Patent classifications
H01Q17/00
SURFACE WAVE TRANSMISSION DEVICE WITH RF HOUSING AND METHODS FOR USE THEREWITH
A transmission device includes a coupler configured to convert a transmit signal to transmitted guided electromagnetic waves that propagate along a surface of a transmission medium without requiring an electrical return path, the coupler further configured to convert to a receive signal, received guided electromagnetic waves that propagate along the surface of the transmission medium without requiring an electrical return path. A housing is configured to provide environmental protection to the coupler. The housing includes an aperture section configured to pass the transmitted guided electromagnetic waves from the coupler through an aperture side of the housing, the aperture section further configured to pass the received guided electromagnetic waves to the coupler through the aperture side of the housing. The housing also includes a non-aperture section configured to absorb radio frequency (RF) signals in a frequency range of the transmit signal and a frequency range the receive signal.
IMPEDANCE MATCHING FILM FOR RADIO WAVE ABSORBER, IMPEDANCE MATCHING FILM-ATTACHED FILM FOR RADIO WAVE ABSORBER, RADIO WAVE ABSORBER, AND LAMINATE FOR RADIO WAVE ABSORBER
An impedance matching film 10 includes a metallic element and a non-metallic element. The impedance matching film 10 has a thickness of 10 to 200 nm. The impedance matching film 10 has a sheet resistance of 200 Ω/□ or more. In the impedance matching film 10, the content of an oxygen atom is less than 50% in terms of the number of atoms.
Differential segmented aperture
A radio frequency (RF) aperture includes an interface printed circuit board. An array of electrically conductive tapered projections have bases disposed on a front side of the interface printed circuit board and extend away from the front side of the interface printed circuit board. Chip baluns are mounted on the back side of the interface printed circuit board. Each chip balun has a balanced port electrically connected with two neighboring electrically conductive tapered projections via electrical feedthroughs passing through the interface printed circuit board. Each chip balun further has an unbalanced port, and RF circuitry disposed at the back side of the interface printed circuit board is electrically connected with the unbalanced ports of the chip baluns. The electrically conductive tapered projections include dielectric tapered projections and an electrically conductive layer disposed on an inner or outer surface of the dielectric tapered projections.
Optically transparent radar absorbing material (RAM)
An optically transparent radar absorbing material has alternating layers of optically transparent conductive material with layers of even thickness of optically transparent material having a homogenous dielectric constant. The even thickness is one quarter of the wavelength of a targeted electromagnetic energy.
Optically transparent radar absorbing material (RAM)
An optically transparent radar absorbing material has alternating layers of optically transparent conductive material with layers of even thickness of optically transparent material having a homogenous dielectric constant. The even thickness is one quarter of the wavelength of a targeted electromagnetic energy.
ANTENNA COMPONENT AND COMMUNICATION DEVICE
An antenna component is provided. An orthographic projection of auxiliary antennas on a clearance area is entirely located in, partly located in, or close to a radiation-sensitive area where a specific absorption ratio (SAR) value of a frequency band needs to be reduced, so that a signal emitted from the radiation-sensitive area where the SAR value of the frequency band needs to be reduced on a primary antenna may be absorbed by the auxiliary antennas, and the auxiliary antennas generate secondary radiation.
NOISE REDUCTION IN AN ULTRA-WIDEBAND (UWB) RADAR
An ultra-wideband (UWB) system includes an enclosure, and an ultra-wideband (UWB) transmitter array within the enclosure, the UWB transmitter array having a transmitter component that transmits electromagnetic waves toward a region-of-interest (ROI), the UWB array having a receiver component that receives reflected electromagnetic waves from objects in the ROI and generates object data. The system further includes a radar absorbing material positioned to receive electromagnetic waves transmitted from the transmitter component that are not directed toward the ROI, and a pattern recognition device having a processor configured to process the electromagnetic waves reflected from the ROI and to determine whether an object-of-interest (OOI) pattern is recognized within the object data.
ANTENNA ARRAY FOR 5G COMMUNICATIONS, ANTENNA STRUCTURE, NOISE-SUPPRESSING THERMALLY CONDUCTIVE SHEET, AND THERMALLY CONDUCTIVE SHEET
The disclosure aims at providing an antenna array for 5G communications that has superior thermal dissipation and crosstalk suppression effect. To achieve the above-described object, an antenna array 1 for 5G communications according to the disclosure includes a substrate 10; at least one high-frequency semiconductor device 20, a noise-suppressing thermally conductive sheet 20, and a first thermal dissipation member 41 sequentially formed on one surface 10a of the substrate 10; and at least one antenna 50 and a second thermal dissipation member 42 sequentially formed on the other surface 10b of the substrate 10.
RADIO FREQUENCY APPARATUS AND METHOD FOR ASSEMBLING RADIO FREQUENCY APPARATUS
Embodiments provide a radio frequency apparatus including a radome, an absorber, and a radio frequency circuit board that may be used for millimeter wave radar of an intelligent automobile to reduce high-frequency radiation interference from a radio frequency chip and an antenna feeder.
RADIO FREQUENCY APPARATUS AND METHOD FOR ASSEMBLING RADIO FREQUENCY APPARATUS
Embodiments provide a radio frequency apparatus including a radome, an absorber, and a radio frequency circuit board that may be used for millimeter wave radar of an intelligent automobile to reduce high-frequency radiation interference from a radio frequency chip and an antenna feeder.