H01P5/00

Magnetic coupling device and communication system

According to one embodiment, there is provided a magnetic coupling device including a first coil, a second coil, a third coil, a fourth coil, a first constant-potential node and a second constant-potential node. The second coil is electrically connected with one end of the first coil and wound in a direction opposite to a direction in which the first coil is wound. The third coil faces the first coil. The fourth coil faces the second coil. The first constant-potential node is electrically connected with one end of the third coil. The second constant-potential node is electrically connected with one end of the fourth coil.

ULTRA-LOW POWER OPTICALLY RECONFIGURABLE INTEGRATED MICROWAVE SWITCH ON A SILICON PHOTONIC CHIP

Microwave photonic devices use light to carry and process microwave signals over a photonic link. Light can be used as a stimulus to microwave devices that directly control microwave signals. Previous optically controlled devices suffer from large footprint, high optical power level required for switching, lack of scalability and complex integration requirements, restricting their implementation in practical microwave systems. Disclosed are monolithic optically reconfigurable integrated microwave switches (MORIMSs) built on a CMOS compatible silicon photonic chip. The disclosed scalable micrometer-scale switches provide higher switching efficiency and operate using optical power that is orders of magnitude lower than previous devices. The disclosed devices and techniques provide examples of silicon photonic platforms integrating microwave circuitry.

Microelectronic package communication using radio interfaces connected through wiring

Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

Side Mounting of MEMS Microphones on Tapered Horn Antenna
20200328495 · 2020-10-15 · ·

Disclosed herein are implementations of devices and methods for side mounting of microelectromechanical systems (MEMS) transducers on tapered horn antennae. A hole may be made in a sidewall of a tapered horn antenna, where the hole may be substantially cylindrical, tapered and the like. In an implementation, an internal port opening of a MEMS microphone may be aligned with the hole and attached to the sidewall of the tapered horn antenna. In an implementation, the hole may be tapered with a diameter at one end the same or slightly larger than the diameter of the port opening of the MEMS microphone and a larger diameter at another end of the hole. In an implementation, a tube may be used to connect the internal port opening of the MEMS antenna to the hole in the tapered horn antenna. In an implementation, the tapered horn antenna may have multiple holes, each having its respective MEMS transducer.

Side mounting of MEMS microphones on tapered horn antenna
10804591 · 2020-10-13 · ·

Disclosed herein are implementations of devices and methods for side mounting of microelectromechanical systems (MEMS) transducers on tapered horn antennae. A hole is made in a sidewall of a tapered horn antenna, where the hole is substantially cylindrical, tapered and the like. In an implementation, an internal port opening of a MEMS microphone is aligned with the hole and attached to the sidewall of the tapered horn antenna. In an implementation, the hole is tapered with a diameter at one end, either the same or slightly larger than the diameter of the port opening of the MEMS microphone and a larger diameter at another end of the hole. In an implementation, a tube is used to connect the internal port opening of the MEMS antenna to the hole in the tapered horn antenna. In an implementation, the tapered horn antenna may have multiple holes, each having its respective MEMS transducer.

Cavity type wireless frequency filter having cross-coupling notch structure
10777869 · 2020-09-15 · ·

The present invention relates to a cavity type wireless frequency filter having a cross-coupling notch structure, the filter comprising a notch substrate provided for cross-coupling between at least two resonance elements among a plurality of resonance elements, wherein the notch substrate comprises: a main substrate, which is made of a non-conductive material and has the first and second coupling structures mechanically coupled with at least two resonance elements, respectively; and a conductive line which is implemented by a conductive pattern formed on the main substrate and transfers a signal of a first resonance element to a second resonance element by using a non-contact coupling method.

EXCITATION AND USE OF GUIDED SURFACE WAVE MODES ON LOSSY MEDIA
20200287264 · 2020-09-10 ·

Disclosed are various embodiments for exciting a guided surface waveguide probe to create a plurality of resultant fields that are substantially mode-matched to a Zenneck surface wave mode of a surface of a lossy conducting medium and embodiments for receiving energy from a Zenneck surface wave launched on the lossy conducting medium.

EXCITATION AND USE OF GUIDED SURFACE WAVE MODES ON LOSSY MEDIA
20200287264 · 2020-09-10 ·

Disclosed are various embodiments for exciting a guided surface waveguide probe to create a plurality of resultant fields that are substantially mode-matched to a Zenneck surface wave mode of a surface of a lossy conducting medium and embodiments for receiving energy from a Zenneck surface wave launched on the lossy conducting medium.

Through glass integrated antenna

A system for radio frequency transmission through a window is provided. The system may include a first wireless coupler, a second wireless coupler, and one or more antennas. The first wireless coupler may be attached to a first side of the window and configured to transmit or receive radio frequency signals. The second wireless coupler attached to a second side of the window and aligned with the first wireless coupler. The first wireless coupler may be configured to transmit or receive the radio frequency signals from the first wireless coupler to the second wireless coupler through the window. The one or more antennas may be electrically connected to the second wireless coupler. One or more radios may transmit or receive the radio frequency signals to or from the one or more antennas.

Through glass integrated antenna

A system for radio frequency transmission through a window is provided. The system may include a first wireless coupler, a second wireless coupler, and one or more antennas. The first wireless coupler may be attached to a first side of the window and configured to transmit or receive radio frequency signals. The second wireless coupler attached to a second side of the window and aligned with the first wireless coupler. The first wireless coupler may be configured to transmit or receive the radio frequency signals from the first wireless coupler to the second wireless coupler through the window. The one or more antennas may be electrically connected to the second wireless coupler. One or more radios may transmit or receive the radio frequency signals to or from the one or more antennas.