electrically powered motor vehicle.

The disclosure relates to power electronic devices with busbars and a method for their fabrication. In particular, the disclosure relates to the connection of semiconductor power modules and intermediate circuit capacitor in a commutation cell of an inverter of an electrically powered motor vehicle.

An electronic modulating device is provided. The electronic modulating device includes a first substrate, a second substrate, at least one working unit and at least one adjustment structure. The second substrate is disposed opposite to the first substrate. The at least one working unit includes a first cell gap and is disposed between the first substrate and the second substrate. The at least one working unit includes a modulating material. The at least one adjustment structure includes a second cell gap and is disposed between the first substrate and the second substrate. The second cell gap is greater than the first cell gap.

An electronic modulating device is provided. The electronic modulating device includes a first substrate, a second substrate, at least one working unit and at least one adjustment structure. The second substrate is disposed opposite to the first substrate. The at least one working unit includes a first cell gap and is disposed between the first substrate and the second substrate. The at least one working unit includes a modulating material. The at least one adjustment structure includes a second cell gap and is disposed between the first substrate and the second substrate. The second cell gap is greater than the first cell gap.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, first and second main surfaces opposing each other in a lamination direction, first and second end surfaces opposing each other in a length direction which intersects the lamination direction, and first and second side surfaces opposing each other in a width direction which intersects the lamination direction and the length direction, and external electrodes on the first and second end surfaces, and each electrically connected to the internal electrode layers, wherein the multilayer body includes a slit in at least one of the first side surface, the second side surface, and the second main surface defining and functioning as a board-mounting surface.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, first and second main surfaces opposing each other in a lamination direction, first and second end surfaces opposing each other in a length direction which intersects the lamination direction, and first and second side surfaces opposing each other in a width direction which intersects the lamination direction and the length direction, and external electrodes on the first and second end surfaces, and each electrically connected to the internal electrode layers, wherein the multilayer body includes a slit in at least one of the first side surface, the second side surface, and the second main surface defining and functioning as a board-mounting surface.

A switch includes a first electrode layer, a second electrode layer disposed over the first electrode layer, and a selecting element layer interposed between the first electrode layer and the second electrode layer. The selecting element layer includes a gas region in which a current flows or does not flow according to a voltage applied to the switch. When the current flows, the switch is in an on-state, and, when the current does not flow, the switch is in an off-state.