Base station antennas include an externally accessible active antenna module releasably coupled to a recessed segment that is over a chamber in the base station antenna and that is longitudinally and laterally extending along and across a rear of a base station antenna housing. The base station antenna housing has a passive antenna assembly that cooperates with the active antenna module.

Base station antennas include an externally accessible active antenna module releasably coupled to a recessed segment that is over a chamber in the base station antenna and that is longitudinally and laterally extending along and across a rear of a base station antenna housing. The base station antenna housing has a passive antenna assembly that cooperates with the active antenna module.

An antenna device includes a main circuit board, a first-type antenna ground-coupled to the main circuit board, and a second-type antenna ground-coupled to the main circuit board. The first-type antenna has a ground structure. The second-type antenna is spaced apart from the first-type antenna and an operating bandwidth of the second-type antenna is greater than an operating bandwidth of the first-type antenna.

An antenna device includes a main circuit board, a first-type antenna ground-coupled to the main circuit board, and a second-type antenna ground-coupled to the main circuit board. The first-type antenna has a ground structure. The second-type antenna is spaced apart from the first-type antenna and an operating bandwidth of the second-type antenna is greater than an operating bandwidth of the first-type antenna.

An array antenna is proved. The array antenna provides multi-polarization by arranging multiple ports at adjacent positions. Specifically, the array antenna includes a first substrate having a first thickness and a rectangular shape, a second substrate disposed to be in contact with the bottom surface of the first substrate and having a second thickness and a rectangular shape, a ground surface shared by the first substrate and the second substrate, and first ports and second ports disposed to penetrate the ground surface.

A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.

A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.

An antenna module includes a radiating element and a dielectric substrate. The dielectric substrate includes a flat portion on which an external terminal (T) to which a RFIC is connected is disposed, a flat portion in which the radiating element is disposed, a bent portion, a feeder, and a ground electrode (GND1). The feeder extends through the flat portions and the bent portion to connect the external terminal (T) and the radiating element to each other. The ground electrode (GND1) extends through the flat portions and the bent portion along the feeder. At the bent portion, a thickness of the feeder is greater than a thickness of the ground electrode (GND1).

A monolithic integrated circuit (IC), and method of manufacturing same, that includes all RF front end or transceiver elements for a portable communication device, including a power amplifier (PA), a matching, coupling and filtering network, and an antenna switch to couple the conditioned PA signal to an antenna. An output signal sensor senses at least a voltage amplitude of the signal switched by the antenna switch, and signals a PA control circuit to limit PA output power in response to excessive values of sensed output. Stacks of multiple FETs in series to operate as a switching device may be used for implementation of the RF front end, and the method and apparatus of such stacks are claimed as subcombinations. An iClass PA architecture is described that dissipatively terminates unwanted harmonics of the PA output signal. A preferred embodiment of the RF transceiver IC includes two distinct PA circuits, two distinct receive signal amplifier circuits, and a four-way antenna switch to selectably couple a single antenna connection to any one of the four circuits.

A monolithic integrated circuit (IC), and method of manufacturing same, that includes all RF front end or transceiver elements for a portable communication device, including a power amplifier (PA), a matching, coupling and filtering network, and an antenna switch to couple the conditioned PA signal to an antenna. An output signal sensor senses at least a voltage amplitude of the signal switched by the antenna switch, and signals a PA control circuit to limit PA output power in response to excessive values of sensed output. Stacks of multiple FETs in series to operate as a switching device may be used for implementation of the RF front end, and the method and apparatus of such stacks are claimed as subcombinations. An iClass PA architecture is described that dissipatively terminates unwanted harmonics of the PA output signal. A preferred embodiment of the RF transceiver IC includes two distinct PA circuits, two distinct receive signal amplifier circuits, and a four-way antenna switch to selectably couple a single antenna connection to any one of the four circuits.