H01Q23/00

Radar device for vehicle
11703561 · 2023-07-18 · ·

A radar device for a vehicle, according to an embodiment of the present invention, comprises: a case; a first printed circuit board (PCB) that is accommodated in the case and has a plurality of antenna arrays and an integrated circuit (IC) chip that are formed thereon, wherein the IC chip is connected to the plurality of antenna arrays; and a radome that is coupled to the case and covers the first printed circuit board, wherein the radome includes: a cover facing the first printed circuit board; a first wall connected to the cover surface; and a second wall connected to the cover and facing the first wall, wherein the internal angle between the cover and the first wall and the internal angle between the cover and the second wall are formed to be greater than 90° and less than 180°.

Radar device for vehicle
11703561 · 2023-07-18 · ·

A radar device for a vehicle, according to an embodiment of the present invention, comprises: a case; a first printed circuit board (PCB) that is accommodated in the case and has a plurality of antenna arrays and an integrated circuit (IC) chip that are formed thereon, wherein the IC chip is connected to the plurality of antenna arrays; and a radome that is coupled to the case and covers the first printed circuit board, wherein the radome includes: a cover facing the first printed circuit board; a first wall connected to the cover surface; and a second wall connected to the cover and facing the first wall, wherein the internal angle between the cover and the first wall and the internal angle between the cover and the second wall are formed to be greater than 90° and less than 180°.

Cancelation circuit for radio frequency antenna systems
11705628 · 2023-07-18 · ·

A radio frequency antenna system is provided and can include a radio printed circuit board, a first antenna element located proximate an edge of the radio printed circuit board, a second antenna element located proximate the edge of the radio printed circuit board, and a cancelation circuit located on the radio printed circuit board and connected to feeding points of the first antenna and the second antenna, wherein the cancelation circuit can provide a cancelation effect at output ports of the cancelation circuit with respect to signals broadcast by the first antenna element and the second antenna element over air.

Cancelation circuit for radio frequency antenna systems
11705628 · 2023-07-18 · ·

A radio frequency antenna system is provided and can include a radio printed circuit board, a first antenna element located proximate an edge of the radio printed circuit board, a second antenna element located proximate the edge of the radio printed circuit board, and a cancelation circuit located on the radio printed circuit board and connected to feeding points of the first antenna and the second antenna, wherein the cancelation circuit can provide a cancelation effect at output ports of the cancelation circuit with respect to signals broadcast by the first antenna element and the second antenna element over air.

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
20230223364 · 2023-07-13 ·

A device includes a redistribution structure, a first semiconductor device, a first antenna, and a first conductive pillar on the redistribution structure that are electrically connected to the redistribution structure, an antenna structure over the first semiconductor device, wherein the antenna structure includes a second antenna that is different from the first antenna, wherein the antenna structure includes an external connection bonded to the first conductive pillar, and a molding material extending between the antenna structure and the redistribution structure, the molding material surrounding the first semiconductor device, the first antenna, the external connection, and the first conductive pillar.

CIP PACKAGE
20230018396 · 2023-01-19 ·

An electronic device and a CIP (connector-in-package) package used therein. The CIP package can includes a semiconductor chip, an RF connector, and a carrier substrate. The carrier substrate is for carrying the semiconductor chip and the RF connector and electrically connected to the semiconductor chip and the RF connector to allow the semiconductor chip to transmit RF signal through the RF connector.

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall between the cavity ceiling and the cavity base. Either a bottom surface of the antenna element defines the cavity ceiling and a perimeter portion of the antenna element is fixed to the antenna dielectric structure, or the antenna dielectric structure includes a body portion having a bottom surface that defines the cavity ceiling and the antenna element is vertically spaced apart from the bottom surface of the body portion. An semiconductor component is coupled to a bottom side of the substrate and is coupled to the transceiver pattern. Other examples and related methods are also disclosed herein.

ANTENNA APPARATUS HAVING HEAT DISSIPATION FEATURES

In one embodiment of the present disclosure, an antenna apparatus includes a housing assembly including a radome portion and a lower enclosure portion, wherein the radome portion and lower enclosure portion are couplable to form an inner compartment for housing antenna components of the antenna assembly, an antenna stack assembly disposed within the inner compartment, wherein the antenna stack assembly generates heat when in operation, and a heat transfer system within the inner compartment configured to facilitate the flow of heat toward the radome portion.

ANTENNA APPARATUS HAVING HEAT DISSIPATION FEATURES

In one embodiment of the present disclosure, an antenna apparatus includes a housing assembly including a radome portion and a lower enclosure portion, wherein the radome portion and lower enclosure portion are couplable to form an inner compartment for housing antenna components of the antenna assembly, an antenna stack assembly disposed within the inner compartment, wherein the antenna stack assembly generates heat when in operation, and a heat transfer system within the inner compartment configured to facilitate the flow of heat toward the radome portion.

Antenna module and massive MIMO antenna
11552410 · 2023-01-10 · ·

The present invention provides an antenna module for a massive MIMO antenna, the antenna module comprising a plurality of first signal ports, a number of first antenna elements arranged in a first matrix arrangement, wherein a number of rows of the first matrix arrangement and/or a number of columns of the first matrix arrangement equals the number of first signal ports, and a switching matrix that is configured to controllably couple each of the first signal ports either with all first antenna elements of a respective row of the first matrix arrangement or all first antenna elements of a respective column of the first matrix arrangement. Further, the present invention provides a respective massive MIMO antenna.