A voltage detection circuit includes: a transistor; a switch coupled to a drain terminal of the transistor; the drain terminal is coupled to an one end of the switch; a first driver that controls the switch in synchronization with a second driver that drives a gate terminal of the transistor; and a plurality of resistors coupled in series and coupled to an another end of the switch.

A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

Provided is a lighting fixture, which belongs to the technical field of display equipment detection and can be used for solving the problem that an existing lighting fixture is liable to damage a detection probe in a detection process. The lighting fixture includes a work load platform, a lifting unit and a lighting test unit, wherein the work load platform is used for loading a display panel to be subjected to lighting test; the lifting unit is connected with the lighting test unit and used for driving the lighting test unit to ascend and descend; and the lighting test unit is provided with a plurality of probes and is driven by the lifting unit to contact the probes with a circuit test point on the display panel, in order to carry out the lighting test on the display panel. The lighting fixture is intelligent, flexile and strong in adaptability.

A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.

Embodiments relate to current sensors and methods. In an embodiment, a current sensor comprises a leadframe; a semiconductor die coupled to the leadframe; a conductor comprising a metal layer on the semiconductor die, the conductor comprising at least one bridge portion and at least two slots, a first slot having a first tip and a second slot having a second tip, a distance between the first and second tips defining a width of one of the at least one bridge portion, wherein the conductor is separated from the leadframe by at least a thickness of the semiconductor die, and the thickness is about 0.2 millimeters (mm) to about 0.7 mm; and at least one magnetic sensor element arranged on the die relative to and spaced apart from the one of the at least one bridge portion and more proximate the conductor than the leadframe.

An inter-circuit board connector connects a first circuit board to a second circuit board. The inter-circuit board connector includes power pins to transmit power from the first circuit board to the second circuit board. Each power pin provides an equal amount of current from the first circuit board to the second circuit board. The inter-circuit board connector includes a current sensor to measure current on a selected number of the power pins that can be less than a total number of the power pins.

A sensor for inductively measuring the current in a conductor flowing through a recess in a printed circuit board. Wire loops on the printed circuit board function as the inductive current sensor. Combined with a voltage measurement, the energy being dissipated in the conductor's load circuit can be determined and transmitted wirelessly. Control circuits can be integrated with the metering hardware to enable the remote modulation of the load's power. The inductive sensor(s) can be used to track differences between the load's supply and return currents. If a fault is detected, the circuit can be broken for safety, serving a ground fault circuit interruption (GFCI) purpose.

A solid state impedance tuner or impedance tuner system including a housing structure and at least two solid state tuner modules electrically combined and disposed in one package within the housing structure. Each tuner module includes at least one solid state control element.

Another embodiment is directed to an impedance tuner module card configured in a standardized system architecture. The card includes a chassis board, and at least one solid state tuner module integrated on the card and supported on or by the chassis board, each module including at least one solid state control element.

Methods for calibrating a solid state impedance tuner that includes at least two solid state tuner modules combined in one package are disclosed.

Embodiments of the disclosure relate to deposition of a conformal organic material over a feature formed in a photoresist or a hardmask, to decrease the critical dimensions and line edge roughness. In various embodiments, an ultra-conformal carbon-based material is deposited over features formed in a high-resolution photoresist. The conformal organic layer formed over the photoresist thus reduces both the critical dimensions and the line edge roughness of the features.

A manufacturing method of a semiconductor device is provided with an inspecting of a semiconductor substrate by an inspection method, the method including heating the semiconductor substrate, measuring first and second characteristics. The measuring of a first characteristic is performed by bringing a plurality of probes into contact with the heated semiconductor substrate and making a first electric current flow in the semiconductor substrate. The measuring of a second characteristic is performed, after the measuring of the first characteristic, by bringing a plurality of probes into contact with the heated semiconductor substrate and making a second electric current flow in the semiconductor substrate. A number of the plurality of probes used in the measuring of the second characteristic is larger than a number of the plurality of probes used in the measuring of the first characteristic. The second electric current is larger than the first electric current.