A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.

A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.

A method of manufacturing an electronic component includes preparing an unfired multilayer body, bonding one of first and second side surfaces of each unfired multilayer body to an adhesive sheet such that the unfired multilayer bodies are in at least one row, polishing the other side surface of each unfired multilayer body by rotating a polishing surface of a rotary polishing machine in contact with the other side surface of each unfired multilayer body, and forming a first insulating layer on the polished other side surface, wherein in the polishing the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other to form a polish groove in the length direction, and the rotary polishing machine has a cylindrical shape and includes an outer circumferential surface that defines the polishing surface.

A ceramic electronic component includes a multilayer chip including a multilayer structure and cover layers disposed on top and bottom faces in a stack direction of the multilayer structure, and a pair of external electrodes respectively formed on two edge faces of the multilayer structure and extending to four side faces of the multilayer chip, wherein each external electrode has a recessed portion on at least one of two side faces facing each other in the stack direction or at least one of remaining two side faces, and wherein each external electrode has no recessed portion on the two side faces when each external electrode has the recessed portion on at least one of the remaining two side faces, and has no recessed portion on the remaining two side faces when each external electrode has the recessed portion on at least one of the two side faces.

A ceramic electronic component includes a multilayer chip including a multilayer structure and cover layers disposed on top and bottom faces in a stack direction of the multilayer structure, and a pair of external electrodes respectively formed on two edge faces of the multilayer structure and extending to four side faces of the multilayer chip, wherein each external electrode has a recessed portion on at least one of two side faces facing each other in the stack direction or at least one of remaining two side faces, and wherein each external electrode has no recessed portion on the two side faces when each external electrode has the recessed portion on at least one of the remaining two side faces, and has no recessed portion on the remaining two side faces when each external electrode has the recessed portion on at least one of the two side faces.

An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to form a 3D printed capacitor on a body of the 3D printed object. The controller does this by controlling deposition of a conductive agent to form electrodes of the 3D printed capacitor and by controlling deposition of a dielectric agent in a dielectric region between the electrodes of the 3D printed capacitor.

In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to form a 3D printed capacitor on a body of the 3D printed object. The controller does this by controlling deposition of a conductive agent to form electrodes of the 3D printed capacitor and by controlling deposition of a dielectric agent in a dielectric region between the electrodes of the 3D printed capacitor.

An electrode pressure-bonding device that includes a feeding device that feeds a separator material in a strip shape in a feeding direction; a support stage under the separator material and configured to support an electrode on the separator material with the separator material interposed between the electrode and the support stage; and a pressure-bonding device that holds the separator material and the electrode together and pressure-bonds at least part of the separator material to the electrode.

An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of −55 degrees C. to 125 degrees C.