A transistor in which shape defects are unlikely to occur is provided. A transistor with favorable electrical characteristics is provided. A semiconductor device with favorable electrical characteristics is provided. The semiconductor device includes a transistor. The transistor includes a semiconductor layer, a first insulating layer, a metal oxide layer, a functional layer, and a conductive layer. The first insulating layer is positioned over the semiconductor layer. The metal oxide layer is positioned over the first insulating layer. The functional layer is positioned over the metal oxide layer. The conductive layer is positioned over the functional layer. The semiconductor layer, the first insulating layer, the metal oxide layer, the functional layer, and the conductive layer have regions overlapping with each other. In the channel length direction of the transistor, end portions of the first insulating layer, the metal oxide layer, the functional layer, and the conductive layer are positioned inward from an end portion of the semiconductor layer. An etching rate of the functional layer with an etchant containing one or more of phosphoric acid, acetic acid, nitric acid, hydrochloric acid, and sulfuric acid is lower than an etching rate of the conductive layer.

A method for fabricating a semiconductor device is provided and includes the following steps: providing a substrate; forming a lower electrode on the substrate; forming at least one sub-dielectric layer on the lower electrode; patterning the dielectric layer to form an intermediate dielectric layer, where the intermediate dielectric layer exposes a portion of the at least one sub-dielectric layer; forming a hole by etching the portion of the at least one sub-dielectric layer not covered by the intermediate dielectric layer; filling at least one plug into the hole; and forming an upper electrode on the intermediate dielectric layer.

A display device includes a first thin film transistor disposed on a substrate. A first insulating interlayer covers the first thin film transistor. An active pattern is disposed on the first insulating interlayer. The active pattern includes indium-gallium-zinc oxide (IGZO) having a thickness in a range of about 150 Å to about 400 Å. A gate insulation layer covers the active pattern. A gate pattern is disposed on the gate insulation layer. A second insulating interlayer covers the gate pattern.

A display device according to the disclosure includes a substrate, a first transistor provided on the substrate, and a second transistor provided on the substrate, not overlapping the first transistor. The first transistor includes a polycrystalline silicon layer provided on the substrate, a first insulating film provided on the polycrystalline silicon layer, a first gate electrode provided on the first insulating film, and a second insulating film provided on the first gate electrode. The second transistor includes an oxide semiconductor layer provided on the first insulating film, a third insulating film provided on the oxide semiconductor layer, and a second gate electrode provided on the third insulating film. The first and third insulating films are SiOx films. The second insulating film is an SiNx film including hydrogen, and is provided overlapping the polycrystalline silicon layer, and is provided not overlapping the oxide semiconductor layer.

According to an embodiment, a synapse circuit includes: a buffer that changes an output signal to a second logical value at a timing when an input signal exceeds a first threshold level, in a case where the output signal has a first logical value in a first mode, and changes the output signal to the second logical value at a timing when the input signal exceeds a reference level lower than the first threshold level, in a case where the output signal has the first logical value in a second mode; an adjusting unit that adjusts the first threshold level depending on a stored coefficient; and a mode switching unit that operates the buffer in the first mode during a period in which an acquired spike is not generated, and operates the buffer in the second mode during a period in which the spike is generated.

According to an embodiment, a synapse circuit includes: a buffer that changes an output signal to a second logical value at a timing when an input signal exceeds a first threshold level, in a case where the output signal has a first logical value in a first mode, and changes the output signal to the second logical value at a timing when the input signal exceeds a reference level lower than the first threshold level, in a case where the output signal has the first logical value in a second mode; an adjusting unit that adjusts the first threshold level depending on a stored coefficient; and a mode switching unit that operates the buffer in the first mode during a period in which an acquired spike is not generated, and operates the buffer in the second mode during a period in which the spike is generated.

An array substrate and a method of manufacturing the same are provided. The array substrate includes an active island and a gate insulating layer, a gate, and an interlayer dielectric layer stacked on the active island. A color resist layer is disposed on the interlayer dielectric layer, and an orthographic projection of the color resist layer on a base substrate covers an orthographic projection of a channel region of the active island on the base substrate.

A display substrate, a method for forming the display substrate and a display device are provided. The display substrate includes: a first conductive pattern located on a base substrate, where a ring-shaped conductive protection structure is arranged at an edge of a preset region of the first conductive pattern and surrounds the preset region, and the conductive protection structure is made of an anti-dry-etching material; an insulation layer covering the first conductive pattern; and a second conductive pattern located on a side of the insulation layer away from the first conductive pattern, where the second conductive pattern is electrically connected to the first conductive pattern through the via-hole.

A thin film transistor (TFT) array substrate for an electronic device includes a first active layer of a first TFT which is an oxide semiconductor layer including molybdenum, a second active layer of a second TFT which is an oxide semiconductor layer and disposed on a buffer layer to be spaced apart from the first active layer of the first TFT, a first gate insulating film overlapping the first active layer and the second active layer, a first gate electrode of the first TFT overlapping the first gate insulating film and a part of the first active layer, and a second gate electrode of the second TFT overlapping the first gate insulating film, spaced apart from the first gate electrode, and overlapping a part of the second active layer. Accordingly, the first TFT has a high subthreshold parameter, and the second TFT has high mobility.

A semiconductor substrate includes a buried semiconductor layer and semiconductor wells. A device for detecting a possible thinning of the semiconductor substrate via the rear face thereof is formed on and in the semiconductor wells. The device is a non-inverting buffer including an input terminal and an output terminal, the device being powered between a supply terminal and a reference terminal where the buried semiconductor layer provides the supply terminal. A control circuit delivers an input signal in a first state to the input terminal and outputs a control signal indicating a detection of a thinning of the substrate if a signal generated at the output terminal in response to the input signal is in a second state different from the first state.