The present disclosure relates to an antenna element comprising a lower conducting plane, an upper conducting plane and an upper dielectric layer structure that is positioned between the conducting planes. The upper dielectric layer structure comprises a plurality of conducting vias that electrically connect the conducting planes to each other and circumvent an upper radiating patch formed in, below or above the upper conducting plane. The conducting vias circumvent at least one intermediate radiating patch that is formed in the upper dielectric layer structure, and a lowest intermediate radiating patch that is closest to the lower conducting plane is connected to a feed arrangement that comprises at least one feeding probe that extends via a corresponding aperture in the lower conducting plane and is electrically connected to the lowest intermediate radiating patch.

In one embodiment of the present disclosure, an antenna apparatus includes a housing assembly including a radome portion and a lower enclosure portion, wherein the radome portion and lower enclosure portion are couplable to form an inner compartment for housing antenna components of the antenna assembly, an antenna stack assembly disposed within the inner compartment, wherein the antenna stack assembly generates heat when in operation, and a heat transfer system within the inner compartment configured to facilitate the flow of heat toward the radome portion.

In one embodiment of the present disclosure, an antenna apparatus includes a housing assembly including a radome portion and a lower enclosure portion, wherein the radome portion and lower enclosure portion are couplable to form an inner compartment for housing antenna components of the antenna assembly, an antenna stack assembly disposed within the inner compartment, wherein the antenna stack assembly generates heat when in operation, and a heat transfer system within the inner compartment configured to facilitate the flow of heat toward the radome portion.

A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

An apparatus is disclosed comprising first printed circuit board—PCB—and second PCB structure each having a first surface and a second surface and a layer of electrically conductive material on the first surface thereof and being attached to each other in a substantially parallel configuration. A stripline is positioned between the two PCBs. Each one of the first PCB and the second PCB has a plurality of via-holes that are electrically conductive and are connected at one end to the layer of electrically conductive material on the first surface and to an electrically conductive pad on the second surface of the PCB. At least a first electrically conductive pad associated with the first PCB is located in proximity with a first electrically conductive pad associated with the second PCB thereby forming a capacitive configuration.

An antenna is disclosed. The antenna can include a coplanar antenna structure. The coplanar antenna structure can include a substrate and a radiating portion that is configured to emit electromagnetic radiation and is disposed over the substrate. The radiating portion defines a slot having a width to length ratio of at least approximately 0.4. The antenna also includes a scattering element disposed over the substrate and at least partially surrounds the radiating portion.

A lens elements array comprises at least two lens elements aligned along an alignment axis. Each lens element includes a spherical lens and a feed element. The feed elements are tilted such that the RF signals generated by the feed elements have major axes form an angle (preferably between 5° and 30°) other than a perpendicular angle with respect to the alignment axis. The combined RF signals produced collectively by these feed elements have amplitude that has minimal dips across the array. The feed elements that are farther away from the center of the array have higher levels of tilts than the feed elements that are closer to the center of the array.

A lens elements array comprises at least two lens elements aligned along an alignment axis. Each lens element includes a spherical lens and a feed element. The feed elements are tilted such that the RF signals generated by the feed elements have major axes form an angle (preferably between 5° and 30°) other than a perpendicular angle with respect to the alignment axis. The combined RF signals produced collectively by these feed elements have amplitude that has minimal dips across the array. The feed elements that are farther away from the center of the array have higher levels of tilts than the feed elements that are closer to the center of the array.

Example embodiments described herein involve determining three dimensional data representative of an environment for an autonomous vehicle using radar. An example embodiment involves receiving radar reflection signals at a radar unit coupled to a vehicle and determining an azimuth angle and a distance for surfaces in the environment causing the radar reflection signals. The embodiment further involves determining an elevation angle for the surfaces causing the radar reflection signals based on phase information of the radar reflection signals and controlling the vehicle based at least in part on the azimuth angle, the distance, and the elevation angle for the surfaces causing the plurality of radar reflection signals. In some instances, the radar unit is configured to receive radar reflection signals using a staggered linear array with one or multiple radiating elements offset in the array.

The present disclosure provides an antenna package structure and an antenna packaging method. The package structure includes an antenna circuit chip, a first packaging layer, a first rewiring layer, an antenna structure, a second metal connecting column, a third packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using the rewiring layer and the metal connecting column.