A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

An apparatus for processing a signal by means of electromagnetic waves according to one embodiment of the present invention can, when a radio frequency (RF) signal is radiated onto a medium through any one of a plurality of channels, simultaneously receive the radiated RF signals which have been reflected or scattered by the medium or have penetrated the medium through the plurality of channels other than the channel through which the RF signal has been radiated.

Exemplary imaging systems, apparatus, and methods may include a plurality of reconfigurable antenna assemblies. The reconfigurable antenna assemblies may each include one or more antennas. The antennas may be configured in a plurality of states including a passive state in which the antenna may not perturb the electromagnetic field. The antennas may be positioned about a measurement domain such as, e.g., a conductive measurement chamber.

A system for detecting a position of a dual solenoid device includes device configured to move between first and second positions, and a controller. The controller has first and second monitoring circuits in operable communication with first and second channels, respectively. The first and second channels are in operable communication with first and second solenoids, respectively. Each solenoid is configured to selectively operate as an active solenoid to move the device when the solenoid and its respective channel are in an active mode, and as a passive solenoid when the solenoid and its respective channel are in a passive mode to passively move with the active solenoid. Each of the monitoring circuits is configured to determine a position of the device when the channel the monitoring circuit is associated with is operating in the passive mode by monitoring an electrical parameter of the passive solenoid associated with that channel.

Provided is a current detecting device comprising a current detecting resistor including a pair of electrodes and a resistive element; a pair of lands on which the current detecting resistor is adapted to be mounted; connection portions adapted to connect the two electrodes and the two lands, respectively; and a pair of wires connected to the two respective electrodes and adapted to detect a voltage. Positions where the two wires are connected to the two respective electrodes are located in regions on a further inner side than inner ends of the connection portions.

A workpiece evaluating method evaluates the gettering property of a device wafer having a plurality of devices formed on the front side of the wafer and having a gettering layer formed inside the wafer. The method includes the steps of applying excitation light for exciting a carrier to the wafer, applying microwaves to a light applied area where the excitation light is applied and also to an area other than the light applied area, measuring the intensity of the microwaves reflected from the light applied area and from the area other than the light applied area, subtracting the intensity of the microwaves reflected from the area other than the light applied area from the intensity of the microwaves reflected from the light applied area to thereby obtain a differential signal, and determining the gettering property of the gettering layer according to the intensity of the differential signal obtained above.

A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.

A tester interface unit comprising a test hardware module. The test hardware module may have a simple construction, relying on control and/or signal processing in one or more tester instruments to generate or analyze test signals for a device under test. The test hardware module may be disposed within the tester interface unit, providing a short and high integrity signal path length to the device under test. The tester interface unit may include a purge gas chamber and a cooling chamber, with the hardware module penetrate a separator between those chambers, sealing an opening between the purge gas chamber and the cooling chamber. A heat spreader may move heat generated on the portion of the test hardware module in the purge gas chamber to the cooling chamber.

Electrical current transducer (2) of a closed-loop type for measuring a primary current (I.sub.P) flowing in a primary conductor (1), comprising a fluxgate measuring head (7) and an electronic circuit (16) including a microprocessor (18) for digital signal processing. The measuring head includes a secondary coil (6) and a fluxgate detector (4) comprising an excitation coil and a magnetic material core. The electronic circuit comprises an excitation coil drive circuit (14) configured to generate an alternating excitation voltage to supply the excitation coil with an alternating excitation current (I.sub.fx), the secondary coil (6) connected in a feedback loop (12) of the electronic circuit to the excitation coil drive circuit (14), the electronic circuit further comprising a ripple compensation circuit (26, 28) configured to compensate for a ripple signal generated by the alternating excitation voltage.