Patent classifications
H01G15/00
AIRFLOW COOLING FOR AN ENERGY STORAGE SYSTEM
The present disclosure is directed to systems and methods for providing a cooling airflow to an energy storage system. The energy storage system can include one or more energy storage devices positioned within a defined thermal zone. The energy storage system can include a thermal control system configured to provide a cooling airflow to the one or more energy storage devices. The thermal control system can include a heat exchanging device configured to provide a cooled airflow to the defined thermal zone. The thermal control system can also include a moveable element configured to adjust a distribution of airflow within the defined thermal zone.
Composite electronic component and board on which composite electronic component is mounted
A composite electronic composite includes a plurality of multilayer ceramic capacitors each including a ceramic body in which dielectric layer and internal electrodes are alternately disposed and first and second external electrodes disposed on a lower surface of the ceramic body, a tantalum capacitor including a body part including a sintered tantalum powder material and a tantalum wire of which a portion is embedded in the body part and disposed on the plurality of multilayer ceramic capacitors, and a molding portion enclosing the tantalum capacitor and the plurality of multilayer ceramic capacitors.
Composite electronic component and board on which composite electronic component is mounted
A composite electronic composite includes a plurality of multilayer ceramic capacitors each including a ceramic body in which dielectric layer and internal electrodes are alternately disposed and first and second external electrodes disposed on a lower surface of the ceramic body, a tantalum capacitor including a body part including a sintered tantalum powder material and a tantalum wire of which a portion is embedded in the body part and disposed on the plurality of multilayer ceramic capacitors, and a molding portion enclosing the tantalum capacitor and the plurality of multilayer ceramic capacitors.
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
A composite electronic component includes a multilayer capacitor including external electrodes, a tantalum capacitor disposed adjacently to the multilayer capacitor, first electrode parts connected to the external electrodes, a second electrode part connected to a second body, and an encapsulant encapsulating the multilayer capacitor and the tantalum capacitor and formed such that portions of the first and second electrode parts are exposed.
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
A composite electronic component includes a multilayer capacitor including external electrodes, a tantalum capacitor disposed adjacently to the multilayer capacitor, first electrode parts connected to the external electrodes, a second electrode part connected to a second body, and an encapsulant encapsulating the multilayer capacitor and the tantalum capacitor and formed such that portions of the first and second electrode parts are exposed.
Power storage device
A power storage device includes a plurality of power storage modules, a first connecting plate, and a second connecting plate. Each of the plurality of power storage modules includes a plurality of power storage cells, a first end plate, and a second end plate. The first end plate includes a first main plate and a first sub-plate. The first sub-plate includes a first securing hole. The first main plate and the first sub-plate are provided to be connected to each other in at least two positional relationships with different positions of the first securing hole. The first connecting plate includes a first reference securing hole aligned with the first securing hole. The first securing hole is secured to the first reference securing hole by a first securing member.
Power storage device
A power storage device includes a plurality of power storage modules, a first connecting plate, and a second connecting plate. Each of the plurality of power storage modules includes a plurality of power storage cells, a first end plate, and a second end plate. The first end plate includes a first main plate and a first sub-plate. The first sub-plate includes a first securing hole. The first main plate and the first sub-plate are provided to be connected to each other in at least two positional relationships with different positions of the first securing hole. The first connecting plate includes a first reference securing hole aligned with the first securing hole. The first securing hole is secured to the first reference securing hole by a first securing member.
Electronic device with capacitor bank linearization and a linearization method
An electronic device comprises a controllable capacitor bank and a capacitive divider arranged in parallel with the capacitor bank and configured to linearize the capacitor bank in a linearization frequency range of a frequency characteristic of the electronic device. The capacitive divider comprises a series arrangement of a first series capacitance, and a main capacitor bank. A control circuit coupled to one or more control inputs of the capacitive divider and controllable capacitor bank is configured to modify the equivalent capacitance of the capacitive divider and the controllable capacitor bank for providing capacitance steps, each capacitance step being variable over frequency such that for each step a frequency change f of the frequency characteristic is maintained constant in the linearization frequency range.
Electronic device with capacitor bank linearization and a linearization method
An electronic device comprises a controllable capacitor bank and a capacitive divider arranged in parallel with the capacitor bank and configured to linearize the capacitor bank in a linearization frequency range of a frequency characteristic of the electronic device. The capacitive divider comprises a series arrangement of a first series capacitance, and a main capacitor bank. A control circuit coupled to one or more control inputs of the capacitive divider and controllable capacitor bank is configured to modify the equivalent capacitance of the capacitive divider and the controllable capacitor bank for providing capacitance steps, each capacitance step being variable over frequency such that for each step a frequency change f of the frequency characteristic is maintained constant in the linearization frequency range.
Variable capacitance circuit and impedance matching circuit
A first variable capacitance section included in a variable capacitance circuit includes a plurality of first variable capacitance elements connected to a signal line and each having a first capacitance value or a second capacitance value greater than the first capacitance value according to driving voltage, and includes a first fixed capacitance element connected in series with the plurality of first variable capacitance elements. A second variable capacitance section included in the variable capacitance circuit includes a second variable capacitance element connected to the signal line and having the first capacitance value or the second capacitance value according to the driving voltage, and includes a second fixed capacitance element connected in series with the second variable capacitance element.