An antenna arrangement having a stacked layered structure. The antenna arrangement including a radiation layer having a surface. The surface is delimited by a surface boundary. A first and a second slot extend along a first slot axis and second slot axis, respectively, and are arranged on the surface. The antenna arrangement also includes a distribution layer facing the radiation layer. The distribution layer is arranged to distribute a radio frequency signal to the first and second slots. The distribution layer includes a distribution layer feed and a ridge arranged to form a first ridge waveguide intermediate the distribution layer and the radiation layer. The ridge includes a first section connected to a second section via a curved section. The first section extends along a first ridge axis and the second section extends along a second ridge axis different from the first ridge axis.

Systems according to the present disclosure provide one or more surfaces that function as power transferring surfaces for which at least a portion of the surface includes or is composed of “fractal cells” placed sufficiently closed close together to one another so that a surface (plasmonic) wave causes near replication of current present in one fractal cell in an adjacent fractal cell. A fractal of such a fractal cell can be of any suitable fractal shape and may have two or more iterations. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission.

Systems according to the present disclosure provide one or more surfaces that function as power transferring surfaces for which at least a portion of the surface includes or is composed of “fractal cells” placed sufficiently closed close together to one another so that a surface (plasmonic) wave causes near replication of current present in one fractal cell in an adjacent fractal cell. A fractal of such a fractal cell can be of any suitable fractal shape and may have two or more iterations. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission.

In an embodiment, a 3D-printed electrical structure such as an electromagnetic bandgap is provided. The structure includes a dielectric material with an embedded electrical interconnect that functions like a via and electrically connects a first surface of the dielectric material with a second surface of the dielectric material such as a ground plane. Unlike conventional vias, the embedded interconnect is not limited to straight lines and can take a variety of shapes and paths in the dielectric material allowing for the electrical interconnect to have a longer length than the thickness of the dielectric material. Increasing the length of the electrical interconnect increases the inductance of the electrical interconnect which in turn increases the bandwidth and reduces the frequency of the electrical structure without an increase in the height of the dielectric material.

A radar apparatus includes a board, a high-frequency integrated circuit mounted to the board, a metallic housing arranged to face the high-frequency integrated circuit, and a radio-absorbing and heat-dissipating unit. The radio-absorbing and heat-dissipating unit includes a radio-absorbing and heat-dissipative gel. The radio-absorbing and heat-dissipating unit is configured to cover at least part of the high-frequency integrated circuit and to be in contact with the metallic case.

An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment. An electromagnetic wave absorption film 10 has: a planar base 20; a first electromagnetic wave absorption pattern 1 formed on the base 20; a second electromagnetic wave absorption pattern 2 formed on the base 20; and a third electromagnetic wave absorption pattern 3 formed on the base 20, wherein when A [GHz] is defined as a frequency at which an absorption amount of an electromagnetic wave absorbed by the first electromagnetic wave absorption pattern 1 exhibits its local maximum value in a range from 20 to 110 GHz, B [GHz] satisfies Expression (1), B [GHz] being the value of a frequency at which an absorption amount of an electromagnetic wave absorbed by the second electromagnetic wave absorption pattern 2 exhibits its local maximum value, and C [GHz] satisfies Expression (2), C [GHz] being the value of a frequency at which an absorption amount of an electromagnetic wave absorbed by the third electromagnetic wave absorption pattern 3 exhibits its local maximum value,
1.037×A≤B≤1.30×A  Expression (1)
0.60×A≤C≤0.963×A  Expression (2).

A radio wave absorber including: a support; and a linear absorber that is disposed on at least one surface of the support, has an occupancy per unit volume on the support of 0.05 to 0.70, includes a radio wave absorption material and a binder, and has a maximum length on a cross section perpendicular to a longitudinal direction of 25% or less of a wavelength of the radio wave, and a manufacturing method thereof.

A radio wave absorber including: a support; and a linear absorber that is disposed on at least one surface of the support, has an occupancy per unit volume on the support of 0.05 to 0.70, includes a radio wave absorption material and a binder, and has a maximum length on a cross section perpendicular to a longitudinal direction of 25% or less of a wavelength of the radio wave, and a manufacturing method thereof.

An apparatus includes an isolation barrier configured to absorb electromagnetic energy. The isolation barrier includes multiple layers stacked on one another. Each of the multiple layers includes at least one dielectric material, at least one thin-film resistive material carried by the at least one dielectric material, and conductive strips in electrical contact with the at least one thin-film resistive material. The isolation barrier also includes vias through the multiple layers. Multiple ones of the vias are positioned along each of the conductive strips, and the vias electrically couple the conductive strips in the multiple layers to one another. The isolation barrier is configured to guide the electromagnetic energy through the multiple layers to enable absorption of the electromagnetic energy by the at least one thin-film resistive material.

An apparatus includes an isolation barrier configured to absorb electromagnetic energy. The isolation barrier includes multiple layers stacked on one another. Each of the multiple layers includes at least one dielectric material, at least one thin-film resistive material carried by the at least one dielectric material, and conductive strips in electrical contact with the at least one thin-film resistive material. The isolation barrier also includes vias through the multiple layers. Multiple ones of the vias are positioned along each of the conductive strips, and the vias electrically couple the conductive strips in the multiple layers to one another. The isolation barrier is configured to guide the electromagnetic energy through the multiple layers to enable absorption of the electromagnetic energy by the at least one thin-film resistive material.