A waveguide flange adapter includes a plate; an aperture positioned through the plate; and a plurality of holes arranged in a pattern in the plate and around the aperture. The plate is configured to operatively connect a first waveguide to a second waveguide such that the first waveguide and the second waveguide have a different pattern of holes on the waveguide flanges to one another. The pattern of the plurality of holes may be configured to align with connecting holes in each of the first waveguide and the second waveguide. At least some of the plurality of holes may extend through an entire thickness of the plate. The plate may include electrically-conductive material. The size and shape of the aperture may be complementary to a size and shape of each of the first waveguide and the second waveguide. At least some of the plurality of holes may be tapped or untapped.

The present invention relates to a cavity filter and a method of manufacturing the same, and particularly, to a cavity filter including one side cavity and the other side cavity required to have capacitive cross-coupling design, resonant bars respectively provided at centers of one side cavity and the other side cavity, and a vertical post for a notch extending from any one of the resonant bars and extending in a vertical direction in an inner wall that is a boundary between one side cavity and the other side cavity, in which the resonant bar, which is connected to the vertical post for a notch among the resonant bars, is integrated with the vertical post for a notch, thereby providing an advantage of easily manufacturing the cavity filter and easily performing capacitive cross-coupling design.

A filter that can make a reflection delay of an initial stage coupling part correspond to a change in a passband due to a manufacturing error of a substrate or the like is realized. A filter according to an example embodiment includes: a substrate having a dielectric property; an initial stage coupling part formed on the substrate; and an interstage coupling part formed on the substrate. The initial stage coupling part is formed so that a reflection delay is decreased in accordance with an increase in a passband due to a manufacturing error of the substrate or the interstage coupling part, or so that the reflection delay is increased in accordance with a decrease in the passband.

A complementary metal-oxide-semiconductor (CMOS) device includes a metal oxide layer comprising anodic aluminum oxide (AAO) and one or more nanowires (NW) of an electrically conducting material each formed within a corresponding pore extending through the AAO from a first side of the layer to a second side of the layer opposite the first side, a first electrically conducting layer disposed on the first side of the metal oxide layer, and a second electrically conducting layer disposed on the second side of the metal oxide layer. The nanowires form a via electrically connecting first electrically conducting layer and the second electrically conducting layer.

A method for forming anodic aluminum oxide (AAO) on a substrate includes disposing an Al layer on the substrate, there being a Cu layer between the substrate and the Al layer, and a TiW alloy layer between and in contact with the Cu layer and the Al layer, anodizing the Al layer to provide an AAO layer comprising nanopores extending into the AAO layer to a barrier layer of the AAO at a base of each nanopore and converting at least some of the TiW alloy layer to TiW oxide, over-anodizing the barrier layer to remove at least a portion of the AAO of the barrier layer at the base of each nanopore, and exposing the AAO layer, the TiW oxide, and the TiW to a chemical etchant sufficient to extend the nanopores through the AAO layer to a surface of the Cu layer.

The disclosure describes a magnetic circuit assembly that includes a magnet assembly and an excitation ring. The magnet assembly defines an input axis and includes a pole piece and a magnet underlying the pole piece. The excitation ring includes a base and an outer ring positioned around the magnet assembly. The base includes a platform layer underlying the magnet and a base layer underlying the platform layer. The outer ring overlies the base layer. An inner portion of the outer ring faces the magnet assembly and an outer portion of the outer ring is configured to couple to an outer radial portion of a proof mass assembly. The pole piece and the platform layer include a high magnetic permeability material.

The disclosure describes a magnetic circuit assembly that includes a magnet assembly and an excitation ring. The magnet assembly defines an input axis and includes a pole piece and a magnet underlying the pole piece. The excitation ring includes a base and an outer ring positioned around the magnet assembly. The base includes a platform layer underlying the magnet and a base layer underlying the platform layer. The outer ring overlies the base layer. An inner portion of the outer ring faces the magnet assembly and an outer portion of the outer ring is configured to couple to an outer radial portion of a proof mass assembly. The pole piece and the platform layer include a high magnetic permeability material.

A high-frequency line substrate is mounted on a printed circuit board. The printed circuit board includes a first high-frequency line. The high-frequency line substrate includes a second high-frequency line and lead pins that connect the first high-frequency line and the second high-frequency line. At the contact portions between the signal lead pins and the second high-frequency line of the high-frequency line substrate, and at the contact portions between the ground lead pins and the second high-frequency line of the high-frequency line substrate, the height of the ground lead pins from an upper surface of the printed circuit board is greater than the height of the signal lead pins.

A coplanar waveguide structure includes a dielectric layer disposed over at least a portion of a substrate and a planar transmission line disposed within the dielectric layer. In some instances, the planar transmission line can include a conductive signal line and one or more ground lines. In other instances, the planar transmission line may include a conductive stacked signal line and one or more stacked ground lines.

Provided is a resin composition for laser direct structuring on which a plating can be formed and demonstrating low loss tangent, a molded article, and, a method for manufacturing a plated molded article. The resin composition for laser direct structuring contains a polycarbonate resin and a laser direct structuring additive, and the polycarbonate resin containing 5% by mass or more, relative to all structural units, of a structural unit represented by formula (1). In formula (1), each of R.sup.1 and R.sup.2 independently represents a hydrogen atom or a methyl group, and W.sup.1 represents a single bond or a divalent group).

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