H01P3/00

HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES, AND INTEGRATION METHODS
20230100769 · 2023-03-30 ·

An interconnect for a semiconductor device includes a laminate substrate; a first plurality of electrical devices in or on a surface of the laminate substrate; a redistribution layer having a surface disposed on the surface of the laminate substrate; a second plurality of electrical devices in or on the surface of the redistribution layer; and a plurality of transmission lines between the first plurality of electrical devices and the second plurality of electrical devices. The surface of the laminate substrate and the surface of the redistribution layer are parallel to each other to form a dielectric structure and a conductor structure.

Planar MEMS-based phase shifter having a MEMS actuator for adjusting a distance to provide a phase shift

A planar micro-electromechanical system (MEMS)-based phase shifter is described which comprises a dielectric substrate, a grounded coplanar waveguide (GCPW) transmission line for carrying input and output signals, a high-resistivity silicon (HRS) slab coated with metallic gratings over the GCPW line, and a MEMS actuator for adjusting a distance between the HRS slab and the GCPW line to provide a phase shift.

TRANSMISSION LINE STRUCTURES FOR MILLIMETER WAVE SIGNALS

A coplanar waveguide structure includes a dielectric layer disposed over at least a portion of a substrate and a planar transmission line disposed within the dielectric layer. In some instances, the planar transmission line can include a conductive signal line and one or more ground lines. In other instances, the planar transmission line may include a conductive stacked signal line and one or more stacked ground lines.

ANTENNA-ON-PACKAGE SYSTEM
20230131441 · 2023-04-27 ·

One example includes an antenna-on-package (AoP) system. The system includes a first transmission line patterned on a first metal layer. The first metal layer can be arranged to be coupled on a printed circuit board (PCB). The system also includes an antenna portion patterned on a second metal layer. The first and second metal layers can be separated by at least one dielectric layer. The system further includes a coaxial transition portion comprising a via configured to communicatively couple the first transmission line on the first metal layer to a second transmission line on the second metal layer. The second transmission line can be coupled to the antenna portion.

TRANSMISSION LINE
20230066411 · 2023-03-02 ·

A transmission line includes a substrate including insulator layers, a mounting electrode on a front layer of the substrate, a signal conductor, a first ground conductor, a first connecting electrode that electrically connects the mounting electrode and the signal conductor and is between the signal conductor and the first ground conductor in a laminating direction, a first inter-layer connecting conductor that is electrically connected between the mounting electrode and the first connecting electrode and is bonded to the first connecting electrode, and a second inter-layer connecting conductor that is electrically connected between the signal conductor and the first connecting electrode, is bonded to the first connecting electrode, and does not overlap with the first inter-layer connecting conductor when viewed in the laminating direction. The first ground conductor does not overlap with at least a portion of the first connecting electrode when viewed in the laminating direction.

Transmission line module for rotary traveling wave oscillator and design method thereof

Provided are a transmission line module for a rotary traveling wave oscillator (RTWO) and a design method thereof. The transmission line module includes a substrate. The upper surface of the substrate is provided with a grounding metal layer, that is, a metal ground. The metal ground is provided with a rectangular groove. The rectangular groove penetrates front and rear sides of the metal ground along a length direction of the rectangular groove. The thickness of the rectangular groove is the same as the thickness of the metal ground. The rectangular groove is filled with a silicon dielectric plate that has the same shape and size as the rectangular groove. The upper surface of the silicon dielectric plate is provided with two parallel transmission lines along the length direction of the rectangular groove.

Traveling wave parametric amplifier
20230163737 · 2023-05-25 ·

According to an example aspect of the present invention, there is provided a travelling wave parametric amplifier comprising a transmission line comprising therein a plurality of Josephson elements and a plurality of shunt capacitors, and wherein at least some of the shunt capacitors are dispersive capacitors comprising an open-ended, distributed transmission line.

Signal transmission line including a flexible resin laminate having interior hollow portions overlapping the signal transmission line with the hollow portions having a vent hole

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

RADIO FREQUENCY WAVEGUIDE SYSTEM NODES

A node of a radio frequency waveguide system can include a waveguide interface, a signal splitter, a power rectifier and conditioner, a communication filter, and a network processor. The waveguide interface is configured to communicate through a waveguide in the radio frequency waveguide system. The signal splitter is configured to split a radio frequency transmission received at the waveguide interface between a power path and a communications path within the node. The power rectifier and conditioner are configured to produce a conditioned power signal based on power received through the power path. The communication filter of the communications path is configured to produce a filtered communication signal. The network processor is powered by the conditioned power signal and configured to extract encoded information from the filtered communication signal.

PHASED CIRCULAR ARRAY OF PLANAR OMNIDIRECTIONAL RADIATING ELEMENTS

A phased circular array of antennas each having an omnidirectional radiation pattern are disposed on an outside surface of a planar sheet conformed to the shape of a cylinder. A plurality of coplanar waveguides includes a ground line and a signal line feeding the antennas is disposed on the outside surface of the cylinder. A signal-carrying feed network electromagnetically coupled to the coplanar waveguides is disposed on an inside surface of the cylinder which does not interfere with radiation from the antennas. An electrical ground is disposed on the outside surface of the cylinder which is connected to the ground feed of each of the coplanar waveguides and serves as a ground plane for the signal-carrying feed network. The array is configured to provide 360° beam steering around the vertical axis of the cylinder. A method of fabrication is disclosed.