A method for determining at least one electrical property of an earth formation includes emitting an electromagnetic signal into the earth formation from an antenna and measuring an electromagnetic signal from the earth formation. The antenna is a broadband log antenna mounted on a substrate having at least a high dielectric permittivity, defined as a dielectric permittivity of about =100 to =1000 or a gigantic dielectric permittivity, defined as a dielectric permittivity of about =1000 or greater. The antenna has a radius between about 2.5 millimeters (mm) and 10 centimeters (cm). The method further includes determining at least one electrical property of one or more of a borehole, a borehole fluid, and the earth formation based on measuring the electromagnetic signal.

A probe having a sliding rail is provided and includes a probe head, a probe tail, an elastic element made of an elastic material and connected between the probe head and the probe tail, and a sliding rail assembly. The sliding rail assembly includes a slide rail and a position limit protrusion. The slide rail has a fixed end and a free end. The fixed end is fixedly connected to the probe tail, and the free end extends to the probe head. The position limit protrusion is fixedly connected to the probe head, and has a sliding slot formed thereon through which the slide rail can pass. The sliding rail assembly is made of a conductive material, and a cross-section area of the slide rail is greater than a cross-section area of the elastic material of the elastic element.

A solid state impedance tuner or impedance tuner system including a housing structure and at least two solid state tuner modules electrically combined and disposed in one package within the housing structure. Each tuner module includes at least one solid state control element. Another embodiment is directed to an impedance tuner module card configured in a standardized system architecture. The card includes a chassis board, and at least one solid state tuner module integrated on the card and supported on or by the chassis board, each module including at least one solid state control element. Methods for calibrating a solid state impedance tuner that includes at least two solid state tuner modules combined in one package are disclosed.

A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

A fingerprint sensor device and an operation method thereof are provided. The fingerprint sensor device includes a driving electrode, a driving circuit, a fingerprint sensing plate, a reading circuit and a determination circuit. The driving circuit applies a driving signal to an object through the driving electrode. The fingerprint sensing plate has sensing electrodes configured to sense the object. The reading circuit reads the driving signal through the fingerprint sensing plate. During a period between a rising edge time point and its adjacent falling edge time point of the driving signal, the reading circuit respectively samples the driving signal in at least two different phases to obtain at least two sampling results and outputs a difference value of the at least two sampling results. The determination circuit checks the difference value to determine whether the object to be sensed is a real finger or a fake finger.

A method and apparatus for using a magnetic element to detect the presence of foreign materials, or anomalies, embedded in an object including placing magnetic field viewing film over an object such as a coin and passing the magnetic element over the object in prescribed patterns. The object to be tested for an anomaly may be covered or encased in magnetic paper. The presence of a foreign material in the object will be detected by the film when a magnetic element passes by the anomaly. An anomaly, such as of tungsten hidden in a gold coin or nugget, is detected by the film due to the disruption of the magnetic field of the anomaly. The film will present a dark spot adjacent to the location of the hidden anomaly.

A probe having a sliding rail is provided and includes a probe head, a probe tail, an elastic element made of an elastic material and connected between the probe head and the probe tail, and a sliding rail assembly. The sliding rail assembly includes a slide rail and a position limit protrusion. The slide rail has a fixed end and a free end. The fixed end is fixedly connected to the probe tail, and the free end extends to the probe head. The position limit protrusion is fixedly connected to the probe head, and has a sliding slot formed thereon through which the slide rail can pass. The sliding rail assembly is made of a conductive material, and a cross-section area of the slide rail is greater than a cross-section area of the elastic material of the elastic element.

A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction.

A test probe tip can include a resistive element coupled with a tip component. The resistive element can include a resistive layer disposed on an exterior surface of a structural member of the resistive impedance element. In embodiments, the resistive element can be configured to form a structural component of the test probe tip without an insulating covering applied thereto. Additional embodiments may be described and/or claimed herein.

Embodiments of methods of non-destructively testing whether a laminated substrate satisfies structural requirements are disclosed herein. Additionally, laminated substrates that can be non-destructively tested are also disclosed along with methods of manufacturing the same. To non-destructively test whether the laminated substrates satisfies the structural requirement, an electrical characteristic of the laminated substrate may be detected. Since the detected electrical characteristic is related to a structural characteristic being tested, whether the structural characteristic complies with the structural requirement can be determined based on the electrical characteristic.