A tunable antenna. includes a radio frequency integrated circuit, a first frequency modulation branch coupled to the radio frequency integrated circuit, a first antenna coupled to the radio frequency integrated circuit through the first frequency modulation branch, a second antenna coupled to the radio frequency integrated circuit through a second frequency modulation branch. The first antenna corresponds to a first frequency, the second antenna corresponds to a second frequency, and the first frequency and the second frequency are respectively a transmit frequency and a receive frequency in a specified frequency band. The first antenna and the second antenna are respectively connected to the radio frequency integrated circuit through the frequency modulation branches when the tunable antenna is being designed.

In one embodiment of the present disclosure, an antenna apparatus includes a housing assembly including a radome portion and a lower enclosure portion, wherein the radome portion and lower enclosure portion are couplable to form an inner compartment for housing antenna components of the antenna assembly, an antenna stack assembly disposed within the inner compartment, wherein the antenna stack assembly generates heat when in operation, and a heat transfer system within the inner compartment configured to facilitate the flow of heat toward the radome portion.

In one embodiment of the present disclosure, an antenna apparatus includes a housing assembly including a radome portion and a lower enclosure portion, wherein the radome portion and lower enclosure portion are couplable to form an inner compartment for housing antenna components of the antenna assembly, an antenna stack assembly disposed within the inner compartment, wherein the antenna stack assembly generates heat when in operation, and a heat transfer system within the inner compartment configured to facilitate the flow of heat toward the radome portion.

An active matching network for impedance matching to a miniature antenna, comprising a cross-coupled transistor pair, where each transistor has an emitter, base and collector, the emitter of a first transistor forms an input terminal, the emitter of a second transistor forms on output terminal, the collector of the first transistor coupled to the base of the second transistor, the collector of the second transistor coupled to the base of the first transistor, and a matching circuit coupled between the collectors of the first and second transistors. The matching network is configured to match an impendence near resonance of the high Q miniature antenna to an input impedance using a complex negative impedance comprising resistance, inductance and capacitance.

Methods and systems for a passive noise dampener. A system includes a hybrid fiber-coaxial network which carries content signals between a service provider system and premises, where the hybrid fiber-coaxial network is susceptible to receiving wireless noise signals, a plurality of passive noise dampeners, each passive noise dampener connected between the hybrid fiber-coaxial network and a premise of the premises. Each passive noise dampener includes an antenna based on medium used in the hybrid fiber-coaxial network. The antenna receives the wireless noise signals. A phase shifting device phase shifts 180 degrees phase shift the wireless noise signals received by the antenna to generate a counter signal. A directional coupler injects the counter signal into the hybrid fiber-coaxial network to mitigate impact of the wireless noise signals received by the hybrid fiber-coaxial network on the content signals. The antenna, the phase shifting device, and the directional coupler are passive devices.

An AIP includes a package substrate including a top layer including a top metal layer including a first antenna type and a second antenna type, and a bottom layer including a bottom dielectric and a metal layer including a first and second contact pad and filled vias, and an IC embedded therein. Bond pads of an IC are coupled by a connection including ≥1 filled via for connecting to the top and/or bottom metal layer. A first metal pillar is between the first contact pad and first antenna, and a second metal pillar is between the second contact pad and second antenna. A first filled via is coupled to the first metal pillar providing a transmission line from the first contact pad to the first antenna. A second filled via is coupled to the first metal pillar providing a transmission line from the second contact pad to the second antenna.

An AIP includes a package substrate including a top layer including a top metal layer including a first antenna type and a second antenna type, and a bottom layer including a bottom dielectric and a metal layer including a first and second contact pad and filled vias, and an IC embedded therein. Bond pads of an IC are coupled by a connection including ≥1 filled via for connecting to the top and/or bottom metal layer. A first metal pillar is between the first contact pad and first antenna, and a second metal pillar is between the second contact pad and second antenna. A first filled via is coupled to the first metal pillar providing a transmission line from the first contact pad to the first antenna. A second filled via is coupled to the first metal pillar providing a transmission line from the second contact pad to the second antenna.

In the present invention a guide or carrier is used to assemble and position multiple AiPs (or Integrated Circuit packages) on a substrate and maintain spacing therebetween. In some examples, this reduces package size and maintains desired tolerances. The carrier or guard is to be thin and flexible so as to allow some movement but maintain tolerances at specific locations.

In the present invention a guide or carrier is used to assemble and position multiple AiPs (or Integrated Circuit packages) on a substrate and maintain spacing therebetween. In some examples, this reduces package size and maintains desired tolerances. The carrier or guard is to be thin and flexible so as to allow some movement but maintain tolerances at specific locations.

An antenna element transfers a radiofrequency signal and dissipates heat. The antenna element includes a periphery and first and second pairs of fins. The periphery has a length and a width with the length approximately equaling the width. The first and second pairs of fins extend in height from inside the periphery. The first pair of fins are separated by a shared gap for transferring a first polarization of the radiofrequency signal, and the second pair of fins are separated by the shared gap for transferring a second polarization of the radiofrequency signal that is orthogonal to the first polarization. An antenna array includes multiple instances of the antenna element for transferring the radiofrequency signal and for dissipating the heat.