Patent classifications
H01G15/00
Variable capacitance circuit and impedance matching circuit
A first variable capacitance section included in a variable capacitance circuit includes a plurality of first variable capacitance elements connected to a signal line and each having a first capacitance value or a second capacitance value greater than the first capacitance value according to driving voltage, and includes a first fixed capacitance element connected in series with the plurality of first variable capacitance elements. A second variable capacitance section included in the variable capacitance circuit includes a second variable capacitance element connected to the signal line and having the first capacitance value or the second capacitance value according to the driving voltage, and includes a second fixed capacitance element connected in series with the second variable capacitance element.
COMPOSITE ELECTRONIC COMPONENT AND BOARD ON WHICH COMPOSITE ELECTRONIC COMPONENT IS MOUNTED
A composite electronic composite includes a plurality of multilayer ceramic capacitors each including a ceramic body in which dielectric layer and internal electrodes are alternately disposed and first and second external electrodes disposed on a lower surface of the ceramic body, a tantalum capacitor including a body part including a sintered tantalum powder material and a tantalum wire of which a portion is embedded in the body part and disposed on the plurality of multilayer ceramic capacitors, and a molding portion enclosing the tantalum capacitor and the plurality of multilayer ceramic capacitors.
COMPOSITE ELECTRONIC COMPONENT AND BOARD ON WHICH COMPOSITE ELECTRONIC COMPONENT IS MOUNTED
A composite electronic composite includes a plurality of multilayer ceramic capacitors each including a ceramic body in which dielectric layer and internal electrodes are alternately disposed and first and second external electrodes disposed on a lower surface of the ceramic body, a tantalum capacitor including a body part including a sintered tantalum powder material and a tantalum wire of which a portion is embedded in the body part and disposed on the plurality of multilayer ceramic capacitors, and a molding portion enclosing the tantalum capacitor and the plurality of multilayer ceramic capacitors.
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
A multilayer electronic component includes a ceramic body having stacked dielectric layers to form a first capacitor part and a second capacitor part, wherein the first capacitor has a constant capacitance, and the second capacitor part has a variable capacitance; a voltage control terminal formed on a lateral surface of the ceramic body; an input terminal disposed on another lateral surface of the ceramic body corresponding to the first capacitor part; and an output terminal disposed on the other lateral surface of the ceramic body corresponding to the second capacitor part separate from the input terminal.
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
A multilayer electronic component includes a ceramic body having stacked dielectric layers to form a first capacitor part and a second capacitor part, wherein the first capacitor has a constant capacitance, and the second capacitor part has a variable capacitance; a voltage control terminal formed on a lateral surface of the ceramic body; an input terminal disposed on another lateral surface of the ceramic body corresponding to the first capacitor part; and an output terminal disposed on the other lateral surface of the ceramic body corresponding to the second capacitor part separate from the input terminal.
ELECTRONIC DEVICE WITH CAPACITOR BANK LINEARIZATION AND A LINEARIZATION METHOD
An electronic device comprises a controllable capacitor bank and a capacitive divider arranged in parallel with the capacitor bank and configured to linearize the capacitor bank in a linearization frequency range of a frequency characteristic of the electronic device. The capacitive divider comprises a series arrangement of a first series capacitance, and a main capacitor bank. A control circuit coupled to one or more control inputs of the capacitive divider and controllable capacitor bank is configured to modify the equivalent capacitance of the capacitive divider and the controllable capacitor bank for providing capacitance steps, each capacitance step being variable over frequency such that for each step a frequency change f of the frequency characteristic is maintained constant in the linearization frequency range.
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
A composite electronic component includes a multilayer ceramic capacitor including a ceramic body in which dielectric layers and internal electrodes are alternately disposed, and first and second external electrodes disposed on a lower surface of the ceramic body; a tantalum capacitor including a body portion containing a sintered material of a tantalum powder and a tantalum wire having a portion embedded in the body portion, and disposed on the multilayer ceramic capacitor; and an encapsulant part enclosing the tantalum capacitor and the multilayer ceramic capacitor, wherein the internal electrodes are led to the lower surface of the ceramic body.
ELECTROCHEMICAL CELL, ENERGY STORAGE SYSTEM AND VEHICLE COMPRISING SUCH A SYSTEM
An electrochemical cell including a shell delimiting a space filled with an electrolytic solution, and a set of at least two different electrochemical systems selected from among a supercapacitor, a hybrid supercapacitor, and an accumulator, the set being arranged in the space filled with the electrolytic solution. A system for storing and restoring electric energy, or a vehicle, or a hybrid vehicle car can include such an electrochemical cell and can include such a system for storing and restoring electric energy.
Cable repair splice
A splice kit is provided for repairing a cable having a central conductor, an insulator surrounding the central conductor, an outer conductive sheath surrounding the insulator, and a jacket surrounding the outer conductive sheath. The splice kit includes a central conductor joint that is electrically conductive and is configured to engage the central conductor of the cable such that the central conductor joint defines a portion of an electrical path of the central conductor. The splice kit also includes a dielectric insert configured to at least partially surround the central conductive joint and the central conductor of the cable, and an outer sheath joint that is electrically conductive and is configured to at least partially surround the dielectric insert. The outer sheath joint is configured to be electrically connected to the outer conductive sheath of the cable such that the outer sheath joint defines a portion of an electrical path of the outer conductive sheath. The splice kit further includes a jacket joint configured to at least partially surround the outer sheath joint and the jacket of the cable.
Semiconductor unit
A laminated wiring has a first conductor which connects first terminals of one or more capacitors and each positive terminal of a plurality of semiconductor modules, a second conductor which connects second terminals of the one or more capacitors and each negative terminal of the plurality of semiconductor modules, and an insulator. Slits are cut in at least one of the first conductor and the second conductor (in both of them in the example of FIG. 1). By doing so, among the plurality of semiconductor modules, a variation in the total of respective inductance values between respective first terminals and one positive terminal closest to the respective first terminals and respective inductance values between respective negative terminals to one second terminal closest to the respective negative terminals becomes smaller than or equal to 10 nH.