An apparatus is disclosed for implementing an antenna tuner. In an example aspect, the apparatus includes a substrate, an antenna disposed on or in the substrate, a radio-frequency integrated circuit disposed on the substrate, and an antenna tuner. The radio-frequency integrated circuit includes an amplification circuit. The antenna tuner is coupled between the antenna and the amplification circuit. The antenna tuner includes an inductive component disposed on or in the substrate and a capacitive component implemented within the radio-frequency integrated circuit.

An apparatus is disclosed for implementing an antenna tuner. In an example aspect, the apparatus includes a substrate, an antenna disposed on or in the substrate, a radio-frequency integrated circuit disposed on the substrate, and an antenna tuner. The radio-frequency integrated circuit includes an amplification circuit. The antenna tuner is coupled between the antenna and the amplification circuit. The antenna tuner includes an inductive component disposed on or in the substrate and a capacitive component implemented within the radio-frequency integrated circuit.

Disclosed herein is a phased array antenna system that includes: a first array of antenna elements having a first and second antenna element; a second array of antenna elements having a third and fourth antenna element; a beamforming integrated circuit (IC) coupled to the first and second arrays; and a set of transmission lines coupling the beamforming IC to the first and second arrays. The first and second arrays are parallel to and facing in opposite directions of each other. The set of transmission lines is configured to delay radio frequency (RF) signals from the beamforming IC to first and third antenna elements.

According to one embodiment, an electronic apparatus includes processing circuitry. The processing circuitry estimates a first AoA of an arrival wave corresponding to a received signal from a receiving element array. The processing circuitry determines whether the estimated first AoA is an outlier or not. The processing circuitry outputs the first AoA as a second AoA, when the first AoA is not to be an outlier. The processing circuitry acquires one or more main-lobe angles assuming that the first AoA is a side-lobe angle of the receiving element array, when the first AoA is to be an outlier. The processing circuitry determines whether the main-lobe angle is an outlier or not. The processing circuitry outputs the main-lobe angle as the second AoA, when the main-lobe angle is not to be an outlier.

According to one embodiment, an electronic apparatus includes processing circuitry. The processing circuitry estimates a first AoA of an arrival wave corresponding to a received signal from a receiving element array. The processing circuitry determines whether the estimated first AoA is an outlier or not. The processing circuitry outputs the first AoA as a second AoA, when the first AoA is not to be an outlier. The processing circuitry acquires one or more main-lobe angles assuming that the first AoA is a side-lobe angle of the receiving element array, when the first AoA is to be an outlier. The processing circuitry determines whether the main-lobe angle is an outlier or not. The processing circuitry outputs the main-lobe angle as the second AoA, when the main-lobe angle is not to be an outlier.

An electronic device is provided. The electronic device includes a display having a first surface, a metal frame structure configured to form a side surface of the electronic device, a rear plate having a second surface facing a third direction, at least one antenna module disposed inside the side surface and having a radiation surface, at least one dielectric layer having at least a partial region attached to the radiation surface, and a wireless communication circuit configured to transmit or receive an radio frequency (RF) signal to or from the at least one antenna module, in which the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, in which the first dielectric sheet is made of a thermal conductive material having a first permittivity and the second dielectric sheet is made of a material having a second permittivity larger than the first permittivity.

An electronic device is provided. The electronic device includes a display having a first surface, a metal frame structure configured to form a side surface of the electronic device, a rear plate having a second surface facing a third direction, at least one antenna module disposed inside the side surface and having a radiation surface, at least one dielectric layer having at least a partial region attached to the radiation surface, and a wireless communication circuit configured to transmit or receive an radio frequency (RF) signal to or from the at least one antenna module, in which the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, in which the first dielectric sheet is made of a thermal conductive material having a first permittivity and the second dielectric sheet is made of a material having a second permittivity larger than the first permittivity.

This document describes techniques and systems of an exposed portion of a PCB configured to provide isolation among radar antennas. The described radar system includes an exposed portion of a surface of a printed circuit board (PCB) positioned between a first antenna and a second antenna. The PCB includes a metal plating on the surface of the PCB. A width of the exposed portion can delay a phase of electromagnetic (EM) energy conducted by the metal plating relative to a phase of EM energy that does not traverse the exposed portion. A height of the exposed portion can cause an amount of the EM energy conducted by the metal plating to be approximately equal to an amount of EM energy that traverses the exposed portion. In this way, the described systems and techniques can reduce signal-coupling among radar antennas without additional hardware costs and distance between the antennas.

This document describes techniques and systems of an exposed portion of a PCB configured to provide isolation among radar antennas. The described radar system includes an exposed portion of a surface of a printed circuit board (PCB) positioned between a first antenna and a second antenna. The PCB includes a metal plating on the surface of the PCB. A width of the exposed portion can delay a phase of electromagnetic (EM) energy conducted by the metal plating relative to a phase of EM energy that does not traverse the exposed portion. A height of the exposed portion can cause an amount of the EM energy conducted by the metal plating to be approximately equal to an amount of EM energy that traverses the exposed portion. In this way, the described systems and techniques can reduce signal-coupling among radar antennas without additional hardware costs and distance between the antennas.

One embodiment is a device, which comprises a cable attached at a first end to a radio module, the cable having a plurality of electro-magnetic interference (EMI) resistant elements connected at a plurality of positions, a radial board wherein the cable is attached thereto at a second end, and an antenna connected to the radial board, the antenna being configured to receive power from the radio module and to radiate.