H01G13/00

Ceramic electronic component and method of manufacturing the same
11469045 · 2022-10-11 · ·

A ceramic electronic component includes a multilayer structure including dielectric layers and internal electrode layers, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other. A rare earth element of a side margin has an ionic radius smaller than that of a rare earth element of a capacity section. The rare earth element of the side margin is a rare earth element when only the rare earth element is added to the side margin, or a rare earth element with a largest amount when rare earth elements are added to the side margin. The rare earth element of the capacity section is a rare earth element when only the rare earth element is added to the capacity section, or a rare earth element with a largest amount when rare earth elements are added to the capacity section.

ELECTRODE BODY, METHOD FOR MANUFACTURING ELECTRODE BODY, AND ELECTROCHEMICAL ELEMENT
20230104309 · 2023-04-06 · ·

An electrode body having an electrode, and a primer layer or a plurality of primer layers laminated on the electrode, wherein the at least one primer layer is an in-situ polymerizable composition layer formed from a polymerization product of an in-situ polymerizable composition, a method for producing an electrode body, and an electrochemical element.

APPARATUS FOR DETECTING STACKING DIRECTION OF INTERNAL ELECTRODE OF MULTILAYER CAPACITOR AND DETECTING METHOD THEREOF

An apparatus for detecting a stacking direction of internal electrodes of a multilayer capacitor includes a capacitor moving unit having a supply unit in which a plurality of multilayer capacitors are continuously supplied ad moving the supplied multilayer capacitors in one direction, a sensor unit including a coil, installed on the capacitor moving unit, and detecting inductance of the coil when each of the multilayer capacitors approaches the coil to determine a stacking direction of internal electrodes of the multilayer capacitor based on the detected inductance of the coil, and a separating unit installed on the capacitor moving unit and separating a multilayer capacitor selected as an unsuitable multilayer capacitor by the sensor unit.

PRINTING FOUNDATION
20230151240 · 2023-05-18 ·

A printing foundation includes a support having a porous structure and a functional layer in contact with the support and including a plurality of resin particles including a surface at least portion of which is covered by polyvinyl alcohol.

Multilayer capacitor and board having the same mounted thereon

A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.

Multilayer capacitor and board having the same mounted thereon

A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.

Method of winding coilware, computer program product, control device, and winding machine

A method of winding coilware via a winding machine having a plurality of winding devices, which are drivable by a plurality of drives which comprise at least a supply roll and a winding body, includes providing the coilware from the supply roll and winding the coilware over at least one deflection roll onto the winding body, where at least one drive is adjusted as a function of a position-dependent compensation signal at least partly compensating a defect, and where the position-dependent compensation signal for the drive is provided by acquiring a time domain interference variable during a winding operation, transforming the acquired interference variable into a frequency domain spectrum, filtering the spectrum via a filter specific to the winding device assigned to the drive, transforming the filtered spectrum back into the time domain to provide a time-dependent compensation signal, and transforming the time-dependent compensation signal into the position-dependent compensation signal.

MULTILAYER CAPACITOR, MULTILAYER CAPACITOR GROUP, AND METHOD FOR MANUFACTURING MULTILAYER CAPACITOR
20230145085 · 2023-05-11 ·

A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes, and first and second main surfaces, first and second external electrodes on at least one of the first and second main surfaces, first via conductors to electrically connect the first external electrode and the first internal electrodes, and second via conductors to electrically connect the second external electrode and the second internal electrodes, a direction in which the dielectric layer, the first internal electrode, and the second internal electrode are laminated is a height direction of the capacitor body, and a height of the capacitor body is about 100%, and a height of the first and second external electrodes is equal to or larger than about 50% with respect to the height of the capacitor body.

Method of manufacturing capacitor structure and capacitor structure

A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.

Method of manufacturing capacitor structure and capacitor structure

A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.