A snubber apparatus includes N parallel charge paths, each of which has a positive-side capacitor, a first diode, and a negative-side capacitor sequentially connected in series between a positive-side terminal and a negative-side terminal, and that allows current to flow from the positive-side terminal's side to the negative-side terminal's side. The snubber apparatus includes N+1 parallel discharge paths, each of which has a second diode connected between the negative-side terminal or the negative-side capacitor in the k-th charge path of the N charge paths, and the positive-side capacitor in the (k+1)-th charge path of the N charge paths or the positive-side terminal, and that allows current to flow from the negative-side terminal's side to the positive-side terminal's side via at least one of the negative-side capacitor and the positive-side capacitor. At least one of the charge paths has a plurality of sections that are turned and adjacent to each other.

A power component includes two electric terminals, a component housing, a main component at least partially surrounded by the component housing, connected with the two terminals, and configured to carry a power current flowing between the two electric terminals, and a sensor and emitter unit which is configured to measure a value of a physical quantity (T, V, ΔV) characterizing an operating state of the main component, and to emit an electromagnetic signal, in which the measured value of the physical quantity is encoded. The sensor and emitter unit includes an antenna for emitting the electromagnetic signal which is spaced apart from the main component and arranged in, on and/or at the component housing.

A modular electronic power converter is disclosed and includes a first housing, a second housing, and a coupling element. The coupling element is arranged between the housings and is connected to at least one of the housings via a detent connection.

Provided is a power conversion device that achieves both downsizing and improvement in cooling efficiency to have improved reliability. The power conversion device includes a power conversion circuit unit which converts DC power into AC power, a flow path including body for letting a refrigerant for cooling the power conversion circuit unit flow, a filter circuit unit which suppresses electric noise from a wire for transmitting the DC power, and a filter case portion which houses the filter circuit unit, where the filter case portion is formed integrally with the flow path including body, and a gap between the filter case portion and the filter circuit unit is filled with a first resin.

An object of the present invention is to provide a technique capable of suppressing displacement of an electronic component and a solder ball without using a jig. A semiconductor device includes an insulating substrate, an electronic component, and solder. A metal pattern and a semiconductor element are disposed on the insulating substrate. The metal pattern has a first recess and a second recess that are provided side by side. A part of the electronic component is disposed in the first recess. The solder connects the metal pattern disposed on the insulating substrate and the electronic component.

A DC link capacitor (8) comprises a capacitor housing, a plurality of capacitor cells (1), each comprising a film capacitor element (2) with a wound metallized film and two contact terminals (3a, 3b) connected to the metallized plastic film. The plurality of capacitor cells (1) are arranged in the capacitor housing (4) and are sealed therein by means of a sealing material (7). The contact terminals (3a, 3b) are electrically isolated from each other and protrude separately out of the sealing material (7), in order to be connected by means of bus bars.

Electrical circuit device comprising a power electronics circuit with at least one power electronics module, a filter device, a heat sink, a connector and at least one busbar, wherein the filter device is at least partially coupled to the busbar and the busbar electrically connects the connector to the power electronics circuit, wherein the power electronics module and at least a portion of the busbar are thermally connected to the heat sink.

An inverter power assembly includes: a mounting frame; a power module mounted on the mounting frame; and a capacitor electrically connected to the power module. The inverter power assembly has the power module mounted on the mounting frame and the capacitor electrically connected to the power module, which leads to a simple and compact structure and a reasonable arrangement for the entire inverter power assembly.

A power control apparatus includes a case, a cover attached on the case and a gasket which is attached on a wall of the case below the cover. The gasket includes an intermediate pipe and a seal member which seals between the intermediate pipe and the case. The cover includes a water guide portion extending along the wall of the case. The case includes at least two shielding ribs protruding from the case. The shielding ribs are located below the water guide portion. The shielding ribs include portions located above the seal member to overlap the seal member with respect to a vertical direction. The shielding ribs are located between the water guide portion and the seal member with respect to the vertical direction. Each of the shielding ribs includes an inclined portion in which a one-side portion is located lower than the other-side portion.

Provided are a power supply circuit, a power supply device and a control method. The power supply circuit includes a primary rectifier unit, a modulation unit, a transformer, a secondary rectifier and filtering unit, a current feedback unit, and a control unit. The power supply circuit removes a liquid electrolytic capacitor at a primary side. Moreover, the control unit may determine a type of a voltage of input alternating current, and set a current limit value in the current feedback unit according to the type of the voltage of the alternating current.