Provided is a method of manufacturing an electrical connection structure which includes a female connection structure having an inner conductive material inside an insertion hole of a female connection member, and a male connection structure having a conductive column configured to be inserted into and fixed to the insertion hole to be in contact with the inner conductive material, and formed to protrude from a male connection member. The method includes preparing insulating members used for the female connection member and the male connection member, and forming the inner conductive material and the column by patterning a conductive material on each of the insulating member using a photolithography process.

A connection structure of high-temperature superconducting wires includes first and second superconducting wires which are high-temperature superconducting wires respectively having a base material consisting of metal or alloy, and an oxide superconducting layer formed on the base material. A joint portion containing a superconducting connection portion between the first and second superconducting wires joins the first and second superconducting wires in a positional relationship facing the surfaces of first and second superconducting layers which are the oxide superconducting layers of each of the first and second superconducting wires, are opposed to each other. In a base material of at least one superconducting wire among the first and second superconducting wires, a first portion constituting the joint portion is thicker than a second portion not constitute the joint portion in the same base material.

A connection structure of high-temperature superconducting wires includes first and second superconducting wires which are high-temperature superconducting wires respectively having a base material consisting of metal or alloy, and an oxide superconducting layer formed on the base material. A joint portion containing a superconducting connection portion between the first and second superconducting wires joins the first and second superconducting wires in a positional relationship facing the surfaces of first and second superconducting layers which are the oxide superconducting layers of each of the first and second superconducting wires, are opposed to each other. In a base material of at least one superconducting wire among the first and second superconducting wires, a first portion constituting the joint portion is thicker than a second portion not constitute the joint portion in the same base material.

An electrical connector is provided that includes a first conductor for receiving electrical power. A first seal is coupled to the first conductor for protecting the first conductor. An insulating body is coupled to the first conductor, and includes an electrical terminal that establishes electrical connections between the first conductor and a plurality of electrical terminal pins. A downhole cable is coupled to a first electrical terminal pin of the plurality of electrical terminal pins. The first electrical terminal pin establishes an electrical connection between the electrical terminal and the downhole cable to provide the electric power to the downhole cable. A second seal is coupled to the downhole cable for protecting the electrical connection between the electrical terminal and the downhole cable.

A wafer test device and methods of assembling a wafer test device involve a first laminate structure, and a second laminate structure arranged to interface with a microcircuit of the wafer. The wafer test device includes a compliant layer between the first laminate structure and the second laminate structure. The compliant layer includes an elastomer that exhibits compliance within a limited range of movement.

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.

A lead block includes a lead block body and a plurality of busbars. The plurality of busbars is each partially embedded in the lead block body. The plurality of busbars includes a plurality of exposed portions. The plurality of exposed portions each extends in a longitudinal direction and disposed spaced apart from one another in an arrangement direction orthogonal to the longitudinal direction. The plurality of exposed portions includes at least one first exposed portion. The at least one first exposed portion includes a first surface and a first additional surface disposed on a reverse side of the first surface in the arrangement direction. The first surface includes a first cut surface having an area smaller than an area of the first surface. The first additional surface includes a first additional cut surface having an area smaller than an area of the first additional surface.

A lead block includes a lead block body and a plurality of busbars. The plurality of busbars is each partially embedded in the lead block body. The plurality of busbars includes a plurality of exposed portions. The plurality of exposed portions each extends in a longitudinal direction and disposed spaced apart from one another in an arrangement direction orthogonal to the longitudinal direction. The plurality of exposed portions includes at least one first exposed portion. The at least one first exposed portion includes a first surface and a first additional surface disposed on a reverse side of the first surface in the arrangement direction. The first surface includes a first cut surface having an area smaller than an area of the first surface. The first additional surface includes a first additional cut surface having an area smaller than an area of the first additional surface.

Flexible electrical connectors are provided to electrically connect electronic devices. The flexible electrical connector includes a removable adhesive tape strip having an adhesive surface thereof and an electrically conductive trace disposed on the adhesive tape strip. The flexible electrical connector engages an electronic device to form an electrical contact where the adhesive tape strip has an adhesive surface removably adhesively bonded to the substrate of the electronic device to at least partially cover the electrical contact.