A microelectromechanical systems (MEMS) switch die having an N number of radio frequency (RF) MEMS switches, each having a anchored beam with a switch contact, a gate, and a terminal contact is disclosed. Also included is a MEMS-based decoder having logic gates comprised of logic MEMS switches that are configured to decode the coded signals to determine which of the N number of RF MEMS switches to open and close, apply a higher level gate voltage to each gate of the RF MEMS switches determined to be closed, wherein the higher gate voltage electrostatically pulls the anchored beam and brings the switch contact into electrical contact with the terminal contact, and apply a lower gate voltage to each gate of the RF MEMS switches to be opened, wherein the lower gate voltage releases the anchored beam and allows the switch contact to break electrical contact with the terminal contact.

A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

According to one aspect of the invention, there is proposed a capacitive radiofrequency MicroElectroMechanical System or capacitive RF MEMS comprising a metallic membrane suspended above an RF transmission line and resting on ground planes, and exhibiting a lower face, an upper face opposite to the lower face and a first layer comprising a refractory metallic material at least partially covering the upper face of the membrane so as to prevent the heating of the membrane.

Microelectromechanical system (MEMS) switches that provide low contact resistance over a large number of open and close contact cycles are disclosed. A MEMS switch device may include a plurality of parallel MEMS switches with a first MEMS switch that is configured differently in such a manner to close first and/or open last during open and close cycles. In this regard, the first MEMS switch may experience increased contact resistance over a large number of open and close cycles while other MEMS switches maintain a low contact resistance. In certain embodiments, the first MEMS switch is controlled by a different control signal to open and close differently than the other MEMS switches. In certain embodiments, a common control signal controls a plurality of MEMS switches and the first MEMS switch is mechanically different such that it opens and closes differently than other MEMS switches.

Various embodiments include a switch cell comprising: a semiconductor switch element; a micro-electromechanical switch element; and an electronic actuation circuit. The semiconductor switch element and the micro-electromechanical switch element are connected in parallel. In a switch-off process for the switch cell, the semiconductor switch element is switched off after the micro-electromechanical switch element is switched off.

According to one embodiment, an IC chip includes a plurality of fuse elements including a plurality of fuse portions each of which is to be cut off by a stress, and a plurality of actuator portions provided for the plurality of fuse portions, respectively, and each of which applies a stress to corresponding one of fuse portions, and a control circuit supplying a control signal for cutting off desired one of the fuse portions to corresponding one of the actuator portions.

According to one embodiment, an IC chip includes a plurality of fuse elements including a plurality of fuse portions each of which is to be cut off by a stress, and a plurality of actuator portions provided for the plurality of fuse portions, respectively, and each of which applies a stress to corresponding one of fuse portions, and a control circuit supplying a control signal for cutting off desired one of the fuse portions to corresponding one of the actuator portions.

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

MEMS switches and methods of manufacturing MEMS switches is provided. The MEMS switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode.

MEMS switches and methods of manufacturing MEMS switches is provided. The MEMS switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode.