A microstrip circulator includes a carrier and a ferrite slab having a first side and a second side. The circulator further includes a first microwave epoxy positioned between the carrier and the first side of the ferrite slab. The circulator further includes a conductor having a center portion with three legs extending therefrom. The circulator further includes a second microwave epoxy positioned between the second side of the ferrite slab and the conductor. The circulator further includes an insulator and a third microwave epoxy positioned between the conductor and the insulator. The circulator further includes a magnet and a fourth epoxy positioned between the insulator and the magnet.

A semiconductor device includes a first transmission line and a second transmission line. The semiconductor device further includes a high-k dielectric material between the first transmission line and the second transmission line, wherein the high-k dielectric material surrounds the second transmission line. The semiconductor device further includes a dielectric material directly contacting the high-k dielectric material, wherein the dielectric material has a different dielectric constant from the high-k dielectric material, and the dielectric material is separated from the first transmission line and the second transmission line.

A waveguide launch includes a first substrate having a first electrically insulating layer having first and second faces, an internal waveguide extending through the first electrically insulating layer, the internal waveguide being defined by an electrically conductive internal waveguide side wall, and, first and second electrically conductive layers in electrical contact with the internal waveguide side wall, and an electrically conductive probe launch. The waveguide launch also includes a second substrate having a second electrically insulating layer having third and fourth faces, a backshort recess arranged within the second electrically insulating layer, a third electrically conductive layer on the third face, and, an interconnection waveguide extending between the first and third faces.

A multilayer electronic component includes an element body including a plurality of base layers stacked in a first direction, an inner conductor disposed in the element body, and a mounting terminal connected to the inner conductor. The multilayer electronic component has a mount surface positioned on a mounted side when the multilayer electronic component is mounted. The mount surface is disposed so as not to intersect an axis along the first direction. The mounting terminal is disposed on the mount surface and embedded from the mount surface into the element body.

A method and apparatus is presented. A structure having an interior channel is formed using additive manufacturing equipment. A viscous media containing abrasive particles is sent through the interior channel using abrasive flow machining equipment to form a desired surface roughness for the interior channel.

The first member and the second member include, when a line that connects a first port and a second port is denoted by a reference line, a first groove that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove that connects one end of the first groove and the first port; a third groove that connects the other end of the first groove and the first port and has a shape that is line symmetrical to the second groove with respect to the reference line; a fourth groove that connects the other end (FN2) of the first groove and the second port; and a fifth groove that connects one end (FN1) of the first groove and the second port and has a shape that is line symmetrical to the fourth groove with respect to the reference line.

The first member and the second member include, when a line that connects a first port and a second port is denoted by a reference line, a first groove that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove that connects one end of the first groove and the first port; a third groove that connects the other end of the first groove and the first port and has a shape that is line symmetrical to the second groove with respect to the reference line; a fourth groove that connects the other end (FN2) of the first groove and the second port; and a fifth groove that connects one end (FN1) of the first groove and the second port and has a shape that is line symmetrical to the fourth groove with respect to the reference line.

A power combiner/divider includes a main conductor; a ground conductor radially exterior of the main conductor; an input connector having a center conductor electrically coupled to the main conductor and having a second conductor electrically coupled to the ground conductor; a conductive cylinder including an inner cylindrical surface radially exterior of and spaced apart from the main conductor, including an outer cylindrical surface; a second ground conductor radially exterior of the outer cylindrical surface of the conductive cylinder, a gap being defined between the second ground conductor and the outer surface of the conductive cylinder; a plurality of output connectors, the output connectors having center conductors electrically coupled to the conductive cylinder and having respective second conductors electrically coupled to the second ground conductor; and means for receiving and retaining a gas inside the divider/combiner. Methods of manufacturing are also disclosed.

A transmission line design includes a first transmission line configured to transfer at least one first signal. The transmission line design further includes a second transmission line configured to transfer at least one second signal, wherein the second transmission line is spaced from the first transmission line. The transmission line design further includes a high-k dielectric material between the first transmission line and the second transmission line. The transmission line design further includes a dielectric material surrounding the high-k dielectric material, the first transmission line and the second transmission line, wherein the dielectric material is different from the high-k dielectric material.

Lower-limit frequency reflection characteristics of a horn antenna are improved even though element spacing, of less than or equal to one wavelength, is a spacing at which grating lobes do not occur in an antenna radiation pattern. The horn antenna includes a horn antenna and a conductor grid that divides an aperture A of the horn antenna in a grid pattern and that electrically connects to an inner surface of the horn antenna at the aperture A of the horn antenna. Width of the conductor grid in a direction orthogonal to a horn antenna aperture plane differs from electrical length of the path of the horn antenna of the conductor grid portion at the frequency of power supplied to the horn antenna.