A packaging structure, a method of manufacturing a packaging structure, and a quantum processor include a substrate; a coplanar waveguide including a first ground wire, a second ground wire, and a signal wire, wherein the first ground wire, the second ground wire, and the signal wire are disposed on a surface of the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire; an air bridge including a first end connected with the first ground wire and a second end connected with the second ground wire, wherein a gap exists between the air bridge and a surface of the signal wire away from the substrate; and a compensation structure located on the surface of the substrate.

A two-port dyadic radial coupler for RF communications between PCB layers is disclosed. The coupler includes an input port, an impedance matching transformer, a coaxial conductor, and at least one coupled port. The input or coupled port has an at least partially annular conducting strip axially aligned with the coaxial conductor, causing radial coupling excitation by an RF signal to couple the signal between the input port and coupled port. The coupler is configured for coupling of RF signals within a select frequency range at 0 dB attenuation. In other embodiments, the coupler is configured for frequency-selective coupling to attenuate undesired frequencies. In various embodiments, the RF signal is parasitically coupled to a plurality of coupled ports on intermediate layers of the PCB. In additional embodiments, the coupled port may be left disconnected from additional circuit elements, causing the coupler to act as an antenna.

The present invention relates to the field of communications technologies and discloses a phase shifter and a feed network. The phase shifter includes at least one phase shift component. The phase shift component includes a substrate, a microstrip coupling structure disposed on a first plane of the substrate, a microstrip transmission line connected to and coplanar with the microstrip coupling structure, and a microstrip/coplanar-waveguide coupling structure, where the microstrip/coplanar-waveguide coupling structure includes a microstrip connected to and coplanar with the microstrip transmission line, and a coplanar waveguide disposed opposite to the microstrip on the substrate and coupled with the microstrip. A phase shifter using a microstrip/coplanar-waveguide coupling structure has a small volume and costs low, thereby facilitating feed network design.

A structure of serpentine transmission line includes a first transmission line and a second transmission line. The first transmission line includes a first line segment, a second line segment and a third line segment. The second transmission line includes a fourth line segment, a fifth line segment and a sixth line segment. The first line segment, the second line segment, the fourth line segment and the fifth line segment extend along a first direction and have a first line width. The third line segment extends along a second direction and is connected to the first line segment and the second line segment. The sixth line segment extends along the second direction and is connected to the fourth line segment and the fifth line segment. Both the third line segment and the sixth line segment have a second line width. The second line width is greater than the first line width.

A structure of serpentine transmission line includes a first transmission line and a second transmission line. The first transmission line includes a first line segment, a second line segment and a third line segment. The second transmission line includes a fourth line segment, a fifth line segment and a sixth line segment. The first line segment, the second line segment, the fourth line segment and the fifth line segment extend along a first direction and have a first line width. The third line segment extends along a second direction and is connected to the first line segment and the second line segment. The sixth line segment extends along the second direction and is connected to the fourth line segment and the fifth line segment. Both the third line segment and the sixth line segment have a second line width. The second line width is greater than the first line width.

Technologies for radiofrequency optimized interconnects for a quantum processor are disclosed. In the illustrative embodiment, signals are carried in coplanar waveguides on a surface of a quantum processor die. A ground ring surrounds the signals and is connected to the ground conductors of each coplanar waveguide. Wire bonds connect the ground ring to a ground of a circuit board. The wire bonds provide both an electrical connection from the quantum processor die to the circuit board as well as increased thermal coupling between the quantum processor die and the circuit board, increasing cooling of the quantum processor die.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

A transformer balun fabricated in silicon and including a series of alternating metal layers and dielectric layers that define first and second outer conductors that are part of a coaxial structure. Each dielectric layer includes a plurality of conductive vias extending through the dielectric layer to provide electrical contact between opposing metal layers, where a top metal layer forms a top wall of each outer conductor and a bottom metal layer forms a bottom wall of each outer conductor and the other metal layers and the dielectric layers define sidewalls of the outer conductors. Inner conductors extends down both of the first and second outer conductors and a first output line is electrically coupled to a sidewall of the first outer conductor and a second output line is electrically coupled to a sidewall of the second outer conductor.

According to an example aspect of the present invention, there is provided a travelling wave parametric amplifier comprising a waveguide transmission line comprising therein at least ten Josephson elements, wherein each of the at least ten Josephson element comprises a loop, with exactly one Josephson junction of first size on one half of the loop and at least two Josephson junctions of a second size on a second half of the loop, the second size being larger than the first size, a flux bias line configured to generate a magnetic flux threading each of the at least one loop, and a set of resistors coupled with the flux bias line.

An embodiment of the invention may include a circuit structure. The circuit structure may include a wiring tree located between a feeding Josephson transmission line (FJTL) and a global bias line. The circuit may include the wiring tree having an H-tree structure, wherein each branch of the H-tree is connected by a current limiting junction of the FJTL, and wherein a single output port of the H-tree structure is connected to the global bias line. Another embodiment of the invention may include a circuit structure a circuit structure a plurality of feeding Josephson transmission lines (FJTLs) located between a feed line and a global bias line. The path of from the feed line through each FJTL and to the global bias line is substantially similar.