H01P7/00

Transmission line and electronic component

A transmission line is provided with a line portion with a first relative permittivity which is composed of a first dielectric and a conductor filler dispersed in the first dielectric, and a surrounding dielectric portion composed of a second dielectric with a second relative permittivity, wherein, the surrounding dielectric portion exists around the line portion in a cross section perpendicular to a direction in which electromagnetic waves transmit in the line portion, the first relative permittivity is 600 or more, and the second relative permittivity is smaller than the first relative permittivity. An electronic component has the transmission line. Further, an electronic component is provided with a resonator having a resonant frequency ranging from 1 GHz to 10 GHz, wherein, the resonator is formed by using the transmission line.

Dense out of plane interconnect inside hermetically sealed modules

A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.

Metamaterial
09614289 · 2017-04-04 · ·

A cell forming a metamaterial, comprises a patch conductor, a conductor layer arranged in parallel with the patch conductor, and a connection conductor configured to electrically connect the patch conductor and the conductor layer. The connection conductor forms a helical electrical path by a plurality of conductor lines and a plurality of vias which connect the conductor lines to the patch conductor and the conductor layer.

DENSE OUT OF PLANE INTERCONNECT INSIDE HERMETICALLY SEALED MODULES
20170086311 · 2017-03-23 ·

A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.

Dielectric line and electronic component

A dielectric line includes a line portion and a surrounding dielectric portion. The line portion is formed of a first dielectric having a first relative permittivity. The surrounding dielectric portion is formed of a second dielectric having a second relative permittivity. The line portion propagates one or more electromagnetic waves of one or more frequencies within the range of 1 to 10 GHz. In a cross section orthogonal to the direction of propagation of the one or more electromagnetic waves through the line portion, the surrounding dielectric portion is present around the line portion. The first relative permittivity is 1,000 or higher. The second relative permittivity is lower than the first relative permittivity.

GLOBAL ELECTRICAL POWER MULTIPLICATION
20170077575 · 2017-03-16 ·

Various examples are provided for global electrical power multiplication. In one example, a global power multiplier includes first and second guided surface waveguide probes separated by a distance equal to a quarter wavelength of a defined frequency and configured to launch synchronized guided surface waves along a surface of a lossy conducting medium at the defined frequency; and at least one excitation source configured to excite the first and second guided surface waveguide probes at the defined frequency, where the excitation of the second guided surface waveguide probe at the defined frequency is 90 degrees out of phase with respect to the excitation of the first guided surface waveguide probe. In another example, a method includes launching synchronized guided surface waves along a surface of a lossy conducting medium by exciting first and second guided surface waveguide probes to produce a traveling wave propagating along the surface.

GLOBAL ELECTRICAL POWER MULTIPLICATION
20170077575 · 2017-03-16 ·

Various examples are provided for global electrical power multiplication. In one example, a global power multiplier includes first and second guided surface waveguide probes separated by a distance equal to a quarter wavelength of a defined frequency and configured to launch synchronized guided surface waves along a surface of a lossy conducting medium at the defined frequency; and at least one excitation source configured to excite the first and second guided surface waveguide probes at the defined frequency, where the excitation of the second guided surface waveguide probe at the defined frequency is 90 degrees out of phase with respect to the excitation of the first guided surface waveguide probe. In another example, a method includes launching synchronized guided surface waves along a surface of a lossy conducting medium by exciting first and second guided surface waveguide probes to produce a traveling wave propagating along the surface.

ARCHITECTURE FOR COUPLING QUANTUM BITS USING LOCALIZED RESONATORS

A technique relates a superconducting microwave cavity. An array of posts has different heights in the cavity, and the array supports a localized microwave mode. The array of posts includes lower resonant frequency posts and higher resonant frequency posts. The higher resonant frequency posts are arranged around the lower resonant frequency posts. A first plate is opposite a second plate in the cavity. One end of the lower resonant frequency posts is positioned on the second plate so as to be electrically connected to the second plate. Another end of the lower resonant frequency posts in the array is open so as not to form an electrical connection to the first plate. Qubits are connected to the lower resonant frequency posts in the array of posts, such that each of the qubits is physically connected to one or two of the lower resonant frequency posts in the array of posts.

RESONANCE ELEMENT, A ONE-PIECE RESONANCE MEMBER AND A CAVITY FILTER
20250079681 · 2025-03-06 ·

The present disclosure relates to a resonance element for a cavity filter, the resonance element made of a metal sheet and comprising a planar portion to be positioned facing a first inner side of a resonance cavity of the cavity filter and an elongate supporting portion extending from the planar portion towards the second inner side of the resonance cavity opposite to the first inner side and connected therewith in a grounding state, wherein the planar portion is configured to be substantially in an E-shape, an F-shape, an L-shape or a T-shape when viewed along a direction perpendicular to a plane of the planar portion. The present disclosure also relates to a one-piece resonance member comprising the above resonance element and a cavity filter comprising the above-said resonance element and/or the above-said one-piece resonance member.

RESONANCE ELEMENT, A ONE-PIECE RESONANCE MEMBER AND A CAVITY FILTER
20250079681 · 2025-03-06 ·

The present disclosure relates to a resonance element for a cavity filter, the resonance element made of a metal sheet and comprising a planar portion to be positioned facing a first inner side of a resonance cavity of the cavity filter and an elongate supporting portion extending from the planar portion towards the second inner side of the resonance cavity opposite to the first inner side and connected therewith in a grounding state, wherein the planar portion is configured to be substantially in an E-shape, an F-shape, an L-shape or a T-shape when viewed along a direction perpendicular to a plane of the planar portion. The present disclosure also relates to a one-piece resonance member comprising the above resonance element and a cavity filter comprising the above-said resonance element and/or the above-said one-piece resonance member.