A system for transmitting electrical signals through a terrestrial body, the terrestrial body having an upper surface, may include a transmitter. The transmitter may include a first electrode positioned proximate the upper surface of the terrestrial body and at least one second electrode positioned beneath the upper surface of the terrestrial body and spaced from the first electrode. The system may include a power source operable to supply power to the first electrode and the at least one second electrode. The system may include a receiver assembly spaced away from the transmitter. When power is supplied to the transmitter, the transmitter may be operable to propagate an electric non-linear wave signal through the terrestrial body. The receiver assembly may be operable to detect the electric non-linear wave signal.

A waveguide includes: a substrate; a first ground wire; a second ground wire; a signal wire; and a compensation structure. The first ground wire, the second ground wire, and the signal wire are disposed on the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire. The compensation structure is configured to contact at least one of the substrate, the first ground wire, the second ground wire, or the signal wire; and the compensation structure comprises a superconducting material.

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

Disclosed is a capacitive non-directional coupler having a non-directional coupler printed circuit board (PCB) and a capacitive attenuator. The non-directional coupler PCB includes a coupler section configured to carry energy travelling on a main transmission line. The non-directional coupler PCB and the capacitive attenuator are configured as a capacitive voltage divider, and provide a sample of the energy on the main transmission line. Also disclosed is a method for measuring for measuring RF power using an RF power sensor having the capacitive non-directional coupler that includes with the non-directional coupler printed circuit board and the capacitive attenuator. Also disclosed is an RF power metering system that includes an RF power sensor having the capacitive non-directional coupler.

Disclosed is a capacitive non-directional coupler having a non-directional coupler printed circuit board (PCB) and a capacitive attenuator. The non-directional coupler PCB includes a coupler section configured to carry energy travelling on a main transmission line. The non-directional coupler PCB and the capacitive attenuator are configured as a capacitive voltage divider, and provide a sample of the energy on the main transmission line. Also disclosed is a method for measuring for measuring RF power using an RF power sensor having the capacitive non-directional coupler that includes with the non-directional coupler printed circuit board and the capacitive attenuator. Also disclosed is an RF power metering system that includes an RF power sensor having the capacitive non-directional coupler.

A quantum computing device includes multiple co-planar waveguide flux qubits, at least one coupler element arranged such that each co-planar waveguide flux qubit, of the multiple co-planar waveguide flux qubits, is operatively couplable to each other co-planar waveguide flux qubit, of the multiple co-planar waveguide flux qubits, of the quantum computing device, and a tuning quantum device, in which the tuning quantum device is in electrical contact with a first co-planar waveguide flux qubit of the plurality of co-planar waveguide flux qubits and with a second co-planar waveguide flux qubit of the plurality of co-planar waveguide flux qubits.

Methods, apparatuses, and devices for quantum chip preparation include acquiring a coplanar waveguide in a quantum chip; and establishing a connecting bridge on the coplanar waveguide using a bonding machine, wherein the connecting bridge is configured to connect a first reference ground and a second reference ground located on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency. A quantum chip includes a transmission line configured for signal transmission; and a resonant cavity coupled to the transmission line and configured to regulate an operating state of qubits on the quantum chip, wherein the transmission line and the resonant cavity are both composed of a coplanar waveguide, the coplanar waveguide is provided with a connecting bridge, and the connecting bridge is configured to connect a first reference ground and a second reference ground on two sides of the coplanar waveguide to change the chip electromagnetic resonance frequency.

A novel and useful a single layer RFIC/MMIC structure including a package and related redistribution layer (RDL) based low loss grounded coplanar transmission line. The structure includes a package molded around an RF circuit die with a single redistribution layer (RDL) fabricated on the surface thereof mounted on an RF printed circuit board (PCB) via a plurality of solder balls. Coplanar transmission lines are fabricated on the RDL to conduct RF output signals from the die to PCB signal solder balls. The signal trace transition to the solder balls are funnel shaped to minimize insertion loss and maximize RF isolation between channels. A conductive ground shield is fabricated on the single RDL and operative to shield the plurality of coplanar transmission lines. The ground shield is electrically connected to a ground plane on the PCB via a plurality of ground solder balls arranged to surround the plurality of coplanar RF transmission lines and signal solder balls, and are operative to couple the ground shield to the ground plane on the PCB and provide an electrical return path for the plurality of coplanar transmission lines. Ground vias on the printed circuit board can be either located under the ground solder balls or between them.

A packaging structure, a method of manufacturing a packaging structure, and a quantum processor include a substrate; a coplanar waveguide including a first ground wire, a second ground wire, and a signal wire, wherein the first ground wire, the second ground wire, and the signal wire are disposed on a surface of the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire; an air bridge including a first end connected with the first ground wire and a second end connected with the second ground wire, wherein a gap exists between the air bridge and a surface of the signal wire away from the substrate; and a compensation structure located on the surface of the substrate.

A radiofrequency transmission line configured so as to allow a radiofrequency electrical signal to be transmitted between a first end and a second end, the transmission line including a main conductor and a ground plane electrically connected to an electrical ground of the transmission line. The ground plane includes a set of portions that are connected in series between the first end and the second end and a set of second capacitors, the set of portions including a set of second portions, each second capacitor being inserted between two contiguous second portions.