Embodiments of the present disclosure perform incisions along the direction of the long axis of the waveguide, thereby exposing a trench structure which can be readily plated. Once divided and plated, the individual cut pieces can then be secured together to restore the original waveguide structure. In this fashion, multiple cut pieces can be secured together and used as “building blocks” to create a modular solution which can be used to provide a number of different customizable waveguide structures. Thus, embodiments of the present disclosure perform plating procedures in a less expensive manner while achieving the benefits of ganged waveguide structures. Moreover, embodiments of the present disclosure offer a modular approach to ganged waveguide design thereby allowing for end-user flexibility in testing.

A dielectric resonator, an assembly method thereof and a dielectric filter enable are provided. The dielectric resonator includes the dielectric resonant column, the metal cavity, a sealing cover plate and a tuning screw, wherein the dielectric resonant column is located in the metal cavity, the sealing cover plate is located on an upper end face of the metal cavity, and the tuning screw is located on the sealing cover plate. The dielectric resonator also includes an insulating fixed module located between the lower end face of the sealing cover plate and the upper end face of the dielectric resonant column, and the insulating fixed module is high enough to ensure that a pressure is formed between the sealing cover plate and the dielectric resonant column, so that the dielectric resonant column is fixed at the bottom of the metal cavity.

An apparatus includes a top conductive layer of on an integrated circuit waveguide filter and a bottom conductive layer. The top and bottom conductive layers are coupled via a plurality of couplers that form an outline of the waveguide filter. A dielectric substrate layer is disposed between the top conductive layer and the bottom conductive layer of the integrated circuit waveguide filter. The dielectric substrate layer has a relative permittivity, εr that affects the tuning of the integrated circuit waveguide filter. At least one tunable via includes a tunable material disposed within the dielectric substrate layer and is coupled to a set of electrodes. The set of electrodes enable a voltage to be applied to the tunable material within the tunable via to change the relative permittivity of the dielectric substrate layer and to enable tuning the frequency characteristics of the integrated circuit waveguide filter.

The present invention relates to a dielectric ceramic filter including a dielectric block filled with a ceramic material and having an outer surface surrounded by a metal component, a resonance part provided in the dielectric block, having a space having a circular horizontal cross-section, and separated from the dielectric block by a metal film, and a tuning cover coupled to the dielectric block, configured to cover one side of the resonance part, and positioned at a portion corresponding to the resonance part, the tuning cover being configured to tune a frequency of the resonance part by being deformed in shape corresponding to a space of the resonance part, thereby increasing a production yield and implementing a high Q value when the volume remains the same.

A method for manufacturing a radio frequency (RF) applicator which includes covering a ceramic insert with a coating, wherein the ceramic insert has dimensions that substantially match an internal volume of an open-ended, hollow waveguide, and wherein the ceramic insert has a recess therein configured to accept a radio frequency emitter, heating the waveguide to a temperature that is above a melting point of the coating, placing the coated ceramic insert into the internal volume of the heated waveguide, wherein the internal volume is completely filled except for the recess, and cooling the waveguide, ceramic insert, and coating to a temperature below the melting point of the coating so that the coating solidifies and fills gaps between facing surfaces of the insert and the waveguide.

The dielectric resonator includes a sealing cover, a dielectric resonant column, a metal cavity, and an electrically-conductive elastic structure body. The dielectric resonant column is located within the metal cavity, wherein the sealing cover is connected to an upper surface of the dielectric resonant column. The sealing cover is located at the upper end face of the metal cavity and is configured to seal the metal cavity. The metal cavity is provided with a groove at the bottom. The electrically-conductive elastic structure body is located within the groove and is configured to support the dielectric resonant column. The depth of the groove causes a lower surface of the dielectric resonant column to be lower than an inner bottom surface of the metal cavity after the sealing cover seals the metal cavity. A lower end face of the dielectric resonant column is in contact with the electrically-conductive elastic structure body.

A transmission line RF applicator apparatus and method for coupling RF power to a plasma in a plasma chamber. The apparatus comprises two conductors, one of which has a plurality of apertures. In one aspect, apertures in different portions of the conductor have different sizes, spacing or orientations. In another aspect, adjacent apertures at successive longitudinal positions are offset along the transverse dimension. In another aspect, the apparatus comprises an inner conductor and one or two outer conductors. The main portion of each of the one or two outer conductors includes a plurality of apertures that extend between an inner surface and an outer surface of the outer conductor.

Techniques for forming highly stretchable electronic interconnect devices are disclosed herein. In one embodiment, a method of fabricating an electronic interconnect device includes forming a layer of an adhesion material onto a surface of a substrate material capable of elastic and/or plastic deformation. The formed layer of the adhesion material has a plurality of adhesion material portions separated from one another on the surface of the substrate material. The method also includes depositing a layer of an interconnect material onto the formed layer of the adhesion material. The deposited interconnect material has regions that are not bonded or loosely bonded to corresponding regions of the substrate material, such that the interconnect material may be deformed more than the adhesion material attached to the substrate material. In certain embodiments, the interconnect material can also include a plurality of wrinkles on a surface facing away from the substrate material.

An electronic stripline circuit includes a flexible dielectric film having a three-dimensional coiled shape that defines a spiraled inner core. At least one electrically conductive signal trace is formed on a first surface of the flexible dielectric film. The signal trace extends along a signal path to define a trace length configured to control a time delay of a coiled time delay unit.

An optical modulator for switching an optical signal of wavelength λ from one waveguide-electrode to another requires that both waveguide-electrodes be made of an electrically conducting material. Also, a non-conducting cross-coupling material fills a slot along a length L between the waveguide-electrodes. Importantly, cross-coupling material in the slot provides a separation distance x.sub.c between the waveguide-electrodes that is less than 0.35 microns. When a switching voltage V.sub.π is selectively applied to the waveguide-electrodes, a strong uniform electric field E is created within the cross-coupling material. Thus, E modulates the cross-coupling length of the optical signal by an increment ±Δ each time it passes back and forth through the cross-coupling material along the length L. Thus, after an N number of cross-coupling length cycles along the length L, when NΔ equals one cross-coupling length, the optical signal is switched from one waveguide-electrode to the other.