Antenna arrays to be used in MIMO apparatuses are disclosed. Such an antenna array may include a plurality of array elements, wherein every second element in a first direction is a digital pre-distortion-less linear element, and every second element in the first direction is a non-linear element. In the antenna array, spacing between adjacent elements in the first direction is less than a half of a free space wavelength. A non-linear precoding is applied to transmissions from the antenna array, the non-linear precoding converting out-of-band emissions of the transmissions into reactive power in the near-field around the antenna array while ensuring that in-band signals generated by the elements remain unaffected.

Antenna arrays to be used in MIMO apparatuses are disclosed. Such an antenna array may include a plurality of array elements, wherein every second element in a first direction is a digital pre-distortion-less linear element, and every second element in the first direction is a non-linear element. In the antenna array, spacing between adjacent elements in the first direction is less than a half of a free space wavelength. A non-linear precoding is applied to transmissions from the antenna array, the non-linear precoding converting out-of-band emissions of the transmissions into reactive power in the near-field around the antenna array while ensuring that in-band signals generated by the elements remain unaffected.

An example electronic device may include an antenna module including a printed circuit board, a plurality of conductive patches including a first conductive patch and a second conductive patch, an RFIC which is disposed on the second surface of the printed circuit board and includes a first tuning circuit, and a first conductive structure which includes a first portion extending from the first conductive patch, a second portion extending from the second conductive patch and connected to the first portion at a point positioned at one end of the first portion, and a first common portion connected to the first tuning circuit and connecting the first conductive patch and the second conductive patch to the first tuning circuit, a ground, and a wireless communication circuit, and the wireless communication circuit may be configured to feed the plurality of conductive patches to receive a signal in a designated frequency band.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

An antenna device includes a first substrate, a second substrate, an antenna layer, and a redistribution layer. The first substrate has a first surface, a second surface opposite to the first surface, and an inclined sidewall adjoining the first and second surfaces. The second substrate is below the first substrate. The first surface of the first substrate faces toward the second substrate. The antenna layer is located on the first surface of the first substrate. The redistribution layer extends from the second surface of the first substrate to the second substrate along the inclined sidewall of the first substrate, and the redistribution layer has a first section in contact with an end of the antenna layer.

An antenna oscillator unit includes a radiator and a balun support. The radiator is fixed to the balun support and includes a plurality of low-frequency oscillator arms circumferentially distributed along the balun support. Each of the low-frequency oscillator arms includes two radiating sections connected to each other and a connecting section connecting the two radiating sections to form a closed loop. The two radiating sections are substantially perpendicular to each other. The antenna oscillator unit of some embodiments can avoid mutual coupling of signals from the antenna oscillator unit and an adjacent high-frequency oscillator and can improve the capability to radiate electromagnetic signals.

An antenna oscillator unit includes a radiator and a balun support. The radiator is fixed to the balun support and includes a plurality of low-frequency oscillator arms circumferentially distributed along the balun support. Each of the low-frequency oscillator arms includes two radiating sections connected to each other and a connecting section connecting the two radiating sections to form a closed loop. The two radiating sections are substantially perpendicular to each other. The antenna oscillator unit of some embodiments can avoid mutual coupling of signals from the antenna oscillator unit and an adjacent high-frequency oscillator and can improve the capability to radiate electromagnetic signals.

An antenna package according to an exemplary embodiment includes an antenna unit, a printed circuit board including an antenna connection wiring electrically connected to the antenna unit, an antenna driving integrated circuit (IC) chip mounted on the printed circuit board and connected to the antenna connection wiring, and a touch sensor driving IC chip and a display driving IC chip mounted on the printed circuit board together with the antenna driving IC chip. The driving IC chips are integrated in a single printed circuit board to improve spatial and process efficiency.

An integrated radar circuit comprising: a first substrate, of a first semiconductor material, said first substrate comprising an integrated transmit and receive radar circuit; a second substrate, of a second semiconductor material, said second substrate comprising at least on through-substrate cavity having cavity walls; at least one discrete transistor chip, of a third semiconductor material, said at least one discrete transistor chip having chip walls and being held in said at least one through-substrate cavity by a metal filling extending from at least one cavity wall to at least one chip wall; a conductor on said second substrate, electrically connecting a portion of said integrated transmit and receive radar circuit to a discrete transistor on said at least one discrete transistor chip.