An electronic device is provided. An electronic device includes a radio frequency integrated circuit (RFIC) chip, and an antenna array electrically connected to the RFIC chip, the antenna array including a first face and a second face facing each other in a first direction, and a third face and a fourth face connecting the first and second faces to each other and facing each other in a second direction intersecting the first direction, the antenna array including a plurality of substrates sequentially stacked in a third direction intersecting a plane defined by the first and second directions, first and second antenna modules on the plurality of substrates and sequentially arranged along the first direction, a first metal partition-wall including at least one metal via extending through the plurality of substrates in the third direction, and a second metal partition-wall surrounding the first to fourth faces.

The phased array antenna system is described. The phased array antenna system formed on one or more layers of a printed circuit board (PCB). The phased array antenna system be may include a beam forming network to convert between one or more element signals and a beam signal. The phased array antenna system may include one or more control circuits, where each control circuit may receive the element signals for corresponding antenna element. Each of the control circuits may further may establish a control signal path and an element signal path between the antenna elements and the beamforming network, where the signal path may carry multiplexed element and control signals. The control circuits may include a signal adjustment circuit that may adjust the corresponding element signal (e.g., in phase or amplitude) based on the control signal.

Antenna and/or waveguide assemblies for vehicles, such as RADAR sensor antenna assemblies, along with associated signal confinement structures. In some embodiments, the assembly may comprise an antenna block defining one or more waveguides. A conductive layer may be coupled to the antenna block to form, at least in part, a wall of the waveguide. The assembly may comprise one or more periodic structures that may be operably coupled to the waveguide, each of which may comprise a first elongated opening and a first series of repeated slots extending at least substantially transverse to the first elongated opening, wherein each of the first series of repeated slots is spaced apart from an adjacent slot in the first series of repeated slots along the first elongated opening.

Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and an antenna element over the semiconductor die. The chip package also includes a first conductive feature electrically connecting the conductive element of the semiconductor die and the antenna element. The chip package further includes a protective layer surrounding the first conductive feature. In addition, the chip package includes a second conductive feature over the first conductive feature. A portion of the second conductive feature is between the first conductive feature and the protective layer.

In accordance with an aspect of the disclosure, an electronic device is provided. The electronic device comprises an antenna array, a wireless communication module electrically connected to the antenna array and configured to form directional beams through the antenna array, at least one processor operatively connected to the wireless communication module; and a memory operatively connected to the at least one processor. The memory stores instructions causing the at least one processor to perform a plurality of operations comprising: transmitting a sequence of first directional beams having a first beam width to scan first regions having a first size through the antenna array, receiving a sequence of first reflected waves generated by reflection of the sequence of the first directional beams from an object through the antenna array, transmitting a sequence of second directional beams having a second beam width narrower than the first beam width to scan second regions, which are included in the first regions and have a second size smaller than the first size, through the antenna array based on at least a portion of the received sequence of the first reflected waves, receiving a sequence of second reflected waves generated by reflection of the sequence of the second directional beams from the object through the antenna array, and authenticating the object based on at least a portion of the sequence of the second reflected waves.

A coupling device includes a plurality of couplers, a first coupled output port and a second coupled output port, wherein the plurality of couplers comprise a first coupler and a second coupler that are adjacent one another, and each of the first coupler and the second coupler comprises a main line and a subline, and for each of the first coupler and the second coupler: the subline includes a first section, a second section, and a third section, wherein the second section of the subline of the first coupler has a common segment with the first section of the subline of the second coupler.

A 5G antenna system is disclosed that comprises a substrate and at least one antenna element configured to transmit and receive 5G radio frequency signals. The at least one antenna element is coupled to the substrate. The substrate comprises a polymer composition that comprises a polymer matrix containing at least one polymer having a glass transition temperature of about 30° C. or more and at least one laser activatable additive wherein the polymer composition exhibits a dissipation factor of about 0.1 or less, as determined at a frequency of 2 GHz.

An apparatus includes a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver or a transmitter. The first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB. The apparatus includes an antenna having a first side and a second side opposite the first side. The first side of the antenna includes a radiating side of the antenna and the second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.

The present invention relates to an antenna assembly. The antenna assembly comprises a feed board, a backplane, and a calibration board. A plurality of radiating elements are mounted on the feed board and extend forwardly from the feed board. The feed board is mounted on a first major surface of the backplane, and the calibration board is mounted on a second major surface of the backplane opposite the first major surface. The antenna assembly further includes a conductive structure, which extends through openings in at least two of the feed board, the backplane and the calibration board so as to electrically connect a first transmission line on the calibration board with a second transmission line on the feed board. The antenna assembly according to embodiments of the present invention can also achieve high integration and miniaturization of the overall antenna construction. Further, the present invention relates to a base station antenna comprises an antenna assembly.

An antenna apparatus includes a first component layer having a plurality of RFICs arranged in a first lattice geometry (e.g., rectangular), where each RFIC comprises beamforming circuitry. A second, parallel component layer overlays the first component layer and includes a plurality of antenna elements arranged in a second, different lattice geometry (e.g., triangular). The antenna elements have respective feed points each coupled to an input/output (I/O) pad of an RFIC. Each I/O pad is aligned with the feed point coupled thereto along an axis orthogonal to the first and second layers.