A computing apparatus adapted for rear access installation of a computer card with blind mating. The apparatus includes an enclosure with a rear access opening and a circuit board mounted in an interior space of the enclosure with an upward facing connector. The apparatus includes a guide assembly comprising a guide mounted within the interior space, and the guide includes a travel surface extending over the upward facing connector of the circuit board. The apparatus includes a card carrier with a frame that houses a computer card, e.g., a PCIe card, which includes a connector extending outward from the card carrier frame. The card carrier rides upon the travel surface when the card carrier is inserted into the enclosure and then pivots about a contact surface in the guide assembly when the computer card connector is proximate to the upward facing connector to provide vertical insertion of the computer card.

A method is described for solderless electrical press-in contacting of conductive press-in pins in circuit boards, the method comprising the following steps: Providing a circuit board having at least one contacting opening for press-in contacting; providing at least one press-in component having at least one conductive press-in pin; providing a sonotrode for exerting a force and for applying ultrasonic energy. In order to electrically and mechanically contact press-in pins to a circuit board by means of ultrasonic press-in technology, it is provided that the press-in component together with its press-in pin, is fixated during a press-in step, in particular held firmly in place, and that a force and ultrasonic energy are directly applied to the circuit board by means of the sonotrode such that the circuit board is pressed at the location of its contacting opening onto the press-in pin, not directly acted upon by the sonotrode, of the press-in component.

A connector includes a housing and contacts retained by the housing, the contacts forming contact arrays that linearly extend in a predetermined array direction in parallel to each other, each of the contacts having a mounting portion that is fixed to the mounting object when the connector is mounted on the mounting object and a contact portion that contacts a corresponding contact of the counter connector when the connector is connected to the counter connector, the mounting portions of contacts constituting at least two contact arrays adjacent to each other of the contact arrays extending in a same elongation direction, contacts constituting each contact array of the at least two contact arrays being disposed in a position other than a position where those contacts completely coincide with contacts constituting another contact array of the at least two contact arrays in a direction perpendicular to the predetermined array direction.

Connector receptacles that may be space efficient and provide a direct connection to a flexible circuit board. One example may provide an electronic device having a receptacle including a recess formed in a housing of the electronic device. The recess may have a sidewall and a bottom surface portion, and the bottom surface portion may include one or more openings extending through the bottom surface portion from an external surface to an internal surface. One or more contacts formed on a flexible circuit board may be aligned with the one or more openings in the bottom surface portion. In this way, the receptacle may be space efficient and provide a direct connection to a flexible circuit board inside an electronic device. A cosmetic cap may be placed in the recess to obscure the existence of the connector receptacle.

An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.

A grid array connector system is provided that includes cables that are mounted on a board which has a chip packaged mounted thereon. The cables include conductors that are connected to support vias positioned in openings in the board and the conductors are connected to the support vias. The board can be connected to a second board which provides a stiffening ring. The board can be connected to the second board by deflectable terminals which are press-fit into the second board.

An engine control system includes an integrated engine control module assembly having an engine control module and an adapter module. The integrated engine control module assembly further includes a first connector, a second connector, and a hermetic enclosure. The first connector includes a connection circuit configured to connect the integrated engine control module assembly to engine hardware. The second connector is configured to connect the adapter module to engine hardware. The hermetic enclosure houses the engine control module and is configured to protect the engine control module from environmental conditions.

A pair of ground planes arranged in parallel, a dielectric medium disposed in between the pair of ground planes, and a set of at least four signal conductors disposed in the dielectric medium, the set of at least four signal conductors having (i) a first pair of signal conductors arranged proximate to a first ground plane of the pair of ground planes and (ii) a second pair of signal conductors arranged proximate to a second ground plane of the pair of ground planes, each signal conductor of the set of at least four signal conductors configured to carry a respective signal corresponding to a symbol of a codeword of a vector signaling code.

A pair of ground planes arranged in parallel, a dielectric medium disposed in between the pair of ground planes, and a set of at least four signal conductors disposed in the dielectric medium, the set of at least four signal conductors having (i) a first pair of signal conductors arranged proximate to a first ground plane of the pair of ground planes and (ii) a second pair of signal conductors arranged proximate to a second ground plane of the pair of ground planes, each signal conductor of the set of at least four signal conductors configured to carry a respective signal corresponding to a symbol of a codeword of a vector signaling code.

A press-fit pin for a semiconductor package includes a shaft terminating in a head. A pair of arms extends away from a center of the head. Each arm includes a curved shape and the arms together form an s-shape. A length of the s-shape is longer than the shaft diameter. An outer extremity of each arm includes a contact surface configured to electrically couple to and form a friction fit with a pin receiver. In implementations the press-fit pin has only two surfaces configured to contact an inner sidewall of the pin receiver and is configured to contact the inner sidewall at only two locations. The shaft may be a cylinder. The s-shape formed by the pair of arms is visible from a view facing a top of the press-fit pin along a direction parallel with the longest length of the shaft. Versions include a through-hole extending through the head.